IDT, Integrated Device Technology Inc 89HPES3T3ZBNQG
- Part Number:
- 89HPES3T3ZBNQG
- Manufacturer:
- IDT, Integrated Device Technology Inc
- Ventron No:
- 3831631-89HPES3T3ZBNQG
- Description:
- IC PCI SW 3LANE 3PORT 132-VFQFPN
- Datasheet:
- IDT Suffixes
IDT, Integrated Device Technology Inc 89HPES3T3ZBNQG technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 89HPES3T3ZBNQG.
- Factory Lead Time10 Weeks
- Contact PlatingTin
- MountSurface Mount
- Number of Pins132
- Published1999
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)3
- Number of Terminations132
- ECCN CodeEAR99
- Max Operating Temperature70°C
- Min Operating Temperature0°C
- HTS Code8542.39.00.01
- SubcategoryBus Controllers
- TechnologyCMOS
- Terminal PositionQUAD
- Terminal FormNO LEAD
- Peak Reflow Temperature (Cel)260
- Supply Voltage1V
- Terminal Pitch0.65mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- Pin Count132
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.1V
- Power Supplies13.3V
- Temperature GradeCOMMERCIAL
- Supply Voltage-Min (Vsup)0.9V
- InterfacePCI Express
- uPs/uCs/Peripheral ICs TypeBUS CONTROLLER, PCI
- Clock Frequency100MHz
- Bus CompatibilityPCI
- Height Seated (Max)0.9mm
- Length10mm
- Width10mm
- Thickness900μm
- RoHS StatusRoHS Compliant
- Lead FreeLead Free
89HPES3T3ZBNQG Overview
Contact plating for this particular technology, CMOS, was first published in 1999 under the JESD-609 Code e3. This plating method involves the use of tin and has a thickness of 900μm. The technology operates at a minimum temperature of 0°C and can withstand a peak reflow temperature of 260°C. There are a total of 132 terminations for this contact plating, making it suitable for a variety of electronic devices. However, it should be noted that this particular contact plating has not yet been qualified, meaning it has not undergone rigorous testing to ensure its reliability. Additionally, it requires a power supply of 13.3V for optimal performance.
89HPES3T3ZBNQG Features
Set the part at 1V volts
BUS CONTROLLER, PCI of uPs/uCs/Peripheral ICs Type
89HPES3T3ZBNQG Applications
There are a lot of Integrated Device Technology (IDT) 89HPES3T3ZBNQG Specialized Interface ICs applications.
Ultrasound
Multi-Line E1 Interface Cards
Cross Connects
(FTTH)
Imaging
Medical systems
PCMCIA cards
ATM and Frame Relay Equipment
Cell phones
Residential Gateways, Home Gateway/Router
Contact plating for this particular technology, CMOS, was first published in 1999 under the JESD-609 Code e3. This plating method involves the use of tin and has a thickness of 900μm. The technology operates at a minimum temperature of 0°C and can withstand a peak reflow temperature of 260°C. There are a total of 132 terminations for this contact plating, making it suitable for a variety of electronic devices. However, it should be noted that this particular contact plating has not yet been qualified, meaning it has not undergone rigorous testing to ensure its reliability. Additionally, it requires a power supply of 13.3V for optimal performance.
89HPES3T3ZBNQG Features
Set the part at 1V volts
BUS CONTROLLER, PCI of uPs/uCs/Peripheral ICs Type
89HPES3T3ZBNQG Applications
There are a lot of Integrated Device Technology (IDT) 89HPES3T3ZBNQG Specialized Interface ICs applications.
Ultrasound
Multi-Line E1 Interface Cards
Cross Connects
(FTTH)
Imaging
Medical systems
PCMCIA cards
ATM and Frame Relay Equipment
Cell phones
Residential Gateways, Home Gateway/Router
89HPES3T3ZBNQG More Descriptions
PCI Express Switch 132-Pin VFQFPN EP Tray
IC PCI SW 3LANE 3PORT 132-VFQFPN
3-lane, 3-port PCIe I/O Expansion Switch
PCI Interface IC PCI EXPRESS SWITCH
IC PCI SW 3LANE 3PORT 132-VFQFPN
3-lane, 3-port PCIe I/O Expansion Switch
PCI Interface IC PCI EXPRESS SWITCH
The three parts on the right have similar specifications to 89HPES3T3ZBNQG.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingMountNumber of PinsPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeMax Operating TemperatureMin Operating TemperatureHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)Pin CountQualification StatusSupply Voltage-Max (Vsup)Power SuppliesTemperature GradeSupply Voltage-Min (Vsup)InterfaceuPs/uCs/Peripheral ICs TypeClock FrequencyBus CompatibilityHeight Seated (Max)LengthWidthThicknessRoHS StatusLead FreePackage / CaseConsumer IC TypeMounting TypePackagingApplicationsBase Part NumberRadiation HardeningView Compare
-
89HPES3T3ZBNQG10 WeeksTinSurface Mount1321999e3yesActive3132EAR9970°C0°C8542.39.00.01Bus ControllersCMOSQUADNO LEAD2601V0.65mmNOT SPECIFIED132Not Qualified1.1V13.3VCOMMERCIAL0.9VPCI ExpressBUS CONTROLLER, PCI100MHzPCI0.9mm10mm10mm900μmRoHS CompliantLead Free--------
-
10 Weeks-Surface Mount-2011-yesActive--------------100-----PCI Express----9mm9mm1.7mmRoHS CompliantLead Free100CONSUMER CIRCUIT-----
-
-------Obsolete3 (168 Hours)-------------------PCI Express-------Non-RoHS Compliant-100-LFBGA-Surface MountTraySwitch InterfacingIDT89HP0508-
-
10 Weeks-Surface Mount1001999-yesActive--------------100-----PCI Express----9mm9mm1.7mmRoHS CompliantLead Free-CONSUMER CIRCUIT----No
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