MC56F8365VFGE

NXP USA Inc. MC56F8365VFGE

Part Number:
MC56F8365VFGE
Manufacturer:
NXP USA Inc.
Ventron No:
3642410-MC56F8365VFGE
Description:
IC MCU 16BIT 512KB FLASH 128LQFP
ECAD Model:
Datasheet:
MC56F8365VFGE

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Specifications
NXP USA Inc. MC56F8365VFGE technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MC56F8365VFGE.
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    128-LQFP
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C TA
  • Packaging
    Tray
  • Published
    1998
  • Series
    56F8xxx
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    128
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Matte Tin (Sn)
  • Additional Feature
    ALSO REQUIRES 3.3V SUPPLY
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microcontrollers
  • Technology
    CMOS
  • Terminal Position
    QUAD
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    2.5V
  • Terminal Pitch
    0.5mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MC56F8365
  • JESD-30 Code
    R-PQFP-G128
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    2.75V
  • Power Supplies
    2.53.3V
  • Supply Voltage-Min (Vsup)
    2.25V
  • Oscillator Type
    External
  • Number of I/O
    49
  • Speed
    60MHz
  • RAM Size
    18K x 16
  • Voltage - Supply (Vcc/Vdd)
    2.25V~3.6V
  • uPs/uCs/Peripheral ICs Type
    DIGITAL SIGNAL PROCESSOR, OTHER
  • Core Processor
    56800E
  • Peripherals
    POR, PWM, Temp Sensor, WDT
  • Clock Frequency
    120MHz
  • Program Memory Type
    FLASH
  • Core Size
    16-Bit
  • Program Memory Size
    512KB 256K x 16
  • Connectivity
    CANbus, EBI/EMI, SCI, SPI
  • Bit Size
    16
  • Data Converter
    A/D 16x12b
  • Address Bus Width
    11
  • ROM (words)
    524288
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    4
  • Format
    FIXED POINT
  • Barrel Shifter
    YES
  • Internal Bus Architecture
    MULTIPLE
  • Height Seated (Max)
    1.6mm
  • Length
    20mm
  • Width
    14mm
  • RoHS Status
    ROHS3 Compliant
Description
MC56F8365VFGE            Description
The product features a Terminal Finish of Matte Tin (Sn) and a Terminal Form of GULL WING. It is currently Not Qualified in terms of Qualification Status and has a RAM Size of 18K x 16. The Core Processor is 56800E and it includes Peripherals such as POR, PWM, Temp Sensor, and WDT. The Clock Frequency is 120MHz and it has Boundary Scan capabilities. The Height Seated (Max) is 1.6mm and the Width measures 14mm.

MC56F8365VFGE                 Applications
motion control smart appliances limit switches power supply automotive control (56F8365 only)  engine management  noise suppression remote utility industrial control for power  Lighting automation applications   MC56F8365VFGE                  Features
? Harvard architecture permits as many as three simultaneous accesses to program and data memory ? Flash security protection feature ? On-chip memory, including a low-cost, high-volume Flash solution — 512KB of Program Flash — 4KB of Program RAM — 32KB of Data Flash — 32KB of Data RAM — 32KB of Boot Flash ? EEPROM emulation capability  



MC56F8365VFGE More Descriptions
MCU 16-bit MC56F83xx 56800E CISC 512KB Flash 3.3V 128-Pin LQFP Tray
Product Range:mc56F83Xx Series; Core Frequency:60Mhz; Flash Memory Size:512Kb; No. Of I/o S:49I/o S; Embedded Interface Type:can, Sci, Spi; Core Supply Voltage:2.5V; Dsc Case Style:lqfp; No. Of Pins:128Pins; Supply Voltage Min:3V Rohs Compliant: Yes
16BIT HYBRID CONTROLLER, 56F8365; Controller Family/Series:56F8x65; Core Size:16bit; No. of I/O's:49; Program Memory Size:576KB; EEPROM Memory Size:32KB; RAM Memory Size:32KB; CPU Speed:60MHz; No. of Timers:4; No. of PWM Channels:12; Digital IC Case Style:LQFP; Supply Voltage Range:3V to 3.6V; Operating Temperature Range:-40°C to 105°C; No. of Pins:128; SVHC:No SVHC (15-Dec-2010); Operating Temperature Max:105°C; Operating Temperature Min:-40°C; Clock Frequency:40MHz; Flash Memory Size:512KB; IC Generic Number:56F8365; Interface:CAN, JTAG, SCI, SPI; Interface Type:CAN, SCI, SPI; Logic Function Number:8365; Memory Size:512KB; Memory Type:FLASH; Microprocessor/Controller Features:6-channel PWM module, Four 4-channel 12-bit ADCs, Two SCIs, Up to two SPIs, Up to two FlexCAN modules, Temperature Sensor; No. of ADC Inputs:16; No. of Bits:16; No. of I/O's:49; Package / Case:LQFP; Qualified Segment:COMMERCIAL, INDUSTRIAL; Supply Voltage Max:3.6V; Supply Voltage Min:3V; Termination Type:SMD
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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