Xilinx Inc. XCKU060-2FFVA1517I

XCKU060-2FFVA1517I Overview
Contact plating refers to the process of coating a conductive material, such as copper, silver, or tin, onto the surface of a connector or terminal. In this case, the contact plating for the Kintex® UltraScale™ series is a combination of tin, silver, and copper (Sn/Ag/Cu). This type of plating is commonly used in surface mount technology, where components are mounted directly onto the surface of a printed circuit board. The specific mounting type for this series is surface mount, which allows for a more compact and efficient design. However, it is important to note that this particular series has not yet been qualified, meaning it has not undergone testing to ensure its reliability and performance. The power supplies for this series operate at 0.95V, and it has a large number of inputs, with a total of 624. Additionally, the height of the component when seated is 4.09mm, making it relatively low profile. Overall, the Kintex® UltraScale™ series offers a compact, efficient, and versatile solution for electronic systems.

XCKU060-2FFVA1517I Features
624 I/Os
Up to 38912000 RAM bits
663360 registers

XCKU060-2FFVA1517I Applications
There are a lot of Xilinx Inc. XCKU060-2FFVA1517I FPGAs applications.

Bioinformatics
Computer hardware emulation
Image processing
Enterprise networking
Integrating multiple SPLDs
Data Mining
ADAS
Software-defined radios
Data center search engines
Military DSP