Xilinx Inc. XCV150-6BG352C
- Part Number:
- XCV150-6BG352C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3132425-XCV150-6BG352C
- Description:
- IC FPGA 260 I/O 352MBGA
- Datasheet:
- Virtex 2.5 V
Xilinx Inc. XCV150-6BG352C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCV150-6BG352C.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case352-LBGA Exposed Pad, Metal
- Operating Temperature0°C~85°C TJ
- PackagingTray
- SeriesVirtex®
- Published2000
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations352
- ECCN CodeEAR99
- Terminal FinishTin/Lead (Sn63Pb37)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply2.375V~2.625V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)225
- Supply Voltage2.5V
- Terminal Pitch1.27mm
- Reach Compliance Codenot_compliant
- Time@Peak Reflow Temperature-Max (s)30
- Base Part NumberXCV150
- Pin Count352
- JESD-30 CodeS-PBGA-B352
- Number of Outputs260
- Qualification StatusNot Qualified
- Power Supplies1.2/3.62.5V
- Number of I/O260
- RAM Size6kB
- Clock Frequency333MHz
- Number of Inputs260
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells3888
- Total RAM Bits49152
- Number of Gates164674
- Number of LABs/CLBs864
- Combinatorial Delay of a CLB-Max0.6 ns
- Number of CLBs864
- Length35mm
- Height Seated (Max)1.7mm
- Width35mm
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XCV150-6BG352C Overview
Fpga chips is supplied in the 352-LBGA Exposed Pad, Metal package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 260 I/Os for transferring data in a more coherent manner. There are 3888 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 2.5V. This FPGA part belongs to the family of Field Programmable Gate Arrays. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 2.375V~2.625V. It is a type of FPGA belonging to the Virtex® seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 260 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 352 terminations. The RAM bits that this device offer is 49152. Its base part number XCV150 can be used to find related parts. The RAM si6kBe of this FPGA module reaches 6kB to ensure normal operation of the program. This FPGA is built as an array of 864 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Fpga electronics operates from a 1.2/3.62.5V power supply. Its basic building block contains 164674 gates. Fpga semiconductor is equipped wfpga semiconductorh 352 pin count. Typically, fpga semiconductor uses a crystal oscillating at 333MHz . 864 CLBs are basic modules used for its architecture.
XCV150-6BG352C Features
260 I/Os
Up to 49152 RAM bits
XCV150-6BG352C Applications
There are a lot of Xilinx Inc.
XCV150-6BG352C FPGAs applications.
Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Fpga chips is supplied in the 352-LBGA Exposed Pad, Metal package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 260 I/Os for transferring data in a more coherent manner. There are 3888 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 2.5V. This FPGA part belongs to the family of Field Programmable Gate Arrays. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 2.375V~2.625V. It is a type of FPGA belonging to the Virtex® seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 260 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 352 terminations. The RAM bits that this device offer is 49152. Its base part number XCV150 can be used to find related parts. The RAM si6kBe of this FPGA module reaches 6kB to ensure normal operation of the program. This FPGA is built as an array of 864 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Fpga electronics operates from a 1.2/3.62.5V power supply. Its basic building block contains 164674 gates. Fpga semiconductor is equipped wfpga semiconductorh 352 pin count. Typically, fpga semiconductor uses a crystal oscillating at 333MHz . 864 CLBs are basic modules used for its architecture.
XCV150-6BG352C Features
260 I/Os
Up to 49152 RAM bits
XCV150-6BG352C Applications
There are a lot of Xilinx Inc.
XCV150-6BG352C FPGAs applications.
Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
XCV150-6BG352C More Descriptions
Field Programmable Gate Array, 864 CLBs, 164674 Gates, 333MHz, CMOS, PBGA352
IC FPGA 260 I/O 352MBGA
IC FPGA 180 I/O 256BGA
French Electronic Distributor since 1988
OEMs, CMs ONLY (NO BROKERS)
Contact for details
IC FPGA 260 I/O 352MBGA
IC FPGA 180 I/O 256BGA
French Electronic Distributor since 1988
OEMs, CMs ONLY (NO BROKERS)
Contact for details
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