XCKU035-2FFVA1156E

Xilinx Inc. XCKU035-2FFVA1156E

Part Number:
XCKU035-2FFVA1156E
Manufacturer:
Xilinx Inc.
Ventron No:
3129516-XCKU035-2FFVA1156E
Description:
IC FPGA 520 I/O 1156FCBGA
ECAD Model:
Datasheet:
XCKU035-2FFVA1156E

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Specifications
Xilinx Inc. XCKU035-2FFVA1156E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCKU035-2FFVA1156E.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    1156-BBGA, FCBGA
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Bulk
  • Published
    2012
  • Series
    Kintex® UltraScale™
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Subcategory
    Field Programmable Gate Arrays
  • Packing Method
    TRAY
  • Technology
    CMOS
  • Voltage - Supply
    0.922V~0.979V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    0.95V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B1156
  • Number of Outputs
    520
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    950mV
  • Power Supplies
    0.95V
  • Number of I/O
    520
  • RAM Size
    2.4MB
  • Number of Inputs
    520
  • Organization
    1700 CLBS
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    444343
  • Total RAM Bits
    19456000
  • Number of LABs/CLBs
    25391
  • Speed Grade
    2
  • Number of Registers
    406256
  • Number of CLBs
    1700
  • Height Seated (Max)
    3.51mm
  • Length
    35mm
  • Width
    35mm
  • RoHS Status
    ROHS3 Compliant
Description
XCKU035-2FFVA1156E Overview
The operating temperature range for this product is 0°C to 100°C. It belongs to the TJ series and is part of the Kintex® UltraScale™ family. The packing method for this product is TRAY and the terminal form is BALL. The reflow temperature is not specified. This product has 520 outputs and 520 I/Os. The organization is 1700 CLBS and it has a speed grade of 2. The maximum seated height is 3.51mm.

XCKU035-2FFVA1156E Features
520 I/Os
Up to 19456000 RAM bits
406256 registers

XCKU035-2FFVA1156E Applications
There are a lot of Xilinx Inc. XCKU035-2FFVA1156E FPGAs applications.

Integrating multiple SPLDs
Enterprise networking
Consumer Electronics
Aircraft navigation
Ecosystem
Medical ultrasounds
Artificial intelligence (AI)
Secure Communication
Cryptography
Random logic
XCKU035-2FFVA1156E More Descriptions
FPGA Kintex UltraScale 355474 Cells 20nm Technology 0.95V 1156-Pin FC-BGA
Kintex UltraScale FPGA, 48 User I/Os, 0 GTP, 236-Ball BGA, Speed Grade 2, Commercial Grade, FFVA1156, RoHSXilinx SCT
Field Programmable Gate Array, 1700 CLBs, 444343-Cell, PBGA1156
FPGA, KINTEX ULTRASCALE, FCBGA-1156
Fpga, Kintex Ultrascale, Fcbga-1156; No. Of Logic Blocks:203128; No. Of Macrocells:444343; Fpga Family:Kintex Ultrascale Series; Logic Case Style:Fcbga; No. Of Pins:1156Pins; No. Of Speed Grades:2; Total Ram Bits:19456Kbit; No. Of |Amd Xilinx XCKU035-2FFVA1156E
Product Comparison
The three parts on the right have similar specifications to XCKU035-2FFVA1156E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mount
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    ECCN Code
    Terminal Finish
    Subcategory
    Packing Method
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Operating Supply Voltage
    Power Supplies
    Number of I/O
    RAM Size
    Number of Inputs
    Organization
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Number of LABs/CLBs
    Speed Grade
    Number of Registers
    Number of CLBs
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Number of Pins
    Number of Terminations
    Time@Peak Reflow Temperature-Max (s)
    Surface Mount
    HTS Code
    View Compare
  • XCKU035-2FFVA1156E
    XCKU035-2FFVA1156E
    10 Weeks
    Copper, Silver, Tin
    Surface Mount
    Surface Mount
    1156-BBGA, FCBGA
    0°C~100°C TJ
    Bulk
    2012
    Kintex® UltraScale™
    e1
    Active
    4 (72 Hours)
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    Field Programmable Gate Arrays
    TRAY
    CMOS
    0.922V~0.979V
    BOTTOM
    BALL
    NOT SPECIFIED
    0.95V
    1mm
    NOT SPECIFIED
    S-PBGA-B1156
    520
    Not Qualified
    950mV
    0.95V
    520
    2.4MB
    520
    1700 CLBS
    FIELD PROGRAMMABLE GATE ARRAY
    444343
    19456000
    25391
    2
    406256
    1700
    3.51mm
    35mm
    35mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
  • XCKU040-1FBVA676C
    10 Weeks
    Copper, Silver, Tin
    Surface Mount
    Surface Mount
    676-BBGA, FCBGA
    0°C~85°C TJ
    Tray
    2012
    Kintex® UltraScale™
    e1
    Active
    4 (72 Hours)
    -
    Tin/Silver/Copper (Sn/Ag/Cu)
    Field Programmable Gate Arrays
    -
    CMOS
    0.922V~0.979V
    BOTTOM
    BALL
    NOT SPECIFIED
    0.95V
    -
    NOT SPECIFIED
    -
    312
    Not Qualified
    950mV
    0.95V
    312
    2.6MB
    -
    -
    FIELD PROGRAMMABLE GATE ARRAY
    530250
    21606000
    30300
    1
    484800
    -
    -
    27mm
    27mm
    ROHS3 Compliant
    676
    676
    -
    -
    -
  • XCKU115-2FLVB1760I
    10 Weeks
    Copper, Silver, Tin
    Surface Mount
    Surface Mount
    1760-BBGA, FCBGA
    -40°C~100°C TJ
    Bulk
    2012
    Kintex® UltraScale™
    e1
    Active
    4 (72 Hours)
    3A001.A.7.B
    Tin/Silver/Copper (Sn/Ag/Cu)
    Field Programmable Gate Arrays
    TRAY
    CMOS
    0.922V~0.979V
    BOTTOM
    BALL
    NOT SPECIFIED
    0.95V
    1mm
    -
    S-PBGA-B1760
    702
    Not Qualified
    950mV
    0.95V
    702
    9.5MB
    702
    -
    FIELD PROGRAMMABLE GATE ARRAY
    1451100
    77721600
    82920
    2
    1.32672e 06
    -
    3.71mm
    -
    -
    ROHS3 Compliant
    -
    -
    NOT SPECIFIED
    -
    -
  • XCKU040-L1FFVA1156I
    10 Weeks
    -
    -
    Surface Mount
    1156-BBGA, FCBGA
    -40°C~100°C TJ
    Bulk
    2012
    Kintex® UltraScale™
    e1
    Active
    4 (72 Hours)
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    Field Programmable Gate Arrays
    TRAY
    CMOS
    0.880V~0.979V
    BOTTOM
    BALL
    NOT SPECIFIED
    0.9V
    1mm
    NOT SPECIFIED
    S-PBGA-B1156
    520
    Not Qualified
    -
    0.9V
    520
    2.6MB
    520
    1920 CLBS
    FIELD PROGRAMMABLE GATE ARRAY
    530250
    21606000
    30300
    -
    -
    1920
    3.51mm
    35mm
    35mm
    ROHS3 Compliant
    -
    -
    -
    YES
    8542.39.00.01
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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