AS6C1616-55BINTR

Alliance Memory, Inc. AS6C1616-55BINTR

Part Number:
AS6C1616-55BINTR
Manufacturer:
Alliance Memory, Inc.
Ventron No:
3234606-AS6C1616-55BINTR
Description:
IC SRAM 16MBIT 55NS 48TFBGA
ECAD Model:
Datasheet:
AS6C1616-55BINTR

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Specifications
Alliance Memory, Inc. AS6C1616-55BINTR technical specifications, attributes, parameters and parts with similar specifications to Alliance Memory, Inc. AS6C1616-55BINTR.
  • Factory Lead Time
    8 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    48-LFBGA
  • Number of Pins
    48
  • Supplier Device Package
    48-TFBGA (6x8)
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tape & Reel (TR)
  • Published
    2009
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    -40°C
  • Technology
    SRAM - Asynchronous
  • Voltage - Supply
    2.7V~3.6V
  • Interface
    Parallel
  • Memory Size
    16Mb 1M x 16
  • Memory Type
    Volatile
  • Access Time
    55ns
  • Memory Format
    SRAM
  • Memory Interface
    Parallel
  • Write Cycle Time - Word, Page
    55ns
  • RoHS Status
    ROHS3 Compliant
Description
AS6C1616-55BINTR Overview
The mounting type for this particular device is surface mount, meaning it can be easily attached to a surface. The supplier device package is 48-TFBGA (6x8), indicating the size and shape of the device. It is designed to operate in a wide temperature range of -40°C to 85°C, making it suitable for various environments. The packaging for this device is tape and reel (TR), which is a common method for shipping and storing electronic components. It has a moisture sensitivity level (MSL) of 3, meaning it can withstand 168 hours of exposure to moisture. The minimum operating temperature for this device is -40°C. It is a type of SRAM (static random-access memory) that operates asynchronously. Its memory format is SRAM and it has a parallel memory interface. The write cycle time for this device is 55ns, specifically for word and page operations. Overall, this device is a reliable and versatile option for various applications.

AS6C1616-55BINTR Features
Package / Case: 48-LFBGA
48 Pins


AS6C1616-55BINTR Applications
There are a lot of Alliance Memory, Inc.
AS6C1616-55BINTR Memory applications.


personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
AS6C1616-55BINTR More Descriptions
SRAM Chip Async Single 3V 16M-Bit 1M x 16 55ns 48-Pin TFBGA T/R
Low Power CMOS SRAM 16MB 48ball TFBGA 3V 1024k x 16
IC SRAM 16M PARALLEL 48TFBGA REEL
SRAM 16M 3V 55ns 1024Kx16 LP Asy SRAM
Product Comparison
The three parts on the right have similar specifications to AS6C1616-55BINTR.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Number of Pins
    Supplier Device Package
    Operating Temperature
    Packaging
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Max Operating Temperature
    Min Operating Temperature
    Technology
    Voltage - Supply
    Interface
    Memory Size
    Memory Type
    Access Time
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    RoHS Status
    Surface Mount
    Number of Terminations
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Access Time (Max)
    Length
    Height Seated (Max)
    Width
    JESD-609 Code
    Pbfree Code
    Terminal Finish
    Pin Count
    HTS Code
    Alternate Memory Width
    View Compare
  • AS6C1616-55BINTR
    AS6C1616-55BINTR
    8 Weeks
    Surface Mount
    48-LFBGA
    48
    48-TFBGA (6x8)
    -40°C~85°C TA
    Tape & Reel (TR)
    2009
    Active
    3 (168 Hours)
    85°C
    -40°C
    SRAM - Asynchronous
    2.7V~3.6V
    Parallel
    16Mb 1M x 16
    Volatile
    55ns
    SRAM
    Parallel
    55ns
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • AS6C3216A-55BIN
    8 Weeks
    Surface Mount
    48-LFBGA
    -
    -
    -40°C~85°C TA
    Tray
    -
    Active
    3 (168 Hours)
    -
    -
    CMOS
    2.7V~3.6V
    -
    32Mb 2M x 16
    Volatile
    -
    SRAM
    Parallel
    55ns
    ROHS3 Compliant
    YES
    48
    BOTTOM
    NOT SPECIFIED
    1
    3V
    0.75mm
    NOT SPECIFIED
    R-PBGA-B48
    3.6V
    2.7V
    ASYNCHRONOUS
    2MX16
    16
    33554432 bit
    55 ns
    10mm
    1.4mm
    8mm
    -
    -
    -
    -
    -
    -
  • AS6C1616-55TINL
    8 Weeks
    Surface Mount
    48-TFSOP (0.724, 18.40mm Width)
    -
    -
    -40°C~85°C TA
    Tray
    -
    Active
    3 (168 Hours)
    -
    -
    CMOS
    2.7V~3.6V
    -
    16Mb 1M x 16
    Volatile
    -
    SRAM
    Parallel
    55ns
    ROHS3 Compliant
    YES
    48
    DUAL
    260
    1
    3V
    0.5mm
    40
    R-PDSO-G48
    3.6V
    2.7V
    ASYNCHRONOUS
    1MX16
    16
    16777216 bit
    55 ns
    18.4mm
    1.2mm
    12mm
    e3/e6
    yes
    PURE MATTE TIN/TIN BISMUTH
    48
    -
    -
  • AS6C3216A-55TIN
    8 Weeks
    Surface Mount
    48-TFSOP (0.724, 18.40mm Width)
    -
    -
    -40°C~85°C TA
    Tray
    -
    Active
    3 (168 Hours)
    -
    -
    SRAM - Asynchronous
    2.7V~3.6V
    -
    32Mb 2M x 16
    Volatile
    -
    SRAM
    Parallel
    55ns
    ROHS3 Compliant
    YES
    48
    DUAL
    NOT SPECIFIED
    1
    3V
    0.5mm
    NOT SPECIFIED
    R-PDSO-G48
    3.6V
    2.7V
    -
    2MX16
    16
    33554432 bit
    55 ns
    18.4mm
    1.2mm
    12mm
    -
    yes
    -
    -
    8542.32.00.41
    8
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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