NXP USA Inc. MC9S08QE64CLH

Name: MC9S08QE64CLH
Brand: NXP USA Inc.
SKU: 3136312-MC9S08QE64CLH
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: MC9S08QE64CLH

Manufacturer:: NXP USA Inc.

Ventron No:: 3136312-MC9S08QE64CLH

Description:: IC MCU 8BIT 64KB FLASH 64LQFP

ECAD Model:

Datasheet:: MC9S08QE64CLH

Specifications

NXP USA Inc. MC9S08QE64CLH technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MC9S08QE64CLH.

Factory Lead Time
10 Weeks
Mounting Type
Surface Mount
Package / Case
64-LQFP
Surface Mount
YES
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2009
Series
S08
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.A.2
Terminal Finish
Matte Tin (Sn)
Subcategory
Microcontrollers
Technology
CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3V
Terminal Pitch
0.5mm
Reflow Temperature-Max (s)
40
Base Part Number
MC9S08QE64
JESD-30 Code
S-PQFP-G64
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
1.8/3.6V
Supply Voltage-Min (Vsup)
1.8V
Oscillator Type
Internal
Number of I/O
54
Speed
50MHz
RAM Size
4K x 8
Voltage - Supply (Vcc/Vdd)
1.8V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Peripherals
LVD, PWM, WDT
Clock Frequency
16MHz
Program Memory Type
FLASH
Core Size
8-Bit
Program Memory Size
64KB 64K x 8
Connectivity
I2C, LINbus, SCI, SPI
Bit Size
8
Data Converter
A/D 22x12b
Has ADC
YES
DMA Channels
NO
PWM Channels
YES
DAC Channels
NO
ROM (words)
65536
Height Seated (Max)
1.6mm
Length
10mm
Width
10mm
RoHS Status
ROHS3 Compliant

Description

MC9S08QE64CLH Description
Surface mount technology has become the preferred method for packaging electronic components, and YES is a commonly used term to indicate that a particular component is designed for surface mounting. In this case, the packaging for the component is in the form of a tray, which is a convenient and efficient way to store and transport multiple components. The Moisture Sensitivity Level (MSL) for this component is 3, which means it can withstand exposure to a relative humidity of 30-60% for up to 168 hours without any adverse effects. The reflow temperature-max (s) for this component is 40, indicating the maximum temperature it can withstand during the soldering process. Although the qualification status for this component is currently not qualified, its speed of 50MHz and its classification as a MICROCONTROLLER make it a promising option for various applications. Its connectivity options, including I2C, LINbus, SCI, and SPI, make it versatile and suitable for a range of devices. With a bit size of 8 and no DMA channels, this component is ideal for low to medium complexity systems.

MC9S08QE64CLH Features
70 GPIOs and 1 input-only and 1 output-only pin
16 KBI interrupts with selectable polarity
Hysteresis and configurable pull-up device on all input pins; Configurable slew rate and drive strength on all output pins.
SET/CLR registers on 16 pins (PTC and PTE)

MC9S08QE64CLH Applications
Power Management
Consumer Electronics
Portable Devices
Industrial

MC9S08QE64CLH More Descriptions

S08 S08 Microcontroller IC 8-Bit 50MHz 64KB (64K x 8) FLASH 64-LQFP (10x10)
MCU 8-bit S08 S08 CISC 64KB Flash 2.5V/3.3V Automotive 64-Pin LQFP Tray
S08QE 8-bit MCU, S08 core, 64KB Flash, 50MHz, QFP 64
Product Range:s08 Microcontrollers; Cpu Speed:50Mhz; Program Memory Size:64Kb; Ram Memory Size:4Kb; No. Of Pins:64Pins; Mcu Case Style:lqfp; No. Of I/o S:54I/o S; Embedded Interface Type:i2C, Sci, Spi; Supply Voltage Min:1.8V Rohs Compliant: Yes
IC, SM, MCU, 8-BIT, S08, 64KB FLASH; Controller Family/Series:HCS08; Core Size:8bit; No. of I/O's:54; Program Memory Size:64 KB; RAM Memory Size:4KB; CPU Speed:50MHz; Oscillator Type:External, Internal; No. of Timers:3; Peripherals:ADC, RTC, TPM; Embedded Interface Type:I2C, SCI, SPI; No. of PWM Channels:12; Digital IC Case Style:LQFP; Supply Voltage Range:1.8V to 3.6V; Operating Temperature Range:-40°C to 85°C; No. of Pins:64; MSL:MSL 3 - 168 hours; SVHC:No SVHC (18-Jun-2012); Base Number:HCS08; Clock Frequency:50.33MHz; Flash Memory Size:64KB; Interface:I2C, SCI, SPI; Interface:SPI, SCI, I2C; Interface Type:I2C, SCI, SPI; Memory Size:64Kb; Memory Type:Flash; Microprocessor/Controller Features:COP, DBG, RTC, Analog Comparator; No. of ADC Inputs:24; No. of Bits:8; No. of External Interrupts:16; No. of I/O's:54; Number of bits In Timer:16; Number of bits in ADC:12; Operating Temperature Max:85°C; Operating Temperature Min:-40°C; Package / Case:LQFP; Program Memory Size:64KB; Serial Comms:I2C, SCI, SPI
Device Core = HCS08 / Data Bus Width Bit = 8 / Instruction Set Architecture = CISC / Family Name = S08QE / Clock Frequency Max. MHz = 50 / Program Memory Type = Flash / Program Memory Size KB = 64 / RAM Memory Size KB = 4 / Interfaces = I²C / Interfaces = SCI / Interfaces = SPI / ADC Channels = 22 / ADC Resolution Bit = 12 / Number of Programmable I/Os = 54 / Number of Timers/Counters = 4 / Comparators = 4 / Supply Voltage Min. V = 1.8 / Supply Voltage Max. V = 3.6 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 85 / Package Type = LQFP / Pins = 64 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 10 / Width mm = 10 / Height mm = 1.4 / Reflow Temperature Max. °C = 260

Certification