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IDT, Integrated Device Technology Inc 89H12NT12G2ZAHLGI
- Part Number:
- 89H12NT12G2ZAHLGI
- Manufacturer:
- IDT, Integrated Device Technology Inc
- Ventron No:
- 3684352-89H12NT12G2ZAHLGI
- Description:
- IC PCI SW 12LANE 12PORT 324BGA
- ECAD Model:
-
- Datasheet:
- 89H12NT12G2ZAHLGI
IDT, Integrated Device Technology Inc 89H12NT12G2ZAHLGI technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 89H12NT12G2ZAHLGI.
- MountSurface Mount
- Package / CaseFCBGA
- Published1999
- Max Operating Temperature85°C
- Min Operating Temperature-40°C
- Operating Supply Voltage3.3V
- InterfacePCI Express
- Number of Ports12
- Frequency (Max)125MHz
- Data Rate96 Gbps
- RoHS StatusRoHS Compliant
89H12NT12G2ZAHLGI Overview
The Surface Mount (SMT) technology has revolutionized the world of electronic packaging since its introduction in 1999. One of the most widely used packaging options is the Flip Chip Ball Grid Array (FCBGA) package. This package, also known as the "Mount," offers a compact and reliable solution for mounting integrated circuits onto a printed circuit board. With an operating temperature range of -40°C to 85°C, the Mount is suitable for a wide range of applications. It operates at a maximum frequency of 125MHz and has a data rate of 96 Gbps, making it ideal for high-speed data transfer. Additionally, the Mount is RoHS compliant, ensuring that it meets all environmental standards. With an operating supply voltage of 3.3V and PCI Express interface, the Mount is a versatile and efficient packaging solution for various electronic devices.
89H12NT12G2ZAHLGI Features
89H12NT12G2ZAHLGI Applications
There are a lot of Integrated Device Technology (IDT) 89H12NT12G2ZAHLGI Specialized Interface ICs applications.
High reliability control systems
Audio signal routing
Short/Medium Loop: approximately 2000 ft. of 26 AWG,
Communication systems
Cross Connects
Imaging
High-Voltage
Ultrasound
nonfault-protected)
Sample-and-hold systems
The Surface Mount (SMT) technology has revolutionized the world of electronic packaging since its introduction in 1999. One of the most widely used packaging options is the Flip Chip Ball Grid Array (FCBGA) package. This package, also known as the "Mount," offers a compact and reliable solution for mounting integrated circuits onto a printed circuit board. With an operating temperature range of -40°C to 85°C, the Mount is suitable for a wide range of applications. It operates at a maximum frequency of 125MHz and has a data rate of 96 Gbps, making it ideal for high-speed data transfer. Additionally, the Mount is RoHS compliant, ensuring that it meets all environmental standards. With an operating supply voltage of 3.3V and PCI Express interface, the Mount is a versatile and efficient packaging solution for various electronic devices.
89H12NT12G2ZAHLGI Features
89H12NT12G2ZAHLGI Applications
There are a lot of Integrated Device Technology (IDT) 89H12NT12G2ZAHLGI Specialized Interface ICs applications.
High reliability control systems
Audio signal routing
Short/Medium Loop: approximately 2000 ft. of 26 AWG,
Communication systems
Cross Connects
Imaging
High-Voltage
Ultrasound
nonfault-protected)
Sample-and-hold systems
89H12NT12G2ZAHLGI More Descriptions
IC PCI SW 12LANE 12PORT 324BGA
PCI Interface IC
324 BGA (GREEN)
PCI Interface IC
324 BGA (GREEN)
The three parts on the right have similar specifications to 89H12NT12G2ZAHLGI.
-
ImagePart NumberManufacturerMountPackage / CasePublishedMax Operating TemperatureMin Operating TemperatureOperating Supply VoltageInterfaceNumber of PortsFrequency (Max)Data RateRoHS StatusFactory Lead TimeContact PlatingNumber of PinsPackagingJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)ECCN CodeTerminal FinishHTS CodeTechnologyPeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Pin CountuPs/uCs/Peripheral ICs TypeHeightLengthWidthThicknessLead FreeMounting TypeApplicationsVoltage - SupplyBase Part NumberSurface MountNumber of TerminalsSubcategoryTerminal PositionTerminal FormSupply VoltageTerminal PitchReach Compliance CodeJESD-30 CodeQualification StatusOperating Temperature (Max)Supply Voltage-Max (Vsup)Power SuppliesTemperature GradeSupply Voltage-Min (Vsup)Clock FrequencyBus CompatibilityDrive Interface StandardHeight Seated (Max)View Compare
-
89H12NT12G2ZAHLGISurface MountFCBGA199985°C-40°C3.3VPCI Express12125MHz96 GbpsRoHS Compliant--------------------------------------------- -
Surface MountFCBGA199970°C0°C3.3VPCI Express12125MHz96 GbpsRoHS Compliant10 WeeksCopper, Silver, Tin324Tape & Reel (TR)e1yesActive4EAR99Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOS26030324BUS CONTROLLER, PCI3.02mm19mm19mm3.02mmLead Free-----------------------
-
-324-BBGA, FCBGA----PCI Express---Non-RoHS Compliant---Tape & Reel (TR)--Obsolete3 (168 Hours)-------------Surface MountSwitch Interfacing3.3VIDT89H12-------------------
-
----------Non-RoHS Compliant----e0icon-pbfree no-3EAR99Tin/Lead (Sn63Pb37)8542.39.00.01CMOS22520324BUS CONTROLLER, PCI-19mm19mm------YES324Bus ControllersBOTTOMBALL1V1mmnot_compliantS-PBGA-B324Not Qualified70°C1.1V12.53.3VCOMMERCIAL0.9V125MHzPCIIEEE 1149.6AC; IEEE 1149.11.72mm
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