Xilinx Inc. XCKU040-3FFVA1156E

Name: XCKU040-3FFVA1156E
Brand: Xilinx Inc.
SKU: 3129593-XCKU040-3FFVA1156E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCKU040-3FFVA1156E

Manufacturer:: Xilinx Inc.

Ventron No:: 3129593-XCKU040-3FFVA1156E

Description:: IC FPGA 520 I/O 1156FCBGA

ECAD Model:

Datasheet:: XCKU040-3FFVA1156E

Specifications

Xilinx Inc. XCKU040-3FFVA1156E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCKU040-3FFVA1156E.

Factory Lead Time
10 Weeks
Mounting Type
Surface Mount
Package / Case
1156-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
0°C~100°C TJ
Packaging
Bulk
Published
2012
Series
Kintex® UltraScale™
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Packing Method
TRAY
Technology
CMOS
Voltage - Supply
0.970V~1.030V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1V
Terminal Pitch
1mm
Frequency
741MHz
Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B1156
Number of Outputs
520
Qualification Status
Not Qualified
Power Supplies
1V
Number of I/O
520
RAM Size
2.6MB
Memory Type
RAM
Number of Inputs
520
Organization
1920 CLBS
Number of Logic Elements/Cells
530250
Total RAM Bits
21606000
Number of LABs/CLBs
30300
Speed Grade
3
Number of CLBs
1920
Max Junction Temperature (Tj)
100°C
Height
3.42mm
RoHS Status
ROHS3 Compliant

Description

XCKU040-3FFVA1156E Overview
Xilinx Inc. is the brand of this part. It falls under the Embedded - FPGAs (Field Programmable Gate Array) category and is an Embedded - FPGAs (Field Programmable Gate Array) chip. The Mounting Type is Surface Mount and the Package / Case is 1156-BBGA, FCBGA. The JESD-609 Code is e1 and the Terminal Form is BALL. The Peak Reflow Temperature (Cel) is NOT SPECIFIED and the Qualification Status is Not Qualified. The number of inputs for this chip is 520 and it has a total of 21606000 RAM bits. It also has 30300 LABs/CLBs and a Speed Grade of 3.

XCKU040-3FFVA1156E Features
520 I/Os
Up to 21606000 RAM bits
Operating from a frequency of 741MHz

XCKU040-3FFVA1156E Applications
There are a lot of Xilinx Inc. XCKU040-3FFVA1156E FPGAs applications.

Data center search engines
Secure Communication
Automation
Military Temperature
Camera time adjustments
Medical imaging
Solar Energy
Wireless Communications
Automotive driver's assistance
Data Center

XCKU040-3FFVA1156E More Descriptions

FPGA Kintex UltraScale Family 530250 Cells 20nm Technology 0.95V 1156-Pin FC-BGA Tray
IC FPGA 520 I/O 1156FCBGA
FPGA, KINTEX ULTRASCALE, FCBGA-1156; No. of Logic Blocks: 242400; No. of Macrocells: 530250; FPGA Family: Kintex UltraScale Series; Logic Case Style: FCBGA; No. of Pins: 1156Pins; No. of Speed Grades: 3; Total RAM Bits: 21606Kb

Product Comparison

The three parts on the right have similar specifications to XCKU040-3FFVA1156E.

Image

Part Number

Manufacturer

Factory Lead Time

Mounting Type

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Terminal Finish

Packing Method

Technology

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Reflow Temperature-Max (s)

JESD-30 Code

Number of Outputs

Qualification Status

Power Supplies

Number of I/O

RAM Size

Memory Type

Number of Inputs

Organization

Number of Logic Elements/Cells

Total RAM Bits

Number of LABs/CLBs

Speed Grade

Number of CLBs

Max Junction Temperature (Tj)

Height

RoHS Status

Contact Plating

Mount

Number of Pins

Number of Terminations

Subcategory

Operating Supply Voltage

Programmable Logic Type

Number of Registers

Length

Width

Height Seated (Max)

ECCN Code

HTS Code

Time@Peak Reflow Temperature-Max (s)

View Compare
XCKU040-3FFVA1156E

Xilinx Inc.

10 Weeks

Surface Mount

1156-BBGA, FCBGA

YES

0°C~100°C TJ

Bulk

2012

Kintex® UltraScale™

e1

Active

4 (72 Hours)

Tin/Silver/Copper (Sn/Ag/Cu)

TRAY

CMOS

0.970V~1.030V

BOTTOM

BALL

NOT SPECIFIED

1V

1mm

741MHz

NOT SPECIFIED

S-PBGA-B1156

520

Not Qualified

1V

520

2.6MB

RAM

520

1920 CLBS

530250

21606000

30300

3

1920

100°C

3.42mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
XCKU040-1FBVA676C

Xilinx Inc.

10 Weeks

Surface Mount

676-BBGA, FCBGA

-

0°C~85°C TJ

Tray

2012

Kintex® UltraScale™

e1

Active

4 (72 Hours)

Tin/Silver/Copper (Sn/Ag/Cu)

-

CMOS

0.922V~0.979V

BOTTOM

BALL

NOT SPECIFIED

0.95V

-

-

NOT SPECIFIED

-

312

Not Qualified

0.95V

312

2.6MB

-

-

-

530250

21606000

30300

1

-

-

-

ROHS3 Compliant

Copper, Silver, Tin

Surface Mount

676

676

Field Programmable Gate Arrays

950mV

FIELD PROGRAMMABLE GATE ARRAY

484800

27mm

27mm

-

-

-

-

XCKU040-3FFVA1156E vs XCKU040-1FBVA676C
XCKU035-1FBVA900C

Xilinx Inc.

10 Weeks

Surface Mount

900-BBGA, FCBGA

-

0°C~85°C TJ

Bulk

2012

Kintex® UltraScale™

e1

Active

4 (72 Hours)

Tin/Silver/Copper (Sn/Ag/Cu)

TRAY

CMOS

0.922V~0.979V

BOTTOM

BALL

NOT SPECIFIED

0.95V

-

-

NOT SPECIFIED

-

468

Not Qualified

0.95V

468

2.4MB

-

-

-

444343

19456000

25391

1

-

-

-

ROHS3 Compliant

Copper, Silver, Tin

Surface Mount

900

900

Field Programmable Gate Arrays

950mV

FIELD PROGRAMMABLE GATE ARRAY

406256

-

-

2.8mm

-

-

-

XCKU040-3FFVA1156E vs XCKU035-1FBVA900C
XCKU115-2FLVA2104E

Xilinx Inc.

10 Weeks

Surface Mount

2104-BBGA, FCBGA

YES

0°C~100°C TJ

Bulk

2012

Kintex® UltraScale™

e1

Active

4 (72 Hours)

Tin/Silver/Copper (Sn/Ag/Cu)

TRAY

CMOS

0.922V~0.979V

BOTTOM

BALL

NOT SPECIFIED

0.95V

1mm

-

-

S-PBGA-B2104

832

Not Qualified

0.95V

832

-

-

832

5520 CLBS

1451100

77721600

82920

-

5520

-

-

ROHS3 Compliant

-

-

-

-

Field Programmable Gate Arrays

-

FIELD PROGRAMMABLE GATE ARRAY

-

40mm

40mm

3.71mm

3A001.A.7.B

8542.39.00.01

NOT SPECIFIED

XCKU040-3FFVA1156E vs XCKU115-2FLVA2104E