Micron Technology Inc. MT53E128M32D2DS-046 AIT:A
- Part Number:
- MT53E128M32D2DS-046 AIT:A
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 7374590-MT53E128M32D2DS-046 AIT:A
- Description:
- Memory IC
- Datasheet:
- MT53E128M32D2DS-046 AIT:A
Micron Technology Inc. MT53E128M32D2DS-046 AIT:A technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT53E128M32D2DS-046 AIT:A.
- Mounting TypeSurface Mount
- Package / Case200-WFBGA
- Operating Temperature-40°C~95°C
- PackagingTray
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - Mobile LPDDR4
- Voltage - Supply0.6V 1.1V
- Memory Size4Gb 128M x 32
- Memory TypeVolatile
- Clock Frequency2.133GHz
- Memory FormatDRAM
- RoHS StatusROHS3 Compliant
MT53E128M32D2DS-046 AIT:A Overview
Volatile is the type of memory it has. There is a Tray case available. The 200-WFBGA case contains it. The chip has an 4Gb 128M x 32 memory. This device uses a DRAM-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 0.6V 1.1V can be supplied to memory ics. Its recommended mounting type is Surface Mount. It is important to note that the memory has a clock frequency rotation within the range of 2.133GHz.
MT53E128M32D2DS-046 AIT:A Features
Package / Case: 200-WFBGA
MT53E128M32D2DS-046 AIT:A Applications
There are a lot of Micron Technology Inc.
MT53E128M32D2DS-046 AIT:A Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
Volatile is the type of memory it has. There is a Tray case available. The 200-WFBGA case contains it. The chip has an 4Gb 128M x 32 memory. This device uses a DRAM-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 0.6V 1.1V can be supplied to memory ics. Its recommended mounting type is Surface Mount. It is important to note that the memory has a clock frequency rotation within the range of 2.133GHz.
MT53E128M32D2DS-046 AIT:A Features
Package / Case: 200-WFBGA
MT53E128M32D2DS-046 AIT:A Applications
There are a lot of Micron Technology Inc.
MT53E128M32D2DS-046 AIT:A Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
MT53E128M32D2DS-046 AIT:A More Descriptions
Active Volatile ROHS3Compliant DRAM ic memory -40C~95C 0.6V 1.1V 4Gb 128M x 32 2.133GHz
LPDDR4 DRAM, 128MX32, CMOS, PBGA200
DRAM LPDDR4 4G 128MX32 FBGA AIT DDP
IC DRAM 4GBIT 2.133GHZ 200WFBGA
Dram, 128M X 32Bit, -40 To 95Deg C; Dram Type:Mobile Lpddr4; Memory Configuration:128M X 32Bit; Clock Frequency Max:2.133Ghz; Ic Case/Package:Wfbga; No. Of Pins:200Pins; Supply Voltage Nom:1.1V; Ic Mounting:Surface Mount Rohs Compliant: Yes |Micron MT53E128M32D2DS-046 AIT:A
LPDDR4 DRAM, 128MX32, CMOS, PBGA200
DRAM LPDDR4 4G 128MX32 FBGA AIT DDP
IC DRAM 4GBIT 2.133GHZ 200WFBGA
Dram, 128M X 32Bit, -40 To 95Deg C; Dram Type:Mobile Lpddr4; Memory Configuration:128M X 32Bit; Clock Frequency Max:2.133Ghz; Ic Case/Package:Wfbga; No. Of Pins:200Pins; Supply Voltage Nom:1.1V; Ic Mounting:Surface Mount Rohs Compliant: Yes |Micron MT53E128M32D2DS-046 AIT:A
The three parts on the right have similar specifications to MT53E128M32D2DS-046 AIT:A.
-
ImagePart NumberManufacturerMounting TypePackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatRoHS StatusFactory Lead TimeSupplier Device PackageView Compare
-
MT53E128M32D2DS-046 AIT:ASurface Mount200-WFBGA-40°C~95°CTrayActive3 (168 Hours)SDRAM - Mobile LPDDR40.6V 1.1V4Gb 128M x 32Volatile2.133GHzDRAMROHS3 Compliant---
-
Surface Mount200-WFBGA-40°C~125°C TATape & Reel (TR)Obsolete3 (168 Hours)SDRAM - Mobile LPDDR41.1V8Gb 256M x 32Volatile1.6GHzDRAMROHS3 Compliant6 Weeks200-WFBGA (10x14.5)
-
Surface Mount200-WFBGA-40°C~95°C TCTrayActive-SDRAM - Mobile LPDDR41.1V8Gb 256M x 32Volatile1600MHzDRAM-13 Weeks-
-
Surface Mount200-WFBGA-30°C~85°C TCTape & Reel (TR)Active3 (168 Hours)SDRAM - Mobile LPDDR41.1V16Gb 512M x 32Volatile1866MHzDRAMROHS3 Compliant--
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