Xilinx Inc. XCKU035-2FBVA676I

Name: XCKU035-2FBVA676I
Brand: Xilinx Inc.
SKU: 3635896-XCKU035-2FBVA676I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCKU035-2FBVA676I

Manufacturer:: Xilinx Inc.

Ventron No:: 3635896-XCKU035-2FBVA676I

Description:: IC FPGA 312 I/O 676FCBGA

ECAD Model:

Datasheet:: Wireless Bluetooth® Low Energy Modules Overview

Specifications

Xilinx Inc. XCKU035-2FBVA676I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCKU035-2FBVA676I.

Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
676-BBGA, FCBGA
Number of Pins
676
Operating Temperature
-40°C~100°C TJ
Packaging
Bulk
Published
2012
Series
Kintex® UltraScale™
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
676
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory
Field Programmable Gate Arrays
Packing Method
TRAY
Technology
CMOS
Voltage - Supply
0.922V~0.979V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.95V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of Outputs
312
Qualification Status
Not Qualified
Operating Supply Voltage
950mV
Power Supplies
0.95V
Number of I/O
312
RAM Size
2.4MB
Organization
1700 CLBS
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
444343
Total RAM Bits
19456000
Number of LABs/CLBs
25391
Speed Grade
2
Number of Registers
406256
Number of CLBs
1700
RoHS Status
ROHS3 Compliant

Description

XCKU035-2FBVA676I Overview
The TJ Series, part of the Kintex® UltraScale™ family, offers high performance and reliability with an operating temperature range of -40°C to 100°C. With 676 terminations and a terminal pitch of 1mm, this product is ideal for a variety of applications. The technology used is CMOS and the terminal finish is Tin/Silver/Copper (Sn/Ag/Cu), ensuring durability and longevity. The product is classified under the ECCN Code 3A991.D and is currently not qualified. It requires a power supply of 0.95V and boasts a high number of LABs/CLBs at 25391, making it a versatile and efficient choice for your project needs.

XCKU035-2FBVA676I Features
312 I/Os
Up to 19456000 RAM bits
676 LABs/CLBs
406256 registers

XCKU035-2FBVA676I Applications
There are a lot of Xilinx Inc. XCKU035-2FBVA676I FPGAs applications.

Bioinformatics
Military Temperature
Telecommunication
DO-254
Medical ultrasounds
Industrial IoT
Voice recognition
Camera time adjustments
Wired Communications
Embedded Vision

XCKU035-2FBVA676I More Descriptions

FPGA Kintex UltraScale 355474 Cells 20nm Technology 0.95V 676-Pin FCBGA Tray
Field Programmable Gate Array, 444343-Cell, PBGA784
IC FPGA 312 I/O 676FCBGA
IC FPGA 360 I/O 665FCBGA
OEMs, CMs ONLY (NO BROKERS)

Product Comparison

The three parts on the right have similar specifications to XCKU035-2FBVA676I.

Image

Part Number

Manufacturer

Factory Lead Time

Contact Plating

Mount

Mounting Type

Package / Case

Number of Pins

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Subcategory

Packing Method

Technology

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Number of Outputs

Qualification Status

Operating Supply Voltage

Power Supplies

Number of I/O

RAM Size

Organization

Programmable Logic Type

Number of Logic Elements/Cells

Total RAM Bits

Number of LABs/CLBs

Speed Grade

Number of Registers

Number of CLBs

RoHS Status

Time@Peak Reflow Temperature-Max (s)

JESD-30 Code

Number of Inputs

Height Seated (Max)

Surface Mount

HTS Code

Length

Width

Lead Free

View Compare
XCKU035-2FBVA676I

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

Surface Mount

Surface Mount

676-BBGA, FCBGA

676

-40°C~100°C TJ

Bulk

2012

Kintex® UltraScale™

e1

Active

4 (72 Hours)

676

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

Field Programmable Gate Arrays

TRAY

CMOS

0.922V~0.979V

BOTTOM

BALL

NOT SPECIFIED

0.95V

1mm

NOT SPECIFIED

312

Not Qualified

950mV

0.95V

312

2.4MB

1700 CLBS

FIELD PROGRAMMABLE GATE ARRAY

444343

19456000

25391

2

406256

1700

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-
XCKU115-2FLVB1760I

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

Surface Mount

Surface Mount

1760-BBGA, FCBGA

-

-40°C~100°C TJ

Bulk

2012

Kintex® UltraScale™

e1

Active

4 (72 Hours)

-

3A001.A.7.B

Tin/Silver/Copper (Sn/Ag/Cu)

Field Programmable Gate Arrays

TRAY

CMOS

0.922V~0.979V

BOTTOM

BALL

NOT SPECIFIED

0.95V

1mm

-

702

Not Qualified

950mV

0.95V

702

9.5MB

-

FIELD PROGRAMMABLE GATE ARRAY

1451100

77721600

82920

2

1.32672e 06

-

ROHS3 Compliant

NOT SPECIFIED

S-PBGA-B1760

702

3.71mm

-

-

-

-

-

XCKU035-2FBVA676I vs XCKU115-2FLVB1760I
XCKU085-1FLVF1924I

Xilinx Inc.

10 Weeks

-

-

Surface Mount

1924-BBGA, FCBGA

-

-40°C~100°C TJ

Bulk

2012

Kintex® UltraScale™

-

Active

4 (72 Hours)

-

3A001.A.7.B

-

Field Programmable Gate Arrays

TRAY

CMOS

0.922V~0.979V

BOTTOM

BALL

NOT SPECIFIED

0.95V

1mm

-

624

Not Qualified

-

0.95V

624

-

4100 CLBS

FIELD PROGRAMMABLE GATE ARRAY

1088325

58265600

62190

-

-

4100

ROHS3 Compliant

NOT SPECIFIED

S-PBGA-B1924

624

4.13mm

YES

8542.39.00.01

45mm

45mm

-

XCKU035-2FBVA676I vs XCKU085-1FLVF1924I
XCKU025-2FFVA1156E

Xilinx Inc.

10 Weeks

-

Surface Mount

Surface Mount

1156-BBGA, FCBGA

-

0°C~100°C TJ

Bulk

2012

Kintex® UltraScale™

-

Active

4 (72 Hours)

-

-

-

-

TRAY

CMOS

0.922V~0.979V

BOTTOM

BALL

NOT SPECIFIED

0.95V

1mm

NOT SPECIFIED

312

-

950mV

-

312

1.6MB

-

FIELD PROGRAMMABLE GATE ARRAY

318150

13004800

18180

2

290880

-

ROHS3 Compliant

-

S-PBGA-B1156

312

3.51mm

-

-

35mm

35mm

Lead Free

XCKU035-2FBVA676I vs XCKU025-2FFVA1156E