ISSI, Integrated Silicon Solution Inc IS64WV51216BLL-10MLA3

IS64WV51216BLL-10MLA3 Overview
The package or case for this particular electronic component is a 48-TFBGA, which stands for Thin Fine Pitch Ball Grid Array. This package is commonly used for integrated circuits and is known for its compact size and high density. The supply voltage required for this component is 3.3V, which is a standard voltage for many electronic devices. When it comes to reflow temperature, this component has a maximum time of 40 seconds at peak temperature. With a pin count of 48, this component has a relatively high number of pins, allowing for more connections and functionality. The memory size for this component is 8Mb, specifically 512K x 16, which refers to the number of bits and the organization of the memory cells. The memory format for this component is SRAM, which stands for Static Random Access Memory, and the memory interface is parallel, meaning data is transmitted simultaneously through multiple lines. It can operate in both synchronous and asynchronous modes, with a word size of 16 bits. However, this component is not radiation hardened, meaning it is not designed to withstand high levels of radiation.

IS64WV51216BLL-10MLA3 Features
Package / Case: 48-TFBGA
48 Pins
I/O Type: COMMON


IS64WV51216BLL-10MLA3 Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS64WV51216BLL-10MLA3 Memory applications.


servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM