Alliance Memory, Inc. AS6C1616-55BINTR
- Part Number:
- AS6C1616-55BINTR
- Manufacturer:
- Alliance Memory, Inc.
- Ventron No:
- 3234606-AS6C1616-55BINTR
- Description:
- IC SRAM 16MBIT 55NS 48TFBGA
- Datasheet:
- AS6C1616-55BINTR
Alliance Memory, Inc. AS6C1616-55BINTR technical specifications, attributes, parameters and parts with similar specifications to Alliance Memory, Inc. AS6C1616-55BINTR.
- Factory Lead Time8 Weeks
- Mounting TypeSurface Mount
- Package / Case48-LFBGA
- Number of Pins48
- Supplier Device Package48-TFBGA (6x8)
- Operating Temperature-40°C~85°C TA
- PackagingTape & Reel (TR)
- Published2009
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature-40°C
- TechnologySRAM - Asynchronous
- Voltage - Supply2.7V~3.6V
- InterfaceParallel
- Memory Size16Mb 1M x 16
- Memory TypeVolatile
- Access Time55ns
- Memory FormatSRAM
- Memory InterfaceParallel
- Write Cycle Time - Word, Page55ns
- RoHS StatusROHS3 Compliant
AS6C1616-55BINTR Overview
The mounting type for this particular device is surface mount, meaning it can be easily attached to a surface. The supplier device package is 48-TFBGA (6x8), indicating the size and shape of the device. It is designed to operate in a wide temperature range of -40°C to 85°C, making it suitable for various environments. The packaging for this device is tape and reel (TR), which is a common method for shipping and storing electronic components. It has a moisture sensitivity level (MSL) of 3, meaning it can withstand 168 hours of exposure to moisture. The minimum operating temperature for this device is -40°C. It is a type of SRAM (static random-access memory) that operates asynchronously. Its memory format is SRAM and it has a parallel memory interface. The write cycle time for this device is 55ns, specifically for word and page operations. Overall, this device is a reliable and versatile option for various applications.
AS6C1616-55BINTR Features
Package / Case: 48-LFBGA
48 Pins
AS6C1616-55BINTR Applications
There are a lot of Alliance Memory, Inc.
AS6C1616-55BINTR Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
The mounting type for this particular device is surface mount, meaning it can be easily attached to a surface. The supplier device package is 48-TFBGA (6x8), indicating the size and shape of the device. It is designed to operate in a wide temperature range of -40°C to 85°C, making it suitable for various environments. The packaging for this device is tape and reel (TR), which is a common method for shipping and storing electronic components. It has a moisture sensitivity level (MSL) of 3, meaning it can withstand 168 hours of exposure to moisture. The minimum operating temperature for this device is -40°C. It is a type of SRAM (static random-access memory) that operates asynchronously. Its memory format is SRAM and it has a parallel memory interface. The write cycle time for this device is 55ns, specifically for word and page operations. Overall, this device is a reliable and versatile option for various applications.
AS6C1616-55BINTR Features
Package / Case: 48-LFBGA
48 Pins
AS6C1616-55BINTR Applications
There are a lot of Alliance Memory, Inc.
AS6C1616-55BINTR Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
AS6C1616-55BINTR More Descriptions
SRAM Chip Async Single 3V 16M-Bit 1M x 16 55ns 48-Pin TFBGA T/R
Low Power CMOS SRAM 16MB 48ball TFBGA 3V 1024k x 16
IC SRAM 16M PARALLEL 48TFBGA REEL
SRAM 16M 3V 55ns 1024Kx16 LP Asy SRAM
Low Power CMOS SRAM 16MB 48ball TFBGA 3V 1024k x 16
IC SRAM 16M PARALLEL 48TFBGA REEL
SRAM 16M 3V 55ns 1024Kx16 LP Asy SRAM
The three parts on the right have similar specifications to AS6C1616-55BINTR.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseNumber of PinsSupplier Device PackageOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureTechnologyVoltage - SupplyInterfaceMemory SizeMemory TypeAccess TimeMemory FormatMemory InterfaceWrite Cycle Time - Word, PageRoHS StatusSurface MountNumber of TerminationsTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Operating ModeOrganizationMemory WidthMemory DensityAccess Time (Max)LengthHeight Seated (Max)WidthJESD-609 CodePbfree CodeTerminal FinishPin CountHTS CodeAlternate Memory WidthView Compare
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AS6C1616-55BINTR8 WeeksSurface Mount48-LFBGA4848-TFBGA (6x8)-40°C~85°C TATape & Reel (TR)2009Active3 (168 Hours)85°C-40°CSRAM - Asynchronous2.7V~3.6VParallel16Mb 1M x 16Volatile55nsSRAMParallel55nsROHS3 Compliant--------------------------
-
8 WeeksSurface Mount48-LFBGA---40°C~85°C TATray-Active3 (168 Hours)--CMOS2.7V~3.6V-32Mb 2M x 16Volatile-SRAMParallel55nsROHS3 CompliantYES48BOTTOMNOT SPECIFIED13V0.75mmNOT SPECIFIEDR-PBGA-B483.6V2.7VASYNCHRONOUS2MX161633554432 bit55 ns10mm1.4mm8mm------
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8 WeeksSurface Mount48-TFSOP (0.724, 18.40mm Width)---40°C~85°C TATray-Active3 (168 Hours)--CMOS2.7V~3.6V-16Mb 1M x 16Volatile-SRAMParallel55nsROHS3 CompliantYES48DUAL26013V0.5mm40R-PDSO-G483.6V2.7VASYNCHRONOUS1MX161616777216 bit55 ns18.4mm1.2mm12mme3/e6yesPURE MATTE TIN/TIN BISMUTH48--
-
8 WeeksSurface Mount48-TFSOP (0.724, 18.40mm Width)---40°C~85°C TATray-Active3 (168 Hours)--SRAM - Asynchronous2.7V~3.6V-32Mb 2M x 16Volatile-SRAMParallel55nsROHS3 CompliantYES48DUALNOT SPECIFIED13V0.5mmNOT SPECIFIEDR-PDSO-G483.6V2.7V-2MX161633554432 bit55 ns18.4mm1.2mm12mm-yes--8542.32.00.418
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