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ISSI, Integrated Silicon Solution Inc IS61C25616AL-10KLI-TR

Part Number:

IS61C25616AL-10KLI-TR

Manufacturer:

ISSI, Integrated Silicon Solution Inc

Ventron No:

7373472-IS61C25616AL-10KLI-TR

Description:

Memory IC 4 Mb kb 50mA mA 16b b

Datasheet:

IS61C25616AL-10KLI-TR

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Specifications

ISSI, Integrated Silicon Solution Inc IS61C25616AL-10KLI-TR technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS61C25616AL-10KLI-TR.

  • Factory Lead Time
    8 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    44-BSOJ (0.400, 10.16mm Width)
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    44
  • Supplier Device Package
    44-SOJ
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tape & Reel (TR)
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    2 (1 Year)
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    -40°C
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    SRAM - Asynchronous
  • Voltage - Supply
    4.5V~5.5V
  • Operating Supply Voltage
    5V
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    Parallel
  • Max Supply Voltage
    5.5V
  • Min Supply Voltage
    4.5V
  • Memory Size
    4Mb 256K x 16
  • Number of Ports

    Number of Ports refers to the number of electrical connections or terminals available on an electronic component. It indicates the number of external devices or signals that can be connected to the component. For example, a transistor may have three ports (emitter, base, and collector), while a resistor has two ports (terminals). The number of ports determines the functionality and connectivity options of the component within a circuit.

    1
  • Nominal Supply Current
    50mA
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    Volatile
  • Access Time

    Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

    10ns
  • Memory Format

    Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

    SRAM
  • Memory Interface
    Parallel
  • Write Cycle Time - Word, Page
    10ns
  • Address Bus Width
    18b
  • Density
    4 Mb
  • Sync/Async
    Asynchronous
  • Word Size
    16b
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant

Description

IS61C25616AL-10KLI-TR Overview
In terms of its memory type, it can be classified as Volatile. The case comes in Tape & Reel (TR) size. The case is embedded in 44-BSOJ (0.400, 10.16mm Width). Memory size on the chip is 4Mb 256K x 16. This device uses takes advantage of the SRAM format. The device's extended operating temperature range of -40°C~85°C TA makes it ideal for many demanding applications. The device is capable of handling a supply voltage of 4.5V~5.5V. The recommended mounting type for this device is Surface Mount. An 44-pin package is used to package this memory device. There is a note stating that this memory chip operates at 5V. As far as its nominal supply current is concerned, this memory component carries a rating of 50mA. In this chip, there are 1 ports providing read and/or write access to one memory address. A minimum operating temperature of -40°C is required for this device. It should not be operated above 85°C°C. This part should have a minimum supply voltage of at least 4.5V volts in order to function correctly. This part requires a minimum voltage of 5.5V.

IS61C25616AL-10KLI-TR Features
Package / Case: 44-BSOJ (0.400, 10.16mm Width)
44 Pins
Operating Supply Voltage:5V


IS61C25616AL-10KLI-TR Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS61C25616AL-10KLI-TR Memory applications.


eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
IS61C25616AL-10KLI-TR More Descriptions
SRAM Chip Async Single 5V 4M-Bit 256K x 16 10ns 44-Pin SOJ T/R
SRAM 4M (256Kx16) 10ns Async SRAM
4Mb,high-Speed,async,256K X 16,10Ns,5V,44 Pin Soj (400 Mil), Rohs |Integrated Silicon Solution (Issi) IS61C25616AL-10KLI-TR
4.5V~5.5V 4Mbit SOJ-44 SRAM ROHS

Product Comparison

The three parts on the right have similar specifications to IS61C25616AL-10KLI-TR.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Number of Pins
    Supplier Device Package
    Operating Temperature
    Packaging
    Part Status
    Moisture Sensitivity Level (MSL)
    Max Operating Temperature
    Min Operating Temperature
    Technology
    Voltage - Supply
    Operating Supply Voltage
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Memory Size
    Number of Ports
    Nominal Supply Current
    Memory Type
    Access Time
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Sync/Async
    Word Size
    Radiation Hardening
    RoHS Status
    Surface Mount
    Number of Terminations
    ECCN Code
    Additional Feature
    HTS Code
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Clock Frequency
    Organization
    Memory Width
    Memory Density
    Access Time (Max)
    Length
    Height Seated (Max)
    Width
    Reach Compliance Code
    JESD-30 Code
    View Compare
  • IS61C25616AL-10KLI-TR
    IS61C25616AL-10KLI-TR
    8 Weeks
    Surface Mount
    44-BSOJ (0.400, 10.16mm Width)
    44
    44-SOJ
    -40°C~85°C TA
    Tape & Reel (TR)
    Active
    2 (1 Year)
    85°C
    -40°C
    SRAM - Asynchronous
    4.5V~5.5V
    5V
    Parallel
    5.5V
    4.5V
    4Mb 256K x 16
    1
    50mA
    Volatile
    10ns
    SRAM
    Parallel
    10ns
    18b
    4 Mb
    Asynchronous
    16b
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IS61DDB24M18A-250M3L
    12 Weeks
    Surface Mount
    165-LBGA
    165
    -
    0°C~70°C TA
    Tray
    Active
    3 (168 Hours)
    -
    -
    SRAM - Synchronous, DDR II
    1.71V~1.89V
    -
    -
    -
    -
    72Mb 4M x 18
    -
    -
    Volatile
    -
    SRAM
    Parallel
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    YES
    165
    3A991.B.2.A
    PIPELINED ARCHITECTURE
    8542.32.00.41
    BOTTOM
    NOT SPECIFIED
    1
    1.8V
    1mm
    NOT SPECIFIED
    165
    1.89V
    1.71V
    250MHz
    4MX18
    18
    75497472 bit
    0.45 ns
    17mm
    1.4mm
    15mm
    -
    -
  • IS61DDB24M18A-300M3L
    12 Weeks
    Surface Mount
    165-LBGA
    165
    -
    0°C~70°C TA
    Tray
    Active
    3 (168 Hours)
    -
    -
    SRAM - Synchronous, DDR II
    1.71V~1.89V
    -
    -
    -
    -
    72Mb 4M x 18
    -
    -
    Volatile
    -
    SRAM
    Parallel
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    YES
    165
    3A991.B.2.A
    PIPELINED ARCHITECTURE
    8542.32.00.41
    BOTTOM
    NOT SPECIFIED
    1
    1.8V
    1mm
    NOT SPECIFIED
    165
    1.89V
    1.71V
    300MHz
    4MX18
    18
    75497472 bit
    0.45 ns
    17mm
    1.4mm
    15mm
    -
    -
  • IS61DDB44M18A-300M3I
    -
    Surface Mount
    165-LBGA
    -
    -
    -40°C~85°C TA
    Tray
    Last Time Buy
    3 (168 Hours)
    -
    -
    SRAM - Synchronous, DDR II
    1.71V~1.89V
    -
    -
    -
    -
    72Mb 4M x 18
    -
    -
    Volatile
    1.48ns
    SRAM
    Parallel
    -
    -
    -
    -
    -
    -
    -
    YES
    165
    3A991.B.2.A
    PIPELINED ARCHITECTURE
    8542.32.00.41
    BOTTOM
    -
    1
    1.8V
    1mm
    -
    165
    1.89V
    1.71V
    300MHz
    4MX18
    18
    75497472 bit
    -
    17mm
    1.4mm
    15mm
    compliant
    R-PBGA-B165

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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