Alliance Memory, Inc. AS4C64M16D3LA-12BINTR
- Part Number:
- AS4C64M16D3LA-12BINTR
- Manufacturer:
- Alliance Memory, Inc.
- Ventron No:
- 3233869-AS4C64M16D3LA-12BINTR
- Description:
- IC SDRAM 1GBIT 800MHZ 96BGA
- Datasheet:
- AS4C64M16D3LA-12BINTR
Alliance Memory, Inc. AS4C64M16D3LA-12BINTR technical specifications, attributes, parameters and parts with similar specifications to Alliance Memory, Inc. AS4C64M16D3LA-12BINTR.
- Mounting TypeSurface Mount
- Package / Case96-VFBGA
- Supplier Device Package96-FBGA (8x13)
- Operating Temperature-40°C~95°C TC
- PackagingTape & Reel (TR)
- Part StatusDiscontinued
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - DDR3L
- Voltage - Supply1.283V~1.45V
- Memory Size1Gb 64M x 16
- Memory TypeVolatile
- Clock Frequency800MHz
- Access Time20ns
- Memory FormatDRAM
- Memory InterfaceParallel
- Write Cycle Time - Word, Page15ns
- RoHS StatusROHS3 Compliant
AS4C64M16D3LA-12BINTR Overview
The package or case of this particular device is a 96-VFBGA, which stands for Very Fine Pitch Ball Grid Array. This package is commonly used for integrated circuits and has a total of 96 pins. The supplier device package, on the other hand, is a 96-FBGA (8x13), which refers to a 96-pin Ball Grid Array with a size of 8x13 millimeters. This device is designed to operate in a wide range of temperatures, from -40°C to 95°C, making it suitable for various environments. The packaging for this device is Tape & Reel (TR), which is a common method used for shipping and storing electronic components. However, it is important to note that this particular device has been discontinued. The technology used for this device is SDRAM - DDR3L, which stands for Synchronous Dynamic Random Access Memory - Double Data Rate 3 Low Voltage. This type of memory is volatile, meaning it requires a constant power supply to retain data. The voltage supply for this device ranges from 1.283V to 1.45V, making it energy-efficient. With a memory size of 1Gb 64M x 16, this device has a total capacity of 1 gigabit, with 64 million cells and each cell storing 16 bits of data. Finally, the clock frequency for this device is 800MHz, which refers to the speed at which data is transferred within the device. Overall, this device offers efficient and reliable performance with its advanced technology and specifications.
AS4C64M16D3LA-12BINTR Features
Package / Case: 96-VFBGA
AS4C64M16D3LA-12BINTR Applications
There are a lot of Alliance Memory, Inc.
AS4C64M16D3LA-12BINTR Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
The package or case of this particular device is a 96-VFBGA, which stands for Very Fine Pitch Ball Grid Array. This package is commonly used for integrated circuits and has a total of 96 pins. The supplier device package, on the other hand, is a 96-FBGA (8x13), which refers to a 96-pin Ball Grid Array with a size of 8x13 millimeters. This device is designed to operate in a wide range of temperatures, from -40°C to 95°C, making it suitable for various environments. The packaging for this device is Tape & Reel (TR), which is a common method used for shipping and storing electronic components. However, it is important to note that this particular device has been discontinued. The technology used for this device is SDRAM - DDR3L, which stands for Synchronous Dynamic Random Access Memory - Double Data Rate 3 Low Voltage. This type of memory is volatile, meaning it requires a constant power supply to retain data. The voltage supply for this device ranges from 1.283V to 1.45V, making it energy-efficient. With a memory size of 1Gb 64M x 16, this device has a total capacity of 1 gigabit, with 64 million cells and each cell storing 16 bits of data. Finally, the clock frequency for this device is 800MHz, which refers to the speed at which data is transferred within the device. Overall, this device offers efficient and reliable performance with its advanced technology and specifications.
AS4C64M16D3LA-12BINTR Features
Package / Case: 96-VFBGA
AS4C64M16D3LA-12BINTR Applications
There are a lot of Alliance Memory, Inc.
AS4C64M16D3LA-12BINTR Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
AS4C64M16D3LA-12BINTR More Descriptions
AS4C64M16D3LA Series 1 Gb (64 M x 16) 1.45 V 800 MHz SMT DDR3 SDRAM - FBGA-96
DDR3 1GB 800MHz 1600bps/pin 1.35V 64M x 16 96-ball FBGA
CoC and 2-years warranty / RFQ for pricing
DDR3 1GB 800MHz 1600bps/pin 1.35V 64M x 16 96-ball FBGA
CoC and 2-years warranty / RFQ for pricing
The three parts on the right have similar specifications to AS4C64M16D3LA-12BINTR.
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ImagePart NumberManufacturerMounting TypePackage / CaseSupplier Device PackageOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyAccess TimeMemory FormatMemory InterfaceWrite Cycle Time - Word, PageRoHS StatusFactory Lead TimePublishedPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)Surface MountPbfree CodeNumber of TerminationsAdditional FeatureTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of PortsOperating ModeOrganizationMemory WidthMemory DensityLengthHeight Seated (Max)WidthView Compare
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AS4C64M16D3LA-12BINTRSurface Mount96-VFBGA96-FBGA (8x13)-40°C~95°C TCTape & Reel (TR)Discontinued3 (168 Hours)SDRAM - DDR3L1.283V~1.45V1Gb 64M x 16Volatile800MHz20nsDRAMParallel15nsROHS3 Compliant------------------------
-
Surface Mount84-TFBGA-0°C~85°C TCTape & Reel (TR)Active3 (168 Hours)SDRAM - DDR21.7V~1.9V2Gb 128M x 16Volatile400MHz-DRAMParallel15nsRoHS Compliant8 Weeks2015NOT SPECIFIEDNOT SPECIFIED-------------------
-
Surface Mount60-VFBGA--30°C~85°C TJTape & Reel (TR)Active3 (168 Hours)SDRAM - Mobile LPDDR1.7V~1.9V512Mb 32M x 16Volatile200MHz700psDRAMParallel15nsROHS3 Compliant8 Weeks2015NOT SPECIFIEDNOT SPECIFIED-------------------
-
Surface Mount60-TFBGA--40°C~95°C TCTrayActive3 (168 Hours)SDRAM - DDR21.7V~1.9V2Gb 256M x 8Volatile400MHz57.5nsDRAMParallel15nsROHS3 Compliant8 Weeks2014NOT SPECIFIEDNOT SPECIFIEDYESyes60AUTO/SELF REFRESHBOTTOM11.8V0.8mmR-PBGA-B601.9V1.7V1SYNCHRONOUS256MX882147483648 bit13mm1.2mm10.5mm
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