Xilinx Inc. XCKU040-2FBVA676E
- Part Number:
- XCKU040-2FBVA676E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3635984-XCKU040-2FBVA676E
- Description:
- IC FPGA 312 I/O 676FCBGA
- Datasheet:
- XCKU040-2FBVA676E
Xilinx Inc. XCKU040-2FBVA676E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCKU040-2FBVA676E.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case676-BBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2012
- SeriesKintex® UltraScale™
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply0.922V~0.979V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage0.95V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B676
- Number of Outputs312
- Qualification StatusNot Qualified
- Power Supplies0.95V
- Number of I/O312
- RAM Size2.6MB
- Number of Inputs312
- Organization1920 CLBS
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells530250
- Total RAM Bits21606000
- Number of LABs/CLBs30300
- Number of CLBs1920
- Height Seated (Max)2.71mm
- Length27mm
- Width27mm
- RoHS StatusROHS3 Compliant
XCKU040-2FBVA676E Overview
Xilinx Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - FPGAs (Field Programmable Gate Array) chips. These chips are highly versatile and can be programmed to perform a wide range of functions, making them an essential component in many electronic devices. The specific model of this Xilinx Inc. chip is a 676-BBGA or FCBGA package, which refers to the type of packaging used to protect and house the chip. The packaging is in the form of a tray, which is a common method for shipping and storing electronic components. This particular chip was first published in 2012, and since then has become a popular choice among manufacturers due to its advanced technology and capabilities. The HTS Code, or Harmonized Tariff Schedule, for this chip is 8542.39.00.01, which is used for classifying imported and exported goods. This code indicates that the chip is a type of semiconductor device. The technology used in this chip is CMOS, which stands for Complementary Metal-Oxide-Semiconductor, a type of integrated circuit design. The terminal position of this chip is at the bottom, which is a crucial detail for proper installation and connection. It is also classified under JESD-30 Code S-PBGA-B676, which is a standard set by the Joint Electron Device Engineering Council for ball grid array (BGA) packages. The chip has a total of 21606000 RAM bits, which refers to the amount of memory it can store and process. Finally, the height of the chip when seated is at a maximum of 2.71mm, and it has a length of 27mm. These dimensions are essential for determining the compatibility and fit of the chip in different electronic devices. Overall, the Xilinx Inc. Embedded - FPGAs chip offers advanced technology, versatile programming capabilities, and reliable performance, making it a top choice for many manufacturers in the industry.
XCKU040-2FBVA676E Features
312 I/Os
Up to 21606000 RAM bits
XCKU040-2FBVA676E Applications
There are a lot of Xilinx Inc. XCKU040-2FBVA676E FPGAs applications.
Image processing
Automotive
Data Center
Industrial,Medical and Scientific Instruments
Defense Applications
Aircraft navigation
Military DSP
Solar Energy
Security systems
Military Temperature
Xilinx Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - FPGAs (Field Programmable Gate Array) chips. These chips are highly versatile and can be programmed to perform a wide range of functions, making them an essential component in many electronic devices. The specific model of this Xilinx Inc. chip is a 676-BBGA or FCBGA package, which refers to the type of packaging used to protect and house the chip. The packaging is in the form of a tray, which is a common method for shipping and storing electronic components. This particular chip was first published in 2012, and since then has become a popular choice among manufacturers due to its advanced technology and capabilities. The HTS Code, or Harmonized Tariff Schedule, for this chip is 8542.39.00.01, which is used for classifying imported and exported goods. This code indicates that the chip is a type of semiconductor device. The technology used in this chip is CMOS, which stands for Complementary Metal-Oxide-Semiconductor, a type of integrated circuit design. The terminal position of this chip is at the bottom, which is a crucial detail for proper installation and connection. It is also classified under JESD-30 Code S-PBGA-B676, which is a standard set by the Joint Electron Device Engineering Council for ball grid array (BGA) packages. The chip has a total of 21606000 RAM bits, which refers to the amount of memory it can store and process. Finally, the height of the chip when seated is at a maximum of 2.71mm, and it has a length of 27mm. These dimensions are essential for determining the compatibility and fit of the chip in different electronic devices. Overall, the Xilinx Inc. Embedded - FPGAs chip offers advanced technology, versatile programming capabilities, and reliable performance, making it a top choice for many manufacturers in the industry.
XCKU040-2FBVA676E Features
312 I/Os
Up to 21606000 RAM bits
XCKU040-2FBVA676E Applications
There are a lot of Xilinx Inc. XCKU040-2FBVA676E FPGAs applications.
Image processing
Automotive
Data Center
Industrial,Medical and Scientific Instruments
Defense Applications
Aircraft navigation
Military DSP
Solar Energy
Security systems
Military Temperature
XCKU040-2FBVA676E More Descriptions
FPGA Kintex UltraScale Family 424200 Cells 20nm Technology 0.95V 676-Pin FCBGA
Field Programmable Gate Array, 1920 CLBs, 530250-Cell, PBGA676
FPGA, KINTEX ULTRASCALE, FCBGA-676
Fpga, Kintex Ultrascale, Fcbga-676; No. Of Logic Blocks:242400; No. Of Macrocells:530250; Fpga Family:Kintex Ultrascale Series; Logic Case Style:Fcbga; No. Of Pins:676Pins; No. Of Speed Grades:2; Total Ram Bits:21606Kbit; No. Of Rohs Compliant: Yes |Amd Xilinx XCKU040-2FBVA676E
Field Programmable Gate Array, 1920 CLBs, 530250-Cell, PBGA676
FPGA, KINTEX ULTRASCALE, FCBGA-676
Fpga, Kintex Ultrascale, Fcbga-676; No. Of Logic Blocks:242400; No. Of Macrocells:530250; Fpga Family:Kintex Ultrascale Series; Logic Case Style:Fcbga; No. Of Pins:676Pins; No. Of Speed Grades:2; Total Ram Bits:21606Kbit; No. Of Rohs Compliant: Yes |Amd Xilinx XCKU040-2FBVA676E
The three parts on the right have similar specifications to XCKU040-2FBVA676E.
-
ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeSubcategoryTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusPower SuppliesNumber of I/ORAM SizeNumber of InputsOrganizationProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsNumber of CLBsHeight Seated (Max)LengthWidthRoHS StatusContact PlatingPacking MethodTime@Peak Reflow Temperature-Max (s)Operating Supply VoltageSpeed GradeNumber of RegistersSurface MountLead FreeView Compare
-
XCKU040-2FBVA676E10 WeeksSurface MountSurface Mount676-BBGA, FCBGA0°C~100°C TJTray2012Kintex® UltraScale™e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01Field Programmable Gate ArraysCMOS0.922V~0.979VBOTTOMBALLNOT SPECIFIED0.95V1mmNOT SPECIFIEDS-PBGA-B676312Not Qualified0.95V3122.6MB3121920 CLBSFIELD PROGRAMMABLE GATE ARRAY530250216060003030019202.71mm27mm27mmROHS3 Compliant---------
-
10 WeeksSurface MountSurface Mount1760-BBGA, FCBGA-40°C~100°C TJBulk2012Kintex® UltraScale™e1Active4 (72 Hours)-3A001.A.7.BTin/Silver/Copper (Sn/Ag/Cu)-Field Programmable Gate ArraysCMOS0.922V~0.979VBOTTOMBALLNOT SPECIFIED0.95V1mm-S-PBGA-B1760702Not Qualified0.95V7029.5MB702-FIELD PROGRAMMABLE GATE ARRAY14511007772160082920-3.71mm--ROHS3 CompliantCopper, Silver, TinTRAYNOT SPECIFIED950mV21.32672e 06--
-
10 Weeks-Surface Mount1924-BBGA, FCBGA-40°C~100°C TJBulk2012Kintex® UltraScale™-Active4 (72 Hours)-3A001.A.7.B-8542.39.00.01Field Programmable Gate ArraysCMOS0.922V~0.979VBOTTOMBALLNOT SPECIFIED0.95V1mm-S-PBGA-B1924624Not Qualified0.95V624-6244100 CLBSFIELD PROGRAMMABLE GATE ARRAY1088325582656006219041004.13mm45mm45mmROHS3 Compliant-TRAYNOT SPECIFIED---YES-
-
10 WeeksSurface MountSurface Mount1156-BBGA, FCBGA0°C~100°C TJBulk2012Kintex® UltraScale™-Active4 (72 Hours)-----CMOS0.922V~0.979VBOTTOMBALLNOT SPECIFIED0.95V1mmNOT SPECIFIEDS-PBGA-B1156312--3121.6MB312-FIELD PROGRAMMABLE GATE ARRAY3181501300480018180-3.51mm35mm35mmROHS3 Compliant-TRAY-950mV2290880-Lead Free
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
20 December 2023
What is the STM32F103C8T6 Microcontroller and How Does It Work?
Ⅰ. STM32F103C8T6 overviewⅡ. What are the features of STM32F103C8T6?Ⅲ. Programming of STM32F103C8T6Ⅳ. STM32F103C8T6 priceⅤ. What is the difference between STM32F103C8T6 and CH32F103C8T6?Ⅵ. Decoupling circuit of STM32F103C8T6Ⅶ. Several working... -
20 December 2023
1N4007 Diode Characteristics and Application Guide
Ⅰ. Introduction of 1N4007Ⅱ. Naming rules of 1N4007 diodeⅢ. Technical parameters of 1N4007 diodeⅣ. Can we use 1N4004 instead of 1N4007?Ⅴ. 1N4007 diode principle of operationⅥ. Electrical characteristic... -
21 December 2023
Comprehensive Exploration of BC547 Transistor: Advantages, Uses, Specifications and Working Status
Ⅰ. BC547 descriptionⅡ. What are the advantages of BC547 transistor?Ⅲ. BC547 application circuitⅣ. Specifications of BC547Ⅴ. Working status of BC547 transistorⅥ. Absolute maximum ratings of BC547Ⅶ. What are... -
21 December 2023
Exploring the PC817 Optocoupler: Working Principle, Package, Manufacturer and More
Ⅰ. What is PC817 optocoupler?Ⅱ. How PC817 optocoupler works?Ⅲ. Where can we use PC817 optocoupler?Ⅳ. PC817 optocoupler packageⅤ. How to measure the quality of PC817?Ⅵ. Manufacturer of PC817...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.