Macronix MX25L6433FXCI-08G
- Part Number:
- MX25L6433FXCI-08G
- Manufacturer:
- Macronix
- Ventron No:
- 7372749-MX25L6433FXCI-08G
- Description:
- MXSMIO™ Memory IC MXSMIO™ Series 8mm mm
- Datasheet:
- MX25L6433FXCI-08G
Macronix MX25L6433FXCI-08G technical specifications, attributes, parameters and parts with similar specifications to Macronix MX25L6433FXCI-08G.
- Factory Lead Time10 Weeks
- Mounting TypeSurface Mount
- Package / Case24-TBGA, CSPBGA
- Surface MountYES
- Operating Temperature-40°C~85°C TA
- PackagingTray
- SeriesMXSMIO™
- Published2017
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations24
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- Additional FeatureALSO IT CAN BE CONFIGURED AS 64M X 1 BIT
- TechnologyFLASH - NOR
- Voltage - Supply2.65V~3.6V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch1mm
- Time@Peak Reflow Temperature-Max (s)40
- JESD-30 CodeR-PBGA-B24
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)2.65V
- Memory Size64Mb 8M x 8
- Memory TypeNon-Volatile
- Operating ModeSYNCHRONOUS
- Clock Frequency133MHz
- Memory FormatFLASH
- Memory InterfaceSPI - Quad I/O
- Organization16MX4
- Memory Width4
- Write Cycle Time - Word, Page50μs, 1.2ms
- Memory Density67108864 bit
- Parallel/SerialSERIAL
- Programming Voltage3V
- Alternate Memory Width2
- Length8mm
- Height Seated (Max)1.2mm
- Width6mm
- RoHS StatusRoHS Compliant
MX25L6433FXCI-08G Overview
A Non-Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. Embedded in the 24-TBGA, CSPBGA case, memory ics is a single file. On the chip, there is an 64Mb 8M x 8 memory, which is the size of the chip's memory. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of -40°C~85°C TA, this device allows it to be used in a variety of demanding applications. The device is capable of handling a supply voltage of 2.65V~3.6V volts. The recommended mounting type for memory ics is Surface Mount. A total of 24 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 3V will be necessary. A clock frequency rotation within 133MHz is used for the ic memory chip to rotate data. This chip features all the merits of a conventional chip, but it also features ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT to improve system performance. It is an important component of the MXSMIO™ series memory devices used in a variety of applications. A programming voltage of 3V is required to change a nonvolatile memory array's state.
MX25L6433FXCI-08G Features
Package / Case: 24-TBGA, CSPBGA
Additional Feature:ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT
MX25L6433FXCI-08G Applications
There are a lot of Macronix
MX25L6433FXCI-08G Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
A Non-Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. Embedded in the 24-TBGA, CSPBGA case, memory ics is a single file. On the chip, there is an 64Mb 8M x 8 memory, which is the size of the chip's memory. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of -40°C~85°C TA, this device allows it to be used in a variety of demanding applications. The device is capable of handling a supply voltage of 2.65V~3.6V volts. The recommended mounting type for memory ics is Surface Mount. A total of 24 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 3V will be necessary. A clock frequency rotation within 133MHz is used for the ic memory chip to rotate data. This chip features all the merits of a conventional chip, but it also features ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT to improve system performance. It is an important component of the MXSMIO™ series memory devices used in a variety of applications. A programming voltage of 3V is required to change a nonvolatile memory array's state.
MX25L6433FXCI-08G Features
Package / Case: 24-TBGA, CSPBGA
Additional Feature:ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT
MX25L6433FXCI-08G Applications
There are a lot of Macronix
MX25L6433FXCI-08G Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
MX25L6433FXCI-08G More Descriptions
IC FLASH 64MBIT SPI 24CSPBGA
Flash, 16MX4, PBGA24
CMOS MXSMIO (Serial Multi I/O) Flash Memory 64Mb Capacity 64M x 1/32M x 2/16M x 4 Organization 133MHz Speed 3V Supply Voltage Surface Mount 24-Ball TFBGA Tray
Flash, 16MX4, PBGA24
CMOS MXSMIO (Serial Multi I/O) Flash Memory 64Mb Capacity 64M x 1/32M x 2/16M x 4 Organization 133MHz Speed 3V Supply Voltage Surface Mount 24-Ball TFBGA Tray
The three parts on the right have similar specifications to MX25L6433FXCI-08G.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingSeriesPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishAdditional FeatureTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeMemory TypeOperating ModeClock FrequencyMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageMemory DensityParallel/SerialProgramming VoltageAlternate Memory WidthLengthHeight Seated (Max)WidthRoHS StatusNumber of PinsPin CountInterfaceECCN CodeHTS CodeQualification StatusOperating Supply VoltagePower SuppliesSupply Current-MaxDensityStandby Current-MaxSerial Bus TypeEnduranceData Retention Time-MinWrite ProtectionLead FreePbfree CodeReflow Temperature-Max (s)View Compare
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MX25L6433FXCI-08G10 WeeksSurface Mount24-TBGA, CSPBGAYES-40°C~85°C TATrayMXSMIO™2017e1Active3 (168 Hours)24Tin/Silver/Copper (Sn/Ag/Cu)ALSO IT CAN BE CONFIGURED AS 64M X 1 BITFLASH - NOR2.65V~3.6VBOTTOM26013V1mm40R-PBGA-B243.6V2.65V64Mb 8M x 8Non-VolatileSYNCHRONOUS133MHzFLASHSPI - Quad I/O16MX4450μs, 1.2ms67108864 bitSERIAL3V28mm1.2mm6mmRoHS Compliant-------------------
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16 WeeksSurface Mount16-SOIC (0.295, 7.50mm Width)YES-40°C~85°C TATubeMX25xxx35/36 - MXSMIO™-e3Active3 (168 Hours)16MATTE TIN (800)CAN BE ORGNISED AS 128 MBIT X 1FLASH - NOR2.7V~3.6VDUAL26013V1.27mm40-3.6V2.7V128Mb 16M x 8Non-VolatileSYNCHRONOUS104MHzFLASHSPI32MX4430μs, 1.5ms134217728 bit-3V210.3mm2.65mm7.52mmROHS3 Compliant1616SPI, Serial---------------
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10 WeeksSurface Mount8-WDFN Exposed PadYES-40°C~85°C TATrayMX25xxx05/062010-Active3 (168 Hours)8--FLASH - NOR2.7V~3.6VDUALNOT SPECIFIED13V1.27mmNOT SPECIFIEDR-PDSO-N8-2.7V2Mb 256K x 8Non-VolatileSYNCHRONOUS86MHzFLASHSPI1MX2250μs, 3ms--2.7V16mm0.8mm5mmROHS3 Compliant-8SPI, SerialEAR998542.32.00.51Not Qualified3.6V3/3.3V0.02mA2 Mb0.00001ASPI100000 Write/Erase Cycles20HARDWARE/SOFTWARELead Free--
-
16 WeeksSurface Mount8-SOIC (0.209, 5.30mm Width)YES-40°C~85°C TATubeMX25xxx05/062016e3Not For New Designs3 (168 Hours)8Matte Tin (Sn) - annealed-FLASH - NOR2.7V~3.6VDUALNOT SPECIFIED13V1.27mm-R-PDSO-G8-2.7V16Mb 2M x 8Non-VolatileSYNCHRONOUS86MHzFLASHSPI8MX2250μs, 3ms--2.7V15.28mm2.16mm5.23mmROHS3 Compliant-8SPI, SerialEAR998542.32.00.51Not Qualified3.6V3/3.3V0.025mA16 Mb0.00002ASPI100000 Write/Erase Cycles-HARDWARE/SOFTWARELead FreeyesNOT SPECIFIED
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