Winbond Electronics W632GG6AB-12
- Part Number:
- W632GG6AB-12
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 7096518-W632GG6AB-12
- Description:
- Memory IC
- Datasheet:
- W632GG6AB-12
Winbond Electronics W632GG6AB-12 technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W632GG6AB-12.
- Operating Temperature0°C~95°C TC
- PackagingTray
- Part StatusDiscontinued
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - DDR3
- Voltage - Supply1.425V~1.575V
- Memory Size2Gb 128M x 16
- Memory TypeVolatile
- Clock Frequency800MHz
- Access Time20ns
- Memory FormatDRAM
- Memory InterfaceParallel
- RoHS StatusROHS3 Compliant
W632GG6AB-12 Overview
A Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. On the chip, there is an 2Gb 128M x 16 memory, which is the size of the chip's memory. There is a DRAM-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of 0°C~95°C TC, this device allows it to be used in a variety of demanding applications. The device is capable of handling a supply voltage of 1.425V~1.575V volts. A clock frequency rotation within 800MHz is used for the ic memory chip to rotate data.
W632GG6AB-12 Features
This product is manufactured by Winbond Electronics, belongs to the Memory category. Its operating temperature range is between 0°C and 95°C TC. The product comes in a tray packaging, and it is currently classified as discontinued. It utilizes SDRAM - DDR3 technology for enhanced performance. The memory size stands at 2Gb 128M x 16, ensuring ample storage capacity. The memory type is volatile, which means it requires constant refreshing. The clock frequency is set at 800MHz, providing a smooth and efficient operation. The access time stands at 20ns, guaranteeing quick data retrieval. The memory format is DRAM, making it compatible with various systems and devices. Additionally, this product meets the ROHS3 compliance, ensuring minimal environmental impact.
W632GG6AB-12 Applications
There are a lot of Winbond Electronics
W632GG6AB-12 Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
A Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. On the chip, there is an 2Gb 128M x 16 memory, which is the size of the chip's memory. There is a DRAM-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of 0°C~95°C TC, this device allows it to be used in a variety of demanding applications. The device is capable of handling a supply voltage of 1.425V~1.575V volts. A clock frequency rotation within 800MHz is used for the ic memory chip to rotate data.
W632GG6AB-12 Features
This product is manufactured by Winbond Electronics, belongs to the Memory category. Its operating temperature range is between 0°C and 95°C TC. The product comes in a tray packaging, and it is currently classified as discontinued. It utilizes SDRAM - DDR3 technology for enhanced performance. The memory size stands at 2Gb 128M x 16, ensuring ample storage capacity. The memory type is volatile, which means it requires constant refreshing. The clock frequency is set at 800MHz, providing a smooth and efficient operation. The access time stands at 20ns, guaranteeing quick data retrieval. The memory format is DRAM, making it compatible with various systems and devices. Additionally, this product meets the ROHS3 compliance, ensuring minimal environmental impact.
W632GG6AB-12 Applications
There are a lot of Winbond Electronics
W632GG6AB-12 Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
W632GG6AB-12 More Descriptions
IC DRAM 2GBIT PARALLEL 800MHZ
The three parts on the right have similar specifications to W632GG6AB-12.
-
ImagePart NumberManufacturerOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyAccess TimeMemory FormatMemory InterfaceRoHS StatusMounting TypePackage / CaseSurface MountNumber of TerminationsECCN CodeAdditional FeatureTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of PortsOperating ModeOrganizationMemory WidthWrite Cycle Time - Word, PageMemory DensityHeight Seated (Max)LengthWidthView Compare
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W632GG6AB-120°C~95°C TCTrayDiscontinued3 (168 Hours)SDRAM - DDR31.425V~1.575V2Gb 128M x 16Volatile800MHz20nsDRAMParallelROHS3 Compliant-----------------------
-
-40°C~95°C TCTape & Reel (TR)Obsolete3 (168 Hours)SDRAM - DDR31.425V~1.575V2Gb 128M x 16Volatile800MHz20nsDRAMParallelROHS3 CompliantSurface Mount78-VFBGA--------------------
-
-40°C~105°C TCTrayObsolete3 (168 Hours)SDRAM - DDR3L1.283V~1.45V2Gb 256M x 8Volatile800MHz20nsDRAMParallelROHS3 CompliantSurface Mount78-VFBGAYES78EAR99AUTO/SELF REFRESHBOTTOM11.35V0.8mmR-PBGA-B781.45V1.283V1SYNCHRONOUS256MX8815ns2147483648 bit1mm10.5mm8mm
-
0°C~95°C TCTrayObsolete3 (168 Hours)SDRAM - DDR3L1.283V~1.45V2Gb 128M x 16Volatile1.067GHz20nsDRAMParallelROHS3 CompliantSurface Mount96-VFBGAYES96EAR99AUTO/SELF REFRESHBOTTOM11.35V0.8mmR-PBGA-B961.45V1.283V1SYNCHRONOUS128MX161615ns2147483648 bit1mm13mm7.5mm
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