Xilinx Inc. XCZU19EG-1FFVC1760E
- Part Number:
- XCZU19EG-1FFVC1760E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 4544191-XCZU19EG-1FFVC1760E
- Description:
- IC FPGA 512 I/O 1760FCBGA
- Datasheet:
- XCZU19EG-1FFVC1760E
Xilinx Inc. XCZU19EG-1FFVC1760E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU19EG-1FFVC1760E.
- Factory Lead Time11 Weeks
- Package / Case1760-BBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O512
- Speed500MHz, 600MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 1143K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Xilinx Inc. is the brand of this part, which falls under the Embedded - System On Chip (SoC) category. This particular chip, published in 2016, has an active status and is packaged in a tray. It has 512 I/O and a speed of 500MHz, 600MHz, and 1.2GHz. The chip also has a RAM size of 256KB and various peripherals, such as DMA and WDT. It offers connectivity through CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The architecture of this chip is both MCU and FPGA, and its primary attributes include Zynq®UltraScale ™ FPGA and 1143K Logic Cells.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU19EG-1FFVC1760E System On Chip (SoC) applications.
Networked Media Encode/Decode
Smart appliances
Test and Measurement
Mobile computing
Keywords
Fitness
Central alarm system
High-end PLC
Optical drive
Transmitters
Xilinx Inc. is the brand of this part, which falls under the Embedded - System On Chip (SoC) category. This particular chip, published in 2016, has an active status and is packaged in a tray. It has 512 I/O and a speed of 500MHz, 600MHz, and 1.2GHz. The chip also has a RAM size of 256KB and various peripherals, such as DMA and WDT. It offers connectivity through CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The architecture of this chip is both MCU and FPGA, and its primary attributes include Zynq®UltraScale ™ FPGA and 1143K Logic Cells.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU19EG-1FFVC1760E System On Chip (SoC) applications.
Networked Media Encode/Decode
Smart appliances
Test and Measurement
Mobile computing
Keywords
Fitness
Central alarm system
High-end PLC
Optical drive
Transmitters
XCZU19EG-1FFVC1760E More Descriptions
FPGA Zynq UltraScale Family 1143450 Cells 20nm Technology 0.85V 1760-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 1143K, C1760, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 1143K, C1760, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU19EG-1FFVC1760E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusPbfree CodeSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU19EG-1FFVC1760E11 Weeks1760-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED512500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 1143K Logic CellsROHS3 Compliant-------------
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11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED360533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliantyes-----------
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11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant-YES900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B9000.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks1517-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED464533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant------------
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