Part Number: XCZU6CG-L2FFVB1156E vs XCZU19EG-1FFVD1760E

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Part Number: XCZU6CG-L2FFVB1156E XCZU19EG-1FFVD1760E
Manufacturer: Xilinx Inc. Xilinx Inc.
Description: IC FPGA 328 I/O 1156FCBGA IC FPGA 308 I/O 1760FCBGA
Quantity Available: Available Available
Datasheets: - -
Factory Lead Time 11 Weeks 11 Weeks
Package / Case 1156-BBGA, FCBGA 1760-BBGA, FCBGA
Surface Mount YES -
Operating Temperature 0°C~100°C TJ 0°C~100°C TJ
Packaging Tray Tray
Published 2016 2016
Series Zynq® UltraScale ™ MPSoC CG Zynq® UltraScale ™ MPSoC EG
Part Status Active Active
Moisture Sensitivity Level (MSL) 4 (72 Hours) 4 (72 Hours)
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY -
HTS Code 8542.31.00.01 8542.31.00.01
Technology CMOS -
Terminal Position BOTTOM -
Terminal Form BALL -
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Supply Voltage 0.72V -
Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
JESD-30 Code R-PBGA-B1156 -
Supply Voltage-Max (Vsup) 0.742V -
Supply Voltage-Min (Vsup) 0.698V -
Number of I/O 328 308
Speed 533MHz, 1.3GHz 500MHz, 600MHz, 1.2GHz
RAM Size 256KB 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT -
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA MCU, FPGA
Primary Attributes Zynq®UltraScale ™ FPGA, 469K Logic Cells Zynq®UltraScale ™ FPGA, 1143K Logic Cells
RoHS Status ROHS3 Compliant ROHS3 Compliant
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