IRF9910TRPBF

Infineon Technologies IRF9910TRPBF

Part Number:
IRF9910TRPBF
Manufacturer:
Infineon Technologies
Ventron No:
2473858-IRF9910TRPBF
Description:
MOSFET 2N-CH 20V 10A/12A 8-SOIC
ECAD Model:
Datasheet:
IRF9910TRPBF

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Specifications
Infineon Technologies IRF9910TRPBF technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF9910TRPBF.
  • Factory Lead Time
    12 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.154, 3.90mm Width)
  • Number of Pins
    8
  • Transistor Element Material
    SILICON
  • Operating Temperature
    -55°C~150°C TJ
  • Packaging
    Tape & Reel (TR)
  • Series
    HEXFET®
  • Published
    2004
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Resistance
    13.4MOhm
  • Terminal Finish
    Matte Tin (Sn)
  • Subcategory
    FET General Purpose Power
  • Voltage - Rated DC
    20V
  • Max Power Dissipation
    2W
  • Terminal Form
    GULL WING
  • Current Rating
    10A
  • Base Part Number
    IRF9910PBF
  • Number of Elements
    2
  • Element Configuration
    Dual
  • Operating Mode
    ENHANCEMENT MODE
  • Power Dissipation
    2W
  • FET Type
    2 N-Channel (Dual)
  • Transistor Application
    SWITCHING
  • Rds On (Max) @ Id, Vgs
    9.3m Ω @ 12A, 10V
  • Vgs(th) (Max) @ Id
    2.55V @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds
    900pF @ 10V
  • Current - Continuous Drain (Id) @ 25°C
    10A 12A
  • Gate Charge (Qg) (Max) @ Vgs
    11nC @ 4.5V
  • Continuous Drain Current (ID)
    10A
  • Gate to Source Voltage (Vgs)
    20V
  • Drain to Source Breakdown Voltage
    20V
  • Avalanche Energy Rating (Eas)
    33 mJ
  • FET Technology
    METAL-OXIDE SEMICONDUCTOR
  • FET Feature
    Logic Level Gate
  • Nominal Vgs
    2.55 V
  • Height
    1.4986mm
  • Length
    4.9784mm
  • Width
    3.9878mm
  • REACH SVHC
    No SVHC
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
IRF9910TRPBF Description
Fifth Generation HEXFETs from International Rectifier have extraordinarily low on-resistance per silicon area thanks to cutting-edge manufacturing methods. This feature, along with the rapid switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for, provides the designe with an incredibly efficient and reliable device for usage in a number of applications. The SO-8's improved thermal properties and multiple-die capacity make it the perfect choice for a variety of power applications. This adjustment was possible because to the usage of a leadframe that was custom made. With this invention, multiple devices can be used while substantially less board area is needed. The package is designed for use with wave soldering or vapor phase infrared technologies.

IRF9910TRPBF Features
4.5V VGS with Very Low RDS(on)
Gate Fee is Minimal
Voltage and Current of Fully Characterized Avalanches
Gate Rating Maximum 20V VGS

IRF9910TRPBF Applications
Dual SO-8 MOSFET for POL converters in desktop, servers, graphics cards, gaming consoles, and set-top box
free of lead
IRF9910TRPBF More Descriptions
Transistor MOSFET Array Dual N-CH 20V 10A/12A 8-Pin SOIC T/R - Tape and Reel
Dual N-Channel 20 V 18.3/11.3 mOhm 11/23 nC HEXFET® Power Mosfet - SOIC-8
Power Field-Effect Transistor, 10A I(D), 20V, 0.0134ohm, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MS-012AA
Benefits: RoHS Compliant; Low RDS(ON) at 4.5V VGS; Very Low Gate Charge; Fully Characterized Avalanche Voltage and Current; Dual N-Channel MOSFET
N CHANNEL MOSFET, 20V, 10A; Transistor P; N CHANNEL MOSFET, 20V, 10A; Transistor Polarity:N Channel; Continuous Drain Current Id:10A; Drain Source Voltage Vds:20V; On Resistance Rds(on):18.3mohm; Rds(on) Test Voltage Vgs:20V; Threshold Voltage Vgs Typ:2.55V; No. of Pins:8
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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