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ZL30316GKG

Microsemi Corporation ZL30316GKG

Part Number:
ZL30316GKG
Manufacturer:
Microsemi Corporation
Ventron No:
3623498-ZL30316GKG
Description:
IC TIMING-OVER-PACKET 256TEBGA-2
ECAD Model:
Datasheet:
ZL30316GKG

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Specifications
Microsemi Corporation ZL30316GKG technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation ZL30316GKG.
  • Voltage - Supply:
    -
  • Supplier Device Package:
    256-BGA (17x17)
  • Series:
    -
  • Ratio - Input:Output:
    11:8
  • Packaging:
    Tray
  • Package / Case:
    256-BGA
  • PLL:
    Yes
  • Output:
    Clock
  • Operating Temperature:
    -40°C ~ 85°C
  • Number of Circuits:
    1
  • Mounting Type:
    Surface Mount
  • Main Purpose:
    Ethernet
  • Input:
    Clock
  • Frequency - Max:
    125MHz
  • Differential - Input:Output:
    No/No
Description
Images are for reference only.See Product Specifications for product details.If you are interested to buy ZL30316GKG.
ZL30316GKG More Descriptions
Combined Synchronous Ethernet 256-Pin TEBGA
IC TIMING-OVER-PACKET 256TEBGA-2
Product Comparison
The three parts on the right have similar specifications to ZL30316GKG.
  • Image
    Part Number
    Manufacturer
    Voltage - Supply:
    Supplier Device Package:
    Series:
    Ratio - Input:Output:
    Packaging:
    Package / Case:
    PLL:
    Output:
    Operating Temperature:
    Number of Circuits:
    Mounting Type:
    Main Purpose:
    Input:
    Frequency - Max:
    Differential - Input:Output:
    Factory Lead Time
    Mounting Type
    Package / Case
    Supplier Device Package
    Operating Temperature
    Packaging
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Voltage - Supply
    Base Part Number
    Output
    Number of Circuits
    Frequency (Max)
    Input
    Ratio - Input:Output
    PLL
    Differential - Input:Output
    Main Purpose
    RoHS Status
    Mount
    Number of Pins
    Max Operating Temperature
    Min Operating Temperature
    Radiation Hardening
    View Compare
  • ZL30316GKG
    ZL30316GKG
    Microsemi Corporation
    -
    256-BGA (17x17)
    -
    11:8
    Tray
    256-BGA
    Yes
    Clock
    -40°C ~ 85°C
    1
    Surface Mount
    Ethernet
    Clock
    125MHz
    No/No
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • ZL30121GGG2V2
    ZL30121GGG2V2
    Microsemi Corporation
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    6 Weeks
    Surface Mount
    100-FBGA
    100-CABGA (9x9)
    -40°C~85°C
    Tray
    2009
    Active
    3 (168 Hours)
    2.97V~3.63V
    ZL30121
    LVCMOS, LVPECL
    1
    622.08MHz
    LVCMOS
    11:12
    Yes
    No/Yes
    SONET/SDH, Stratum
    ROHS3 Compliant
    -
    -
    -
    -
    -
    ZL30316GKG vs ZL30121GGG2V2
  • ZL30105QDG1
    ZL30105QDG1
    Microsemi Corporation
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    7 Weeks
    Surface Mount
    64-TQFP
    64-TQFP (10x10)
    -40°C~85°C
    Tray
    2010
    Active
    3 (168 Hours)
    2.97V~3.63V
    ZL30105
    Clock
    1
    65.536MHz
    Clock, Crystal
    3:12
    Yes
    No/No
    T1/E1
    ROHS3 Compliant
    Surface Mount
    64
    85°C
    -40°C
    No
    ZL30316GKG vs ZL30105QDG1
  • ZL30169LDG1
    ZL30169LDG1
    Microsemi Corporation
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    8 Weeks
    Surface Mount
    QFN
    32-QFN (5x5)
    -40°C~85°C
    Tray
    2014
    Active
    3 (168 Hours)
    -
    -
    CML, CMOS
    1
    1.035GHz
    CML, CMOS, Crystal
    4:3
    Yes
    Yes/Yes
    Telecom
    ROHS3 Compliant
    -
    -
    85°C
    -40°C
    -
    ZL30316GKG vs ZL30169LDG1
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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