Micron Technology Inc. MT29F256G08EBHBFJ4-3ITF:B
- Part Number:
- MT29F256G08EBHBFJ4-3ITF:B
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 7374473-MT29F256G08EBHBFJ4-3ITF:B
- Description:
- Memory IC
- Datasheet:
- MT29F256G08EBHBFJ4-3ITF:B
Micron Technology Inc. MT29F256G08EBHBFJ4-3ITF:B technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT29F256G08EBHBFJ4-3ITF:B.
- Factory Lead Time3 Weeks
- PackagingBulk
- Part StatusActive
MT29F256G08EBHBFJ4-3ITF:B Overview
In addition, memory ics is available in a Bulk case as well.
MT29F256G08EBHBFJ4-3ITF:B Features
MT29F256G08EBHBFJ4-3ITF:B Applications
There are a lot of Micron Technology Inc.
MT29F256G08EBHBFJ4-3ITF:B Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
In addition, memory ics is available in a Bulk case as well.
MT29F256G08EBHBFJ4-3ITF:B Features
MT29F256G08EBHBFJ4-3ITF:B Applications
There are a lot of Micron Technology Inc.
MT29F256G08EBHBFJ4-3ITF:B Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
MT29F256G08EBHBFJ4-3ITF:B More Descriptions
IC FLASH 256GBIT PAR 132VBGA
Supply Voltage Nom:3.3V; Ic Mounting:Surface Mount Rohs Compliant: Yes |Micron MT29F256G08EBHBFJ4-3ITF:B
IC DRAM 256M PARALLEL 66TSOP
TLC 256G 32GX8 VBGA
Supply Voltage Nom:3.3V; Ic Mounting:Surface Mount Rohs Compliant: Yes |Micron MT29F256G08EBHBFJ4-3ITF:B
IC DRAM 256M PARALLEL 66TSOP
TLC 256G 32GX8 VBGA
The three parts on the right have similar specifications to MT29F256G08EBHBFJ4-3ITF:B.
-
ImagePart NumberManufacturerFactory Lead TimePackagingPart StatusMounting TypePackage / CaseOperating TemperatureSeriesMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatMemory InterfaceRoHS StatusSurface MountNumber of TerminationsAdditional FeatureTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Operating ModeOrganizationMemory WidthMemory DensityHeight Seated (Max)LengthWidthView Compare
-
MT29F256G08EBHBFJ4-3ITF:B3 WeeksBulkActive----------------------------------
-
-Tape & Reel (TR)Last Time BuySurface Mount162-VFBGA-40°C~105°C TAAutomotive, AEC-Q1003 (168 Hours)FLASH - NAND, Mobile LPDRAM1.7V~1.9V4Gb 512M x 8 N 8Gb 512M x 16 LPDDR2Non-Volatile533MHzFLASH, RAMParallelROHS3 Compliant--------------------
-
16 WeeksTrayActiveSurface Mount130-VFBGA-40°C~85°C TA--FLASH - NAND, Mobile LPDRAM1.7V~1.95V1Gb 128M x 8 N 512M 16M x 32 LPDRAMNon-Volatile200MHzFLASH, RAMParallelRoHS CompliantYES130LPDRAM IS ORGANISED AS 32M X 16BOTTOMNOT SPECIFIED11.8V0.65mmcompliantNOT SPECIFIEDR-PBGA-B1301.95V1.7VSYNCHRONOUS128MX881073741824 bit1mm9mm8mm
-
-TrayLast Time BuySurface Mount162-VFBGA-40°C~85°C TA-3 (168 Hours)FLASH - NAND, Mobile LPDRAM1.7V~1.9V4Gb 512M x 8 N 2Gb 128M x 16 LPDDR2Non-Volatile533MHzFLASH, RAMParallel---------------------
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
29 March 2024
TLP2362 Optocoupler Characteristics, Specifications, Working Principle and More
Ⅰ. Overview of TLP2362Ⅱ. Characteristics of TLP2362Ⅲ. Specifications of TLP2362Ⅳ. Recommended operating conditions of TLP2362Ⅴ. How does TLP2362 work?Ⅵ. Internal equivalent circuit of TLP2362Ⅶ. Storage and soldering of... -
29 March 2024
STM32H743VIT6 Specifications, Characteristics, Pinout and Market Situation
Ⅰ. Description of STM32H743VIT6Ⅱ. Specifications of STM32H743VIT6Ⅲ. Characteristics of STM32H743VIT6Ⅳ. How to use STM32H743VIT6?Ⅴ. STM32H743VIT6 pinoutⅥ. Low-power strategy of STM32H743VIT6Ⅶ. Market situation of STM32H743VIT6Ⅰ. Description of STM32H743VIT6The STM32H743VIT6... -
01 April 2024
XCF32PFSG48C Symbol, Manufacturer, Specifications and Programming
Ⅰ. Overview of XCF32PFSG48CⅡ. Symbol, footprint and 3D model of XCF32PFSG48CⅢ. Manufacturer of XCF32PFSG48CⅣ. Reset and power-on reset activationⅤ. Specifications of XCF32PFSG48CⅥ. Programming of XCF32PFSG48CⅦ. In which emerging... -
01 April 2024
M24C16-RMN6TP Structure, Advantages, Package and Other Details
Ⅰ. M24C16-RMN6TP descriptionⅡ. Basic structure and working principle of M24C16-RMN6TPⅢ. Technical parameters of M24C16-RMN6TPⅣ. What are the market competitive advantages of M24C16-RMN6TP?Ⅴ. Package of M24C16-RMN6TPⅥ. Data transmission process...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.