W632GG8MB-12

Winbond Electronics W632GG8MB-12

Part Number:
W632GG8MB-12
Manufacturer:
Winbond Electronics
Ventron No:
7370723-W632GG8MB-12
Description:
Memory IC 10.5mm mm
ECAD Model:
Datasheet:
W632GG8MB-12

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Winbond Electronics W632GG8MB-12 technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W632GG8MB-12.
  • Factory Lead Time
    14 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    78-VFBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~95°C TC
  • Packaging
    Tray
  • Published
    2017
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    78
  • ECCN Code
    EAR99
  • Additional Feature
    AUTO/SELF REFRESH
  • Technology
    SDRAM - DDR3
  • Voltage - Supply
    1.425V~1.575V
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Supply Voltage
    1.5V
  • Terminal Pitch
    0.8mm
  • JESD-30 Code
    R-PBGA-B78
  • Supply Voltage-Max (Vsup)
    1.575V
  • Supply Voltage-Min (Vsup)
    1.425V
  • Memory Size
    2Gb 128M x 16
  • Number of Ports
    1
  • Memory Type
    Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    800MHz
  • Access Time
    20ns
  • Memory Format
    DRAM
  • Memory Interface
    Parallel
  • Organization
    256MX8
  • Memory Width
    8
  • Memory Density
    2147483648 bit
  • Length
    10.5mm
  • Height Seated (Max)
    1mm
  • Width
    8mm
  • RoHS Status
    ROHS3 Compliant
Description
W632GG8MB-12 Overview
A Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. Embedded in the 78-VFBGA case, memory ics is a single file. On the chip, there is an 2Gb 128M x 16 memory, which is the size of the chip's memory. There is a DRAM-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of 0°C~95°C TC, this device allows it to be used in a variety of demanding applications. The device is capable of handling a supply voltage of 1.425V~1.575V volts. The recommended mounting type for memory ics is Surface Mount. A total of 78 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 1.5V will be necessary. A clock frequency rotation within 800MHz is used for the ic memory chip to rotate data. This chip features all the merits of a conventional chip, but it also features AUTO/SELF REFRESH to improve system performance. 1 ports allow read/write access to one memory address in this chip.

W632GG8MB-12 Features
Package / Case: 78-VFBGA
Additional Feature:AUTO/SELF REFRESH


W632GG8MB-12 Applications
There are a lot of Winbond Electronics
W632GG8MB-12 Memory applications.


supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
W632GG8MB-12 More Descriptions
DRAM Chip DDR3 SDRAM 2Gbit 256Mx8 1.5V Automotive 78-Pin VFBGA
IC DRAM 2GBIT PARALLEL 78VFBGA
Product Comparison
The three parts on the right have similar specifications to W632GG8MB-12.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Additional Feature
    Technology
    Voltage - Supply
    Terminal Position
    Number of Functions
    Supply Voltage
    Terminal Pitch
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Number of Ports
    Memory Type
    Operating Mode
    Clock Frequency
    Access Time
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Memory Density
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Write Cycle Time - Word, Page
    View Compare
  • W632GG8MB-12
    W632GG8MB-12
    14 Weeks
    Surface Mount
    78-VFBGA
    YES
    0°C~95°C TC
    Tray
    2017
    Obsolete
    3 (168 Hours)
    78
    EAR99
    AUTO/SELF REFRESH
    SDRAM - DDR3
    1.425V~1.575V
    BOTTOM
    1
    1.5V
    0.8mm
    R-PBGA-B78
    1.575V
    1.425V
    2Gb 128M x 16
    1
    Volatile
    SYNCHRONOUS
    800MHz
    20ns
    DRAM
    Parallel
    256MX8
    8
    2147483648 bit
    10.5mm
    1mm
    8mm
    ROHS3 Compliant
    -
    -
  • W632GG6AB-15
    -
    -
    -
    -
    0°C~95°C TC
    Tray
    -
    Discontinued
    3 (168 Hours)
    -
    -
    -
    SDRAM - DDR3
    1.425V~1.575V
    -
    -
    -
    -
    -
    -
    -
    2Gb 128M x 16
    -
    Volatile
    -
    667MHz
    20ns
    DRAM
    Parallel
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
  • W632GU6MB15J
    -
    Surface Mount
    96-VFBGA
    YES
    -40°C~105°C TC
    Tray
    -
    Obsolete
    3 (168 Hours)
    96
    EAR99
    AUTO/SELF REFRESH
    SDRAM - DDR3L
    1.283V~1.45V
    BOTTOM
    1
    1.35V
    0.8mm
    R-PBGA-B96
    1.45V
    1.283V
    2Gb 128M x 16
    1
    Volatile
    SYNCHRONOUS
    667MHz
    20ns
    DRAM
    Parallel
    128MX16
    16
    2147483648 bit
    13mm
    1mm
    7.5mm
    ROHS3 Compliant
    15ns
  • W632GU6MB-09
    -
    Surface Mount
    96-VFBGA
    YES
    0°C~95°C TC
    Tray
    -
    Obsolete
    3 (168 Hours)
    96
    EAR99
    AUTO/SELF REFRESH
    SDRAM - DDR3L
    1.283V~1.45V
    BOTTOM
    1
    1.35V
    0.8mm
    R-PBGA-B96
    1.45V
    1.283V
    2Gb 128M x 16
    1
    Volatile
    SYNCHRONOUS
    1.067GHz
    20ns
    DRAM
    Parallel
    128MX16
    16
    2147483648 bit
    13mm
    1mm
    7.5mm
    ROHS3 Compliant
    15ns
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • 16 October 2023

    What Is H1102N Pulse Ethernet Transformer?

    Ⅰ. What is a transformer?Ⅱ. Overview of H1102NLⅢ. Pin configuration, symbol and footprint of H1102NLⅣ. Technical parameters of H1102NLⅤ. Features of H1102NLⅥ. Working principle of H1102NLⅦ. Dimensions and...
  • 16 October 2023

    BD139 Transistor Equivalent, Technical Parameters and Applications

    Ⅰ. Overview of BD139Ⅱ. BD139 symbol, footprint and pin configurationⅢ. Technical parameters of BD139Ⅳ. Features of BD139Ⅴ. Working principle of BD139 transistorⅥ. Circuit of BD139 transistor power amplifierⅦ....
  • 17 October 2023

    IRFP250 Transistor Equivalent, Pin Configuration, Working Principle and More

    Ⅰ. Overview of IRFP250Ⅱ. Symbol, footprint and pin configuration of IRFP250Ⅲ. Technical parameters of IRFP250Ⅳ. What are the features of IRFP250?Ⅴ. Working principle of IRFP250Ⅵ. Applications of IRFP250Ⅶ....
  • 17 October 2023

    A Review of TDA2009A Dual Audio Power Amplifier

    Ⅰ. What is TDA2009A?Ⅱ. Symbol, footprint and pin configuration of TDA2009AⅢ. Technical parameters of TDA2009AⅣ. What are the features of TDA2009A?Ⅴ. How does the overheating protection circuit of...
  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.