IDT74FCT3807ASOI8

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IDT, Integrated Device Technology Inc IDT74FCT3807ASOI8

Part Number:

IDT74FCT3807ASOI8

Manufacturer:

IDT, Integrated Device Technology Inc

Ventron No:

2976473-IDT74FCT3807ASOI8

Description:

IC CLK BUFFER 1:10 100MHZ 20SOIC

ECAD Model:

Datasheet:

IDT74FCT3807(A)

Payment:

Payment

Delivery:

Delivery

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    Same Day Delivery

Part Overview

Description
The IDT74FCT3807/A is a 3.3V clock driver built using advanced dual metal CMOS technology. It offers a 1:10 fanout, reducing loading on the preceding driver and providing an efficient clock distribution network. The device features low capacitance inputs with hysteresis for improved noise margins, and multiple power and grounds to reduce noise.

Features
0.5micron CMOS technology
Guaranteed low skew (<350ps max.)
Very low duty cycle distortion (<350ps max.)
High speed: propagation delay <3ns (max.)
Very low CMOS power levels
TTL compatible inputs and outputs
1:10 fanout
Maximum output rise and fall time <1.5ns (max.)
Low input capacitance: 4.5pF typical
Vcc = 3.3V ± 0.3V
Inputs can be driven from 3.3V or 5V components
Available in SSOP, SOIC, and QSOP packages

Applications
Clock and signal distribution

Specifications

IDT, Integrated Device Technology Inc IDT74FCT3807ASOI8 technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc IDT74FCT3807ASOI8.

  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    20-SOIC (0.295, 7.50mm Width)
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Tape & Reel (TR)
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    74FCT
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Voltage - Supply
    3V~3.6V
  • Base Part Number
    IDT74FCT3807
  • Output
    CMOS, TTL
  • Number of Circuits

    Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.

    1
  • Frequency (Max)
    100MHz
  • Input
    LVTTL
  • Ratio - Input:Output
    1:10
  • Differential - Input:Output
    No/No
  • RoHS Status
    Non-RoHS Compliant

Product Comparison

The three parts on the right have similar specifications to IDT74FCT3807ASOI8.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Voltage - Supply
    Base Part Number
    Output
    Number of Circuits
    Frequency (Max)
    Input
    Ratio - Input:Output
    Differential - Input:Output
    RoHS Status
    Supplier Device Package
    Mount
    Published
    JESD-609 Code
    Number of Terminations
    Max Operating Temperature
    Min Operating Temperature
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Pin Count
    JESD-30 Code
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Family
    Logic IC Type
    Propagation Delay (tpd)
    Same Edge Skew-Max (tskwd)
    Number of True Outputs
    Length
    Width
    View Compare
  • IDT74FCT3807ASOI8
    IDT74FCT3807ASOI8
    Surface Mount
    20-SOIC (0.295, 7.50mm Width)
    -40°C~85°C
    Tape & Reel (TR)
    74FCT
    Obsolete
    1 (Unlimited)
    3V~3.6V
    IDT74FCT3807
    CMOS, TTL
    1
    100MHz
    LVTTL
    1:10
    No/No
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IDT74FCT3807SO8
    Surface Mount
    20-SOIC (0.295, 7.50mm Width)
    0°C~70°C
    Tape & Reel (TR)
    74FCT
    Obsolete
    1 (Unlimited)
    3V~3.6V
    IDT74FCT3807
    CMOS, TTL
    1
    100MHz
    LVTTL
    1:10
    No/No
    Non-RoHS Compliant
    20-SOIC
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IDT74FCT3807PYI8
    Surface Mount
    20-SSOP (0.209, 5.30mm Width)
    -40°C~85°C
    Tape & Reel (TR)
    74FCT
    Obsolete
    1 (Unlimited)
    3V~3.6V
    IDT74FCT3807
    CMOS, TTL
    1
    100MHz
    LVTTL
    1:10
    No/No
    Non-RoHS Compliant
    20-SSOP
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IDT74FCT3807DQI8
    -
    SSOP
    -
    Tape & Reel (TR)
    -
    -
    1
    -
    -
    -
    1
    166MHz
    LVTTL
    -
    -
    RoHS Compliant
    -
    Surface Mount
    2009
    e0
    20
    85°C
    -40°C
    Clock Drivers
    CMOS
    DUAL
    GULL WING
    225
    1
    3.3V
    0.635mm
    30
    20
    R-PDSO-G20
    Not Qualified
    3.6V
    3.3V
    INDUSTRIAL
    3V
    FCT
    LOW SKEW CLOCK DRIVER
    2.5 ns
    0.25 ns
    10
    8.6868mm
    3.937mm

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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