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IDT, Integrated Device Technology Inc IDT74FCT3807SOI8

Name: IDT74FCT3807SOI8
Brand: IDT, Integrated Device Technology Inc
SKU: 2975799-IDT74FCT3807SOI8
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: IDT74FCT3807SOI8

Manufacturer:: IDT, Integrated Device Technology Inc

Ventron No:: 2975799-IDT74FCT3807SOI8

Description:: IC CLK BUFFER 1:10 100MHZ 20SOIC

ECAD Model:

Datasheet:: IDT74FCT3807(A)

Payment:

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Part Overview

Description
The IDT74FCT3807/A is a 3.3V clock driver built using advanced dual metal CMOS technology. It offers a 1:10 fanout, reducing loading on the preceding driver and providing an efficient clock distribution network. The device features low capacitance inputs with hysteresis for improved noise margins, and multiple power and grounds to reduce noise.

Features
0.5micron CMOS technology
Guaranteed low skew (<350ps max.)
Very low duty cycle distortion (<350ps max.)
High speed: propagation delay <3ns (max.)
Very low CMOS power levels
TTL compatible inputs and outputs
1:10 fanout
Maximum output rise and fall time <1.5ns (max.)
Low input capacitance: 4.5pF typical
Vcc = 3.3V ± 0.3V
Inputs can be driven from 3.3V or 5V components
Available in SSOP, SOIC, and QSOP packages

Applications
Clock and signal distribution

Specifications

IDT, Integrated Device Technology Inc IDT74FCT3807SOI8 technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc IDT74FCT3807SOI8.

Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
20-SOIC (0.295, 7.50mm Width)
Supplier Device Package
20-SOIC
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~85°C
Packaging
Tape & Reel (TR)
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
74FCT
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Voltage - Supply
3V~3.6V
Base Part Number
IDT74FCT3807
Output
CMOS, TTL
Number of Circuits
Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.
1
Frequency (Max)
100MHz
Input
LVTTL
Ratio - Input:Output
1:10
Differential - Input:Output
No/No
RoHS Status
Non-RoHS Compliant

Product Comparison

The three parts on the right have similar specifications to IDT74FCT3807SOI8.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Supplier Device Package

Operating Temperature

Packaging

Series

Part Status

Moisture Sensitivity Level (MSL)

Voltage - Supply

Base Part Number

Output

Number of Circuits

Frequency (Max)

Input

Ratio - Input:Output

Differential - Input:Output

RoHS Status

Mount

Published

JESD-609 Code

Number of Terminations

Max Operating Temperature

Min Operating Temperature

Additional Feature

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Reach Compliance Code

Reflow Temperature-Max (s)

Pin Count

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Load Capacitance

Family

Logic IC Type

Max I(ol)

Propagation Delay (tpd)

Same Edge Skew-Max (tskwd)

Number of True Outputs

Length

Width

View Compare
IDT74FCT3807SOI8

IDT, Integrated Device Technology Inc

Surface Mount

20-SOIC (0.295, 7.50mm Width)

20-SOIC

-40°C~85°C

Tape & Reel (TR)

74FCT

Obsolete

1 (Unlimited)

3V~3.6V

IDT74FCT3807

CMOS, TTL

1

100MHz

LVTTL

1:10

No/No

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
IDT74FCT807CTPY8

IDT, Integrated Device Technology Inc

-

SSOP

-

-

Tape & Reel (TR)

-

-

1

-

-

-

1

100MHz

TTL

-

-

Non-RoHS Compliant

Surface Mount

2009

e0

20

70°C

0°C

MAX PART TO PART SKEW = 0.75NS

Clock Drivers

CMOS

DUAL

GULL WING

225

1

5V

0.65mm

not_compliant

30

20

R-PDSO-G20

Not Qualified

5.25V

5V

COMMERCIAL

4.75V

50pF

FCT

LOW SKEW CLOCK DRIVER

0.048 A

3.5 ns

0.35 ns

10

7.2mm

5.3mm

IDT74FCT3807SOI8 vs IDT74FCT807CTPY8
IDT74FCT3807PYI8

IDT, Integrated Device Technology Inc

Surface Mount

20-SSOP (0.209, 5.30mm Width)

20-SSOP

-40°C~85°C

Tape & Reel (TR)

74FCT

Obsolete

1 (Unlimited)

3V~3.6V

IDT74FCT3807

CMOS, TTL

1

100MHz

LVTTL

1:10

No/No

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

IDT74FCT3807SOI8 vs IDT74FCT3807PYI8
IDT74FCT807CTQI

IDT, Integrated Device Technology Inc

Surface Mount

20-SSOP (0.154, 3.90mm Width)

-

-40°C~85°C

Tube

74FCT

Obsolete

1 (Unlimited)

4.75V~5.25V

IDT74FCT807

-

1

100MHz

TTL

1:10

No/No

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

IDT74FCT3807SOI8 vs IDT74FCT807CTQI