Micron Technology Inc. MT53D768M32D2DS-046 WT:A
- Part Number:
- MT53D768M32D2DS-046 WT:A
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 7373998-MT53D768M32D2DS-046 WT:A
- Description:
- Memory IC
- Datasheet:
- MT53D768M32D2DS-046 WT:A
Micron Technology Inc. MT53D768M32D2DS-046 WT:A technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT53D768M32D2DS-046 WT:A.
- PackagingTray
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- RoHS StatusROHS3 Compliant
MT53D768M32D2DS-046 WT:A Overview
It comes in a Tray.
MT53D768M32D2DS-046 WT:A Features
MT53D768M32D2DS-046 WT:A Applications
There are a lot of Micron Technology Inc.
MT53D768M32D2DS-046 WT:A Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
It comes in a Tray.
MT53D768M32D2DS-046 WT:A Features
MT53D768M32D2DS-046 WT:A Applications
There are a lot of Micron Technology Inc.
MT53D768M32D2DS-046 WT:A Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
MT53D768M32D2DS-046 WT:A More Descriptions
IC EEPROM 8K I2C VSON008X2030
DRAM LPDDR4 24G 768MX32 FBGA DDP
IC DRAM 24GBIT 2.133GHZ WFBGA
IC DRAM LPDDR4 WFBGA
DRAM LPDDR4 24G 768MX32 FBGA DDP
IC DRAM 24GBIT 2.133GHZ WFBGA
IC DRAM LPDDR4 WFBGA
The three parts on the right have similar specifications to MT53D768M32D2DS-046 WT:A.
-
ImagePart NumberManufacturerPackagingPart StatusMoisture Sensitivity Level (MSL)RoHS StatusMounting TypePackage / CaseOperating TemperatureTechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatFactory Lead TimeSeriesView Compare
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MT53D768M32D2DS-046 WT:ATrayActive3 (168 Hours)ROHS3 Compliant------------
-
Tape & Reel (TR)Not For New Designs3 (168 Hours)ROHS3 CompliantSurface Mount200-VFBGA-30°C~85°C TCSDRAM - Mobile LPDDR41.1V24Gb 768M x 32Volatile1600MHzDRAM--
-
Tape & Reel (TR)Not For New Designs3 (168 Hours)ROHS3 CompliantSurface Mount200-WFBGA-40°C~105°C TASDRAM - Mobile LPDDR40.6V 1.1V16Gb 512M x 32Volatile1.6GHzDRAM6 WeeksAutomotive, AEC-Q100
-
TrayActive-----30°C~105°C TCSDRAM - Mobile LPDDR41.1V16Gb 256M x 64Volatile1600MHzDRAM9 Weeks-
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