ON Semiconductor CY62126DV30L-55BVXE
- Part Number:
- CY62126DV30L-55BVXE
- Manufacturer:
- ON Semiconductor
- Ventron No:
- 7372818-CY62126DV30L-55BVXE
- Description:
- MoBL® 48 Pin Memory IC MoBL® Series 8mm mm
- ECAD Model:
-
- Datasheet:
- CY62126DV30 MoBL
ON Semiconductor CY62126DV30L-55BVXE technical specifications, attributes, parameters and parts with similar specifications to ON Semiconductor CY62126DV30L-55BVXE.
- Mounting TypeSurface Mount
- Package / Case48-VFBGA
- Surface MountYES
- Operating Temperature-40°C~125°C TA
- PackagingTray
- SeriesMoBL®
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations48
- Terminal FinishTIN SILVER COPPER
- TechnologySRAM - Asynchronous
- Voltage - Supply2.2V~3.6V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch0.75mm
- Reach Compliance Codeunknown
- Time@Peak Reflow Temperature-Max (s)20
- Pin Count48
- JESD-30 CodeR-PBGA-B48
- Qualification StatusCOMMERCIAL
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)2.2V
- Memory Size1Mb 64K x 16
- Memory TypeVolatile
- Memory FormatSRAM
- Memory InterfaceParallel
- Organization64KX16
- Memory Width16
- Write Cycle Time - Word, Page55ns
- Memory Density1048576 bit
- Access Time (Max)55 ns
- Length8mm
- Height Seated (Max)1mm
- Width6mm
- RoHS StatusROHS3 Compliant
CY62126DV30L-55BVXE Overview
Its memory type can be classified as Volatile. It comes in a Tray. It is available in 48-VFBGA case. The memory size of the chip is 1Mb 64K x 16 Mb. This device utilizes a SRAM format memory which is of mainstream design. With an extended designed operating temperature of -40°C~125°C TA, this device is capable of lots of demanding applications. It is supplied votage within 2.2V~3.6V. Its recommended mounting type is Surface Mount. 48 terminations are planted on the chip. This part supports as many as 1 functions for the comprehensive working procedure. This ic memory chip is designed to be supplied with 3V. This memory device has 48 pins, indicating it has 48 memory locations. As a member of the MoBL® series memory devices, this part plays an important role for its target applications.
CY62126DV30L-55BVXE Features
Package / Case: 48-VFBGA
CY62126DV30L-55BVXE Applications
There are a lot of Rochester Electronics, LLC
CY62126DV30L-55BVXE Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
Its memory type can be classified as Volatile. It comes in a Tray. It is available in 48-VFBGA case. The memory size of the chip is 1Mb 64K x 16 Mb. This device utilizes a SRAM format memory which is of mainstream design. With an extended designed operating temperature of -40°C~125°C TA, this device is capable of lots of demanding applications. It is supplied votage within 2.2V~3.6V. Its recommended mounting type is Surface Mount. 48 terminations are planted on the chip. This part supports as many as 1 functions for the comprehensive working procedure. This ic memory chip is designed to be supplied with 3V. This memory device has 48 pins, indicating it has 48 memory locations. As a member of the MoBL® series memory devices, this part plays an important role for its target applications.
CY62126DV30L-55BVXE Features
Package / Case: 48-VFBGA
CY62126DV30L-55BVXE Applications
There are a lot of Rochester Electronics, LLC
CY62126DV30L-55BVXE Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
CY62126DV30L-55BVXE More Descriptions
Obsolete 3-STATE 2006 BOTTOM SRAM Memory -40C~125C TA 2.2V 1Mb 64K x 16 0.00001A
SRAM Chip Async Single 2.5V/3.3V 1M-Bit 64K x 16 55ns 48-Pin VFBGA
64K X 16 STANDARD SRAM 55 ns PBGA48
IC SRAM 1MBIT PARALLEL 48VFBGA
SRAM Chip Async Single 2.5V/3.3V 1M-Bit 64K x 16 55ns 48-Pin VFBGA
64K X 16 STANDARD SRAM 55 ns PBGA48
IC SRAM 1MBIT PARALLEL 48VFBGA
The three parts on the right have similar specifications to CY62126DV30L-55BVXE.
-
ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountOperating TemperaturePackagingSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeTime@Peak Reflow Temperature-Max (s)Pin CountJESD-30 CodeQualification StatusSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeMemory TypeMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageMemory DensityAccess Time (Max)LengthHeight Seated (Max)WidthRoHS StatusFactory Lead TimeSupplier Device PackageAccess TimeView Compare
-
CY62126DV30L-55BVXESurface Mount48-VFBGAYES-40°C~125°C TATrayMoBL®e1yesObsolete3 (168 Hours)48TIN SILVER COPPERSRAM - Asynchronous2.2V~3.6VBOTTOM26013V0.75mmunknown2048R-PBGA-B48COMMERCIAL3.6V2.2V1Mb 64K x 16VolatileSRAMParallel64KX161655ns1048576 bit55 ns8mm1mm6mmROHS3 Compliant---- -
Surface Mount44-TSOP (0.400, 10.16mm Width)--40°C~85°C TATape & Reel (TR)MoBL®--Active3 (168 Hours)--SRAM - Asynchronous2.2V~3.6V------------4Mb 256K x 16VolatileSRAMParallel--45ns-----ROHS3 Compliant13 Weeks--
-
Surface Mount48-VFBGA--40°C~125°C TATrayMoBL®--Obsolete3 (168 Hours)--SRAM - Asynchronous2.7V~3.3V------------2Mb 128K x 16VolatileSRAMParallel--70ns-----ROHS3 Compliant-48-VFBGA (6x8)70ns
-
Surface Mount32-TFSOP (0.724, 18.40mm Width)YES-40°C~125°C TATubeMoBL®e3/e4yesObsolete3 (168 Hours)32MATTE TIN/NICKEL PALLADIUM GOLDSRAM - Asynchronous4.5V~5.5VDUAL26015V0.5mmunknown2032R-PDSO-G32COMMERCIAL5.5V4.5V1Mb 128K x 8VolatileSRAMParallel128KX8870ns1048576 bit70 ns18.4mm1.2mm8mmROHS3 Compliant---
-
Surface Mount MoBL® 32 Pin Memory IC MoBL® Series CY62128 1 Mb kb 20.4465mm mm 35mA mA 8b b
-
-
-
-
-
-
-
-
-
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
08 December 2023
NE556 Dual Bipolar Timer Features, Function, Structure, Working Principle, and Applications
Ⅰ. What is a timer?Ⅱ. Overview of NE556Ⅲ. What are the features of NE556 dual timer?Ⅳ. Pin configuration of NE556 dual timerⅤ. Function of NE556 dual timerⅥ. Structure... -
08 December 2023
AT89C51 Microcontroller Structure, Features, Function, AT89C51 vs AT89C52 and Applications
Ⅰ. What is AT89C51?Ⅱ. Pin configuration of AT89C51 microcontrollerⅢ. Structure of AT89C51 microcontrollerⅣ. What are the features of AT89C51 microcontroller?Ⅴ. Function of AT89C51 microcontrollerⅥ. Block diagram of AT89C51... -
11 December 2023
STM32F030F4P6 32-bit Microcontroller Features, Advantages and disadvantages, Dimension and Applications
Ⅰ. What is STM32F030F4P6?Ⅱ. Symbol, footprint and pin configuration of STM32F030F4P6 microcontrollerⅢ. What are the features of STM32F030F4P6 microcontroller?Ⅳ. Advantages and disadvantages of STM32F030F4P6 microcontrollerⅤ. Technical parameters of... -
11 December 2023
CR2032 vs CR2450: What is the Difference?
Ⅰ. What is a button battery?Ⅱ. CR2032 vs CR2450: OverviewⅢ. CR2032 vs CR2450: Symbol and footprintⅣ. CR2032 vs CR2450: FeaturesⅤ. CR2032 vs CR2450: Technical parametersⅥ. CR2450 vs CR2032:...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.