ISSI, Integrated Silicon Solution Inc IS61LPS25636A-200B3I
- Part Number:
- IS61LPS25636A-200B3I
- Manufacturer:
- ISSI, Integrated Silicon Solution Inc
- Ventron No:
- 3236101-IS61LPS25636A-200B3I
- Description:
- IC SRAM 9MBIT 200MHZ 165BGA
- Datasheet:
- IS61LPS(VPS)51218A/25636A, IS64LPS25636A
ISSI, Integrated Silicon Solution Inc IS61LPS25636A-200B3I technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS61LPS25636A-200B3I.
- Mounting TypeSurface Mount
- Package / Case165-TBGA
- Surface MountYES
- Number of Pins165
- Operating Temperature-40°C~85°C TA
- PackagingTray
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusLast Time Buy
- Moisture Sensitivity Level (MSL)2 (1 Year)
- Number of Terminations165
- ECCN Code3A991.B.2.A
- Terminal FinishTin/Lead (Sn/Pb)
- Additional FeaturePIPELINED ARCHITECTURE
- TechnologySRAM - Synchronous, SDR
- Voltage - Supply3.135V~3.465V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch1mm
- Pin Count165
- Operating Supply Voltage3.3V
- Supply Voltage-Min (Vsup)3.135V
- Memory Size9Mb 256K x 36
- Number of Ports4
- Memory TypeVolatile
- Clock Frequency200MHz
- Supply Current-Max0.275mA
- Access Time3.1ns
- Memory FormatSRAM
- Memory InterfaceParallel
- Organization256KX36
- Output Characteristics3-STATE
- Memory Width36
- Address Bus Width18b
- Density9 Mb
- Standby Current-Max0.105A
- I/O TypeCOMMON
- Height Seated (Max)1.2mm
- Length15mm
- Radiation HardeningNo
- RoHS StatusNon-RoHS Compliant
IS61LPS25636A-200B3I Overview
The JESD-609 Code e0 is an industry standard that specifies the requirements for a particular electronic component. In this case, the Part Status is Last Time Buy, meaning that this component is no longer in production and is only available for a limited time. With a Number of Terminations of 165, this component is designed to handle a large amount of data. The Supply Voltage of 3.3V ensures that the component receives enough power to function properly. The Terminal Pitch of 1mm and Pin Count of 165 indicate that this component is compact and can be used in space-constrained applications. With a Clock Frequency of 200MHz, this component can process data at a high speed. The Organization of 256KX36 means that this component has a large memory capacity. Its I/O Type is COMMON, which allows for easy communication with other components. Lastly, the Height Seated (Max) of 1.2mm ensures that this component can fit into tight spaces without causing any interference. Overall, the JESD-609 Code e0 component is a versatile and efficient choice for electronic designs.
IS61LPS25636A-200B3I Features
Package / Case: 165-TBGA
165 Pins
Operating Supply Voltage:3.3V
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: COMMON
IS61LPS25636A-200B3I Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS61LPS25636A-200B3I Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
The JESD-609 Code e0 is an industry standard that specifies the requirements for a particular electronic component. In this case, the Part Status is Last Time Buy, meaning that this component is no longer in production and is only available for a limited time. With a Number of Terminations of 165, this component is designed to handle a large amount of data. The Supply Voltage of 3.3V ensures that the component receives enough power to function properly. The Terminal Pitch of 1mm and Pin Count of 165 indicate that this component is compact and can be used in space-constrained applications. With a Clock Frequency of 200MHz, this component can process data at a high speed. The Organization of 256KX36 means that this component has a large memory capacity. Its I/O Type is COMMON, which allows for easy communication with other components. Lastly, the Height Seated (Max) of 1.2mm ensures that this component can fit into tight spaces without causing any interference. Overall, the JESD-609 Code e0 component is a versatile and efficient choice for electronic designs.
IS61LPS25636A-200B3I Features
Package / Case: 165-TBGA
165 Pins
Operating Supply Voltage:3.3V
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: COMMON
IS61LPS25636A-200B3I Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS61LPS25636A-200B3I Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
IS61LPS25636A-200B3I More Descriptions
SRAM Chip Sync Quad 3.3V 9M-Bit 256K x 36 3.1ns 165-Pin BGA
IC SRAM 9MBIT PARALLEL 165TFBGA
SRAM 8M (256Kx36) 200MHz Sync SRAM 3.3v
IC SRAM 9MBIT PARALLEL 165TFBGA
SRAM 8M (256Kx36) 200MHz Sync SRAM 3.3v
The three parts on the right have similar specifications to IS61LPS25636A-200B3I.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchPin CountOperating Supply VoltageSupply Voltage-Min (Vsup)Memory SizeNumber of PortsMemory TypeClock FrequencySupply Current-MaxAccess TimeMemory FormatMemory InterfaceOrganizationOutput CharacteristicsMemory WidthAddress Bus WidthDensityStandby Current-MaxI/O TypeHeight Seated (Max)LengthRadiation HardeningRoHS StatusFactory Lead TimeHTS CodePeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)Supply Voltage-Max (Vsup)Memory DensityAccess Time (Max)WidthSupplier Device PackageMax Operating TemperatureMin Operating TemperatureInterfaceMax Supply VoltageMin Supply VoltageNominal Supply CurrentWrite Cycle Time - Word, PageSync/AsyncWord SizeReach Compliance CodeJESD-30 CodeView Compare
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IS61LPS25636A-200B3ISurface Mount165-TBGAYES165-40°C~85°C TATraye0noLast Time Buy2 (1 Year)1653A991.B.2.ATin/Lead (Sn/Pb)PIPELINED ARCHITECTURESRAM - Synchronous, SDR3.135V~3.465VBOTTOM13.3V1mm1653.3V3.135V9Mb 256K x 364Volatile200MHz0.275mA3.1nsSRAMParallel256KX363-STATE3618b9 Mb0.105ACOMMON1.2mm15mmNoNon-RoHS Compliant---------------------
-
Surface Mount165-LBGAYES1650°C~70°C TATray--Active3 (168 Hours)1653A991.B.2.A-PIPELINED ARCHITECTURESRAM - Synchronous, DDR II1.71V~1.89VBOTTOM11.8V1mm165-1.71V72Mb 4M x 18-Volatile300MHz--SRAMParallel4MX18-18----1.4mm17mm-ROHS3 Compliant12 Weeks8542.32.00.41NOT SPECIFIEDNOT SPECIFIED1.89V75497472 bit0.45 ns15mm------------
-
Surface Mount44-BSOJ (0.400, 10.16mm Width)-44-40°C~85°C TATape & Reel (TR)--Active2 (1 Year)----SRAM - Asynchronous4.5V~5.5V-----5V-4Mb 256K x 161Volatile--10nsSRAMParallel---18b4 Mb----NoROHS3 Compliant8 Weeks-------44-SOJ85°C-40°CParallel5.5V4.5V50mA10nsAsynchronous16b--
-
Surface Mount165-LBGAYES--40°C~85°C TATray--Last Time Buy3 (168 Hours)1653A991.B.2.A-PIPELINED ARCHITECTURESRAM - Synchronous, DDR II1.71V~1.89VBOTTOM11.8V1mm165-1.71V72Mb 4M x 18-Volatile300MHz-1.48nsSRAMParallel4MX18-18----1.4mm17mm---8542.32.00.41--1.89V75497472 bit-15mm----------compliantR-PBGA-B165
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