Alliance Memory, Inc. AS4C128M8D2-25BCN
- Part Number:
- AS4C128M8D2-25BCN
- Manufacturer:
- Alliance Memory, Inc.
- Ventron No:
- 3226935-AS4C128M8D2-25BCN
- Description:
- IC SDRAM 1GBIT 400MHZ 60BGA
- Datasheet:
- AS4C128M8D2-25BCN
Alliance Memory, Inc. AS4C128M8D2-25BCN technical specifications, attributes, parameters and parts with similar specifications to Alliance Memory, Inc. AS4C128M8D2-25BCN.
- Factory Lead Time8 Weeks
- Mounting TypeSurface Mount
- Package / Case60-TFBGA
- Surface MountYES
- Number of Pins60
- Operating Temperature0°C~85°C TC
- PackagingTray
- Published2013
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations60
- ECCN CodeEAR99
- Additional FeatureAUTO/SELF REFRESH
- HTS Code8542.32.00.32
- TechnologySDRAM - DDR2
- Voltage - Supply1.7V~1.9V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.8mm
- Operating Supply Voltage1.8V
- Supply Voltage-Max (Vsup)1.9V
- Supply Voltage-Min (Vsup)1.7V
- Memory Size1Gb 128M x 8
- Number of Ports1
- Memory TypeVolatile
- Clock Frequency400MHz
- Access Time400ps
- Memory FormatDRAM
- Memory InterfaceParallel
- Data Bus Width8b
- Organization128MX8
- Memory Width8
- Write Cycle Time - Word, Page15ns
- Address Bus Width14b
- Density1 Gb
- Height Seated (Max)1.2mm
- Length10mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
AS4C128M8D2-25BCN Overview
The mounting type of this particular electronic component is surface mount, making it easy to install and use. One of its additional features is the AUTO/SELF REFRESH function, which allows for automatic refreshing of data without any manual intervention. Its HTS code is 8542.32.00.32, indicating its classification as a DRAM (Dynamic Random Access Memory) module. The voltage supply for this component ranges from 1.7V to 1.9V, with an operating supply voltage of 1.8V. It has one port and a data bus width of 8 bits, with a memory width of 8. The write cycle time for this component is 15 nanoseconds, ensuring fast and efficient data transfer.
AS4C128M8D2-25BCN Features
Package / Case: 60-TFBGA
60 Pins
Operating Supply Voltage:1.8V
Additional Feature:AUTO/SELF REFRESH
AS4C128M8D2-25BCN Applications
There are a lot of Alliance Memory, Inc.
AS4C128M8D2-25BCN Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
The mounting type of this particular electronic component is surface mount, making it easy to install and use. One of its additional features is the AUTO/SELF REFRESH function, which allows for automatic refreshing of data without any manual intervention. Its HTS code is 8542.32.00.32, indicating its classification as a DRAM (Dynamic Random Access Memory) module. The voltage supply for this component ranges from 1.7V to 1.9V, with an operating supply voltage of 1.8V. It has one port and a data bus width of 8 bits, with a memory width of 8. The write cycle time for this component is 15 nanoseconds, ensuring fast and efficient data transfer.
AS4C128M8D2-25BCN Features
Package / Case: 60-TFBGA
60 Pins
Operating Supply Voltage:1.8V
Additional Feature:AUTO/SELF REFRESH
AS4C128M8D2-25BCN Applications
There are a lot of Alliance Memory, Inc.
AS4C128M8D2-25BCN Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
AS4C128M8D2-25BCN More Descriptions
AS4C128M8D2 Series 1Gb (128M x 8) 3.3 V Synchronous DRAM - FBGA-60
DRAM Chip DDR2 SDRAM 1Gbit 128Mx8 1.8V 60-Pin FBGA Tray
DRAM, 1Gb, 128M X 8, 400MHz, 1.8v, STD, FBGA
DDR2 1G 128M x 8 1.8V 60-ball BGA 400 MHz Commercial Temp
DRAM DRAM 1G, 1.8V 128M X 8 DDR2
DRAM Chip DDR2 SDRAM 1Gbit 128Mx8 1.8V 60-Pin FBGA Tray
DRAM, 1Gb, 128M X 8, 400MHz, 1.8v, STD, FBGA
DDR2 1G 128M x 8 1.8V 60-ball BGA 400 MHz Commercial Temp
DRAM DRAM 1G, 1.8V 128M X 8 DDR2
The three parts on the right have similar specifications to AS4C128M8D2-25BCN.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeAdditional FeatureHTS CodeTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeNumber of PortsMemory TypeClock FrequencyAccess TimeMemory FormatMemory InterfaceData Bus WidthOrganizationMemory WidthWrite Cycle Time - Word, PageAddress Bus WidthDensityHeight Seated (Max)LengthRadiation HardeningRoHS StatusLead FreePeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)MountJESD-609 CodePbfree CodeTerminal FinishPin CountData RateHeightWidthView Compare
-
AS4C128M8D2-25BCN8 WeeksSurface Mount60-TFBGAYES600°C~85°C TCTray2013Active3 (168 Hours)60EAR99AUTO/SELF REFRESH8542.32.00.32SDRAM - DDR21.7V~1.9VBOTTOM11.8V0.8mm1.8V1.9V1.7V1Gb 128M x 81Volatile400MHz400psDRAMParallel8b128MX8815ns14b1 Gb1.2mm10mmNoROHS3 CompliantLead Free-----------
-
8 WeeksSurface Mount84-TFBGA--0°C~85°C TCTape & Reel (TR)2015Active3 (168 Hours)----SDRAM - DDR21.7V~1.9V-------2Gb 128M x 16-Volatile400MHz-DRAMParallel---15ns-----RoHS Compliant-NOT SPECIFIEDNOT SPECIFIED--------
-
8 WeeksSurface Mount96-TFBGA---40°C~95°C TCTape & Reel (TR)-Active3 (168 Hours)----SDRAM - DDR3L1.283V~1.45V-------4Gb 256M x 16-Volatile800MHz20nsDRAMParallel---15ns-----Non-RoHS Compliant-----------
-
-Surface Mount66-TSSOP (0.400, 10.16mm Width)-66-40°C~85°C TATray2012Obsolete3 (168 Hours)66EAR99AUTO/SELF REFRESH8542.32.00.28SDRAM - DDR2.3V~2.7VDUAL12.5V0.65mm2.5V2.7V2.3V512Mb 32M x 161Volatile200MHz700psDRAMParallel16b32MX16-15ns13b512 Mb-22.35mmNoRoHS CompliantLead Free26040Surface Mounte3/e6yesPURE MATTE TIN/TIN BISMUTH66400 Mbps1.1mm10.29mm
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
25 December 2023
ULN2803ADWR Darlington Transistor Array Advantages, Market Trends, Applications, Pinout and Feature Description
Ⅰ. ULN2803ADWR overviewⅡ. What are the advantages of the ULN2803ADWR chip?Ⅲ. Market trends of ULN2803ADWRⅣ. Where is ULN2803ADWR mainly used?Ⅴ. Symbol, footprint and pin configuration of ULN2803ADWRⅥ. Precautions... -
26 December 2023
LM358DR Dual Operational Amplifier Characteristics, Applications, LM358DR vs LM358S
Ⅰ. LM358DR descriptionⅡ. Pin configuration of LM358DRⅢ. What are the characteristics of LM358DR?Ⅳ. How to adjust the gain setting of the LM358DR chip?Ⅴ. Schematic diagram of LM358DRⅥ. What... -
26 December 2023
An Overview of BAV99 Switching Diode
Ⅰ. What is a switching diode?Ⅱ. Introduction of BAV99Ⅲ. What are the functions of BAV99 diode?Ⅳ. Typical characteristics of BAV99 diodeⅤ. Technical parameters of BAV99 diodeⅥ. How to... -
27 December 2023
Everything You Need to Know About STM8S003F3P6TR Microcontroller
Ⅰ. Overview of STM8S003F3P6TRⅡ. Structure of STM8S003F3P6TR microcontrollerⅢ. Package of STM8S003F3P6TR microcontrollerⅣ. STM8S003F3P6TR priceⅤ. Advantages and application scenarios of STM8S003F3P6TRⅥ. STM8S003F3P6TR specificationsⅦ. What are the characteristics of STM8S003F3P6TR...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.