Winbond Electronics W632GG6KB11I
- Part Number:
- W632GG6KB11I
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 7096491-W632GG6KB11I
- Description:
- Memory IC
- Datasheet:
- W632GG6KB11I
Winbond Electronics W632GG6KB11I technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W632GG6KB11I.
- Mounting TypeSurface Mount
- Package / Case96-TFBGA
- Operating Temperature-40°C~95°C TC
- PackagingTray
- Part StatusDiscontinued
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - DDR3
- Voltage - Supply1.425V~1.575V
- Memory Size2Gb 128M x 16
- Memory TypeVolatile
- Clock Frequency933MHz
- Access Time20ns
- Memory FormatDRAM
- Memory InterfaceParallel
- RoHS StatusROHS3 Compliant
W632GG6KB11I Overview
This product is manufactured by Winbond Electronics, a renowned player in the electronics industry. It is an essential Memory electronic component that comes in a compact tray packaging. The part status of this product has been discontinued, which means it is no longer available for purchase. The moisture sensitivity level (MSL) of this product is categorized as 3 (168 hours), indicating its high resistance to moisture. The technology used in this product is SDRAM - DDR3, which stands for Double Data Rate Dynamic Random Access Memory. It offers a memory size of 2Gb 128M x 16, making it a reliable choice for those seeking a high-capacity memory solution. The memory type is volatile, meaning it can be lost or erased when power is removed from the system. The clock frequency of this product is set at 933MHz, ensuring faster data transfer speeds. The access time for this product is only 20ns, which is incredibly fast, resulting in quick response times. The memory format is DRAM, which stands for Dynamic Random Access Memory, while the memory interface is designed for parallel communication. This interface allows for efficient communication between different components of a computer system, enhancing overall performance.
W632GG6KB11I Features
Package / Case: 96-TFBGA
W632GG6KB11I Applications
There are a lot of Winbond Electronics
W632GG6KB11I Memory applications.
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
This product is manufactured by Winbond Electronics, a renowned player in the electronics industry. It is an essential Memory electronic component that comes in a compact tray packaging. The part status of this product has been discontinued, which means it is no longer available for purchase. The moisture sensitivity level (MSL) of this product is categorized as 3 (168 hours), indicating its high resistance to moisture. The technology used in this product is SDRAM - DDR3, which stands for Double Data Rate Dynamic Random Access Memory. It offers a memory size of 2Gb 128M x 16, making it a reliable choice for those seeking a high-capacity memory solution. The memory type is volatile, meaning it can be lost or erased when power is removed from the system. The clock frequency of this product is set at 933MHz, ensuring faster data transfer speeds. The access time for this product is only 20ns, which is incredibly fast, resulting in quick response times. The memory format is DRAM, which stands for Dynamic Random Access Memory, while the memory interface is designed for parallel communication. This interface allows for efficient communication between different components of a computer system, enhancing overall performance.
W632GG6KB11I Features
Package / Case: 96-TFBGA
W632GG6KB11I Applications
There are a lot of Winbond Electronics
W632GG6KB11I Memory applications.
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
W632GG6KB11I More Descriptions
IC DRAM 2GBIT PARALLEL 96WBGA
IC DRAM 2G PARALLEL 933MHZ
IC DRAM 2G PARALLEL 933MHZ
The three parts on the right have similar specifications to W632GG6KB11I.
-
ImagePart NumberManufacturerMounting TypePackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyAccess TimeMemory FormatMemory InterfaceRoHS StatusSurface MountNumber of TerminationsECCN CodeAdditional FeatureTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of PortsOperating ModeOrganizationMemory WidthMemory DensityLengthHeight Seated (Max)WidthWrite Cycle Time - Word, PageView Compare
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W632GG6KB11ISurface Mount96-TFBGA-40°C~95°C TCTrayDiscontinued3 (168 Hours)SDRAM - DDR31.425V~1.575V2Gb 128M x 16Volatile933MHz20nsDRAMParallelROHS3 Compliant-----------------------
-
Surface Mount96-VFBGA0°C~95°C TCTrayObsolete3 (168 Hours)SDRAM - DDR31.283V~1.45V2Gb 128M x 16Volatile800MHz20nsDRAMParallelROHS3 CompliantYES96EAR99AUTO/SELF REFRESHBOTTOMNOT SPECIFIED11.35V0.8mmNOT SPECIFIEDR-PBGA-B961.45V1.283V1SYNCHRONOUS128MX16162147483648 bit13mm1mm7.5mm-
-
Surface Mount78-TFBGA0°C~95°C TCTrayDiscontinued3 (168 Hours)SDRAM - DDR31.425V~1.575V2Gb 128M x 16Volatile667MHz20nsDRAMParallelROHS3 Compliant----------------------
-
Surface Mount96-VFBGA-40°C~105°C TCTrayObsolete3 (168 Hours)SDRAM - DDR3L1.283V~1.45V2Gb 128M x 16Volatile667MHz20nsDRAMParallelROHS3 CompliantYES96EAR99AUTO/SELF REFRESHBOTTOM-11.35V0.8mm-R-PBGA-B961.45V1.283V1SYNCHRONOUS128MX16162147483648 bit13mm1mm7.5mm15ns
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