Alliance Memory, Inc. AS6C2008A-55BINTR
- Part Number:
- AS6C2008A-55BINTR
- Manufacturer:
- Alliance Memory, Inc.
- Ventron No:
- 3719697-AS6C2008A-55BINTR
- Description:
- IC SRAM 2MBIT 55NS 36TFBGA
- Datasheet:
- AS6C2008A-55BINTR
Alliance Memory, Inc. AS6C2008A-55BINTR technical specifications, attributes, parameters and parts with similar specifications to Alliance Memory, Inc. AS6C2008A-55BINTR.
- Factory Lead Time8 Weeks
- Mounting TypeSurface Mount
- Package / Case36-TFBGA
- Operating Temperature-40°C~85°C TA
- PackagingTape & Reel (TR)
- Published2007
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySRAM - Asynchronous
- Voltage - Supply2.7V~5.5V
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reach Compliance Codeunknown
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
- Memory Size2Mb 256K x 8
- Memory TypeVolatile
- Memory FormatSRAM
- Memory InterfaceParallel
- Write Cycle Time - Word, Page55ns
- RoHS StatusROHS3 Compliant
AS6C2008A-55BINTR Overview
The package or case for this particular product is 36-TFBGA, making it compact and suitable for various electronic devices. Its operating temperature range is -40°C to 85°C TA, ensuring its durability and functionality in extreme conditions. The packaging method used for this product is Tape & Reel (TR), which allows for easy handling and transportation. This product was published in 2007, indicating its reliability and longevity in the market. Its part status is active, meaning it is currently available for purchase. The technology used in this product is SRAM - Asynchronous, providing fast and efficient data storage and retrieval. The voltage supply for this product ranges from 2.7V to 5.5V, making it compatible with different power sources. The peak reflow temperature for this product is not specified. This product falls under the category of volatile memory, meaning it requires a constant power supply to retain data. Its memory interface is parallel, allowing for simultaneous data transfer between the memory and other components.
AS6C2008A-55BINTR Features
Package / Case: 36-TFBGA
AS6C2008A-55BINTR Applications
There are a lot of Alliance Memory, Inc.
AS6C2008A-55BINTR Memory applications.
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
The package or case for this particular product is 36-TFBGA, making it compact and suitable for various electronic devices. Its operating temperature range is -40°C to 85°C TA, ensuring its durability and functionality in extreme conditions. The packaging method used for this product is Tape & Reel (TR), which allows for easy handling and transportation. This product was published in 2007, indicating its reliability and longevity in the market. Its part status is active, meaning it is currently available for purchase. The technology used in this product is SRAM - Asynchronous, providing fast and efficient data storage and retrieval. The voltage supply for this product ranges from 2.7V to 5.5V, making it compatible with different power sources. The peak reflow temperature for this product is not specified. This product falls under the category of volatile memory, meaning it requires a constant power supply to retain data. Its memory interface is parallel, allowing for simultaneous data transfer between the memory and other components.
AS6C2008A-55BINTR Features
Package / Case: 36-TFBGA
AS6C2008A-55BINTR Applications
There are a lot of Alliance Memory, Inc.
AS6C2008A-55BINTR Memory applications.
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
AS6C2008A-55BINTR More Descriptions
Low Power CMOS SRAM 2MB 36 ball TFBGA (6mm x 8mm) 2.7-5V 256k x 8
SRAM Chip Async Single 3V 2M-Bit 256K x 8 55ns 36-Pin TF-BGA T/R
IC SRAM 2MBIT PARALLEL 36TFBGA
SRAM Chip Async Single 3V 2M-Bit 256K x 8 55ns 36-Pin TF-BGA T/R
IC SRAM 2MBIT PARALLEL 36TFBGA
The three parts on the right have similar specifications to AS6C2008A-55BINTR.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseOperating TemperaturePackagingPublishedPbfree CodePart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyPeak Reflow Temperature (Cel)Reach Compliance CodeTime@Peak Reflow Temperature-Max (s)Memory SizeMemory TypeMemory FormatMemory InterfaceWrite Cycle Time - Word, PageRoHS StatusSurface MountNumber of TerminationsTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Operating ModeOrganizationMemory WidthMemory DensityAccess Time (Max)LengthHeight Seated (Max)WidthHTS CodeAlternate Memory WidthJESD-609 CodeTerminal FinishPin CountView Compare
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AS6C2008A-55BINTR8 WeeksSurface Mount36-TFBGA-40°C~85°C TATape & Reel (TR)2007yesActive3 (168 Hours)SRAM - Asynchronous2.7V~5.5VNOT SPECIFIEDunknownNOT SPECIFIED2Mb 256K x 8VolatileSRAMParallel55nsROHS3 Compliant-----------------------
-
8 WeeksSurface Mount48-LFBGA-40°C~85°C TATray--Active3 (168 Hours)CMOS2.7V~3.6VNOT SPECIFIED-NOT SPECIFIED32Mb 2M x 16VolatileSRAMParallel55nsROHS3 CompliantYES48BOTTOM13V0.75mmR-PBGA-B483.6V2.7VASYNCHRONOUS2MX161633554432 bit55 ns10mm1.4mm8mm-----
-
8 WeeksSurface Mount48-TFSOP (0.724, 18.40mm Width)-40°C~85°C TATape & Reel (TR)-yesActive3 (168 Hours)SRAM - Asynchronous2.7V~3.6VNOT SPECIFIED-NOT SPECIFIED32Mb 2M x 16VolatileSRAMParallel55nsROHS3 CompliantYES48DUAL13V0.5mmR-PDSO-G483.6V2.7V-2MX161633554432 bit55 ns18.4mm1.2mm12mm8542.32.00.418---
-
8 WeeksSurface Mount48-TFSOP (0.724, 18.40mm Width)-40°C~85°C TATray-yesActive3 (168 Hours)CMOS2.7V~3.6V260-4016Mb 1M x 16VolatileSRAMParallel55nsROHS3 CompliantYES48DUAL13V0.5mmR-PDSO-G483.6V2.7VASYNCHRONOUS1MX161616777216 bit55 ns18.4mm1.2mm12mm--e3/e6PURE MATTE TIN/TIN BISMUTH48
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