Microchip Technology DSPIC30F3013-20E/ML

DSPIC30F3013-20E/ML Overview
The 2006 publication of the Pbfree Code marked a significant shift in the industry towards more environmentally friendly manufacturing processes. Along with this code, the Reflow Temperature-Max (s) was set at 40 degrees, ensuring that the components were not subjected to excessive heat during the manufacturing process. The Supply Voltage-Min (Vsup) was also specified at 4.5V, ensuring that the components would not be damaged by higher voltage levels. The interface for this particular chip was specified as I2C, SPI, UART, and USART, providing flexibility in communication protocols. The RAM size was set at 2K x 8, and the chip also included important peripherals such as Brown-out Detect/Reset, POR, PWM, and WDT. The On Chip Program ROM Width was specified at 24, and the chip had a total of 30 programmable I/Os. However, it should be noted that this chip was not designed for radiation-hardened applications.

DSPIC30F3013-20E/ML Features
44-VQFN Exposed Pad package
Mounting type of Surface Mount
Digital Signal Processors subcategory

DSPIC30F3013-20E/ML Applications
There are a lot of Microchip Technology DSPIC30F3013-20E/ML Microcontroller applications.

Leakage current tester
Communication
Paper shredders
Virtual reality VR robots
Electrocardiogram (EKG)
Xbox
DVD\DV\MP3 players
Industrial instrumentation devices
Heart rate monitors
Electromechanical control