Xilinx Inc. XCKU025-2FFVA1156I
- Part Number:
- XCKU025-2FFVA1156I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3635913-XCKU025-2FFVA1156I
- Description:
- IC FPGA 312 I/O 1156FCBGA
- ECAD Model:
-
- Datasheet:
- XCKU025-2FFVA1156I
Xilinx Inc. XCKU025-2FFVA1156I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCKU025-2FFVA1156I.
- Factory Lead Time10 Weeks
- Mounting TypeSurface Mount
- Package / Case1156-BBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingBulk
- Published2012
- SeriesKintex® UltraScale™
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.39.00.01
- Packing MethodTRAY
- TechnologyCMOS
- Voltage - Supply0.922V~0.979V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage0.95V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B1156
- Number of Outputs312
- Number of I/O312
- Number of Inputs312
- Organization1152 CLBS
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells318150
- Total RAM Bits13004800
- Number of LABs/CLBs18180
- Number of CLBs1152
- Height Seated (Max)3.51mm
- Length35mm
- Width35mm
- RoHS StatusROHS3 Compliant
XCKU025-2FFVA1156I Overview
The manufacturer of this component is Xilinx Inc. It is a type of chip known as Embedded - FPGAs (Field Programmable Gate Array), which falls under the category of Embedded - FPGAs (Field Programmable Gate Array). The chip is designed to be mounted on the surface of a circuit board, and it is available in bulk packaging. The part is currently in active production and its Harmonized Tariff Schedule (HTS) code is 8542.39.00.01. It utilizes CMOS technology and has its terminals located at the bottom of the chip with a pitch of 1mm. The chip has a total of 312 input/output connections and a width of 35mm. It is also compliant with the Restriction of Hazardous Substances Directive (RoHS) and meets the requirements of the third version of the directive.
XCKU025-2FFVA1156I Features
312 I/Os
Up to 13004800 RAM bits
XCKU025-2FFVA1156I Applications
There are a lot of Xilinx Inc. XCKU025-2FFVA1156I FPGAs applications.
Space Applications
Data Center
DO-254
Image processing
Security systems
Medical Applications
Medical ultrasounds
Automotive Applications
Ecosystem
Data Mining
The manufacturer of this component is Xilinx Inc. It is a type of chip known as Embedded - FPGAs (Field Programmable Gate Array), which falls under the category of Embedded - FPGAs (Field Programmable Gate Array). The chip is designed to be mounted on the surface of a circuit board, and it is available in bulk packaging. The part is currently in active production and its Harmonized Tariff Schedule (HTS) code is 8542.39.00.01. It utilizes CMOS technology and has its terminals located at the bottom of the chip with a pitch of 1mm. The chip has a total of 312 input/output connections and a width of 35mm. It is also compliant with the Restriction of Hazardous Substances Directive (RoHS) and meets the requirements of the third version of the directive.
XCKU025-2FFVA1156I Features
312 I/Os
Up to 13004800 RAM bits
XCKU025-2FFVA1156I Applications
There are a lot of Xilinx Inc. XCKU025-2FFVA1156I FPGAs applications.
Space Applications
Data Center
DO-254
Image processing
Security systems
Medical Applications
Medical ultrasounds
Automotive Applications
Ecosystem
Data Mining
XCKU025-2FFVA1156I More Descriptions
FPGA Kintex UltraScale Family 318150 Cells 20nm Technology 0.95V 1156-Pin FC-BGA Tray
Field Programmable Gate Array, 444343-Cell, PBGA676
IC SUPERVISOR 12 CHANNEL 48TQFP
Field Programmable Gate Array, 444343-Cell, PBGA676
IC SUPERVISOR 12 CHANNEL 48TQFP
The three parts on the right have similar specifications to XCKU025-2FFVA1156I.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePacking MethodTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsNumber of I/ONumber of InputsOrganizationProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsNumber of CLBsHeight Seated (Max)LengthWidthRoHS StatusJESD-609 CodeECCN CodeTerminal FinishSubcategoryTime@Peak Reflow Temperature-Max (s)Qualification StatusPower SuppliesRAM SizeView Compare
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XCKU025-2FFVA1156I10 WeeksSurface Mount1156-BBGA, FCBGAYES-40°C~100°C TJBulk2012Kintex® UltraScale™Active4 (72 Hours)8542.39.00.01TRAYCMOS0.922V~0.979VBOTTOMBALLNOT SPECIFIED0.95V1mmNOT SPECIFIEDS-PBGA-B11563123123121152 CLBSFIELD PROGRAMMABLE GATE ARRAY318150130048001818011523.51mm35mm35mmROHS3 Compliant--------- -
10 WeeksSurface Mount2104-BBGA, FCBGAYES0°C~100°C TJBulk2012Kintex® UltraScale™Active4 (72 Hours)8542.39.00.01TRAYCMOS0.922V~0.979VBOTTOMBALLNOT SPECIFIED0.95V1mm-S-PBGA-B21048328328325520 CLBSFIELD PROGRAMMABLE GATE ARRAY1451100777216008292055203.71mm40mm40mmROHS3 Compliante13A001.A.7.BTin/Silver/Copper (Sn/Ag/Cu)Field Programmable Gate ArraysNOT SPECIFIEDNot Qualified0.95V-
-
11 WeeksSurface Mount676-BBGA, FCBGA--40°C~100°C TJTray-Kintex® UltraScale ™Active4 (72 Hours)8542.39.00.01--0.698V~0.876V--------256--FIELD PROGRAMMABLE GATE ARRAY4746004198400027120----ROHS3 Compliant--------
-
10 WeeksSurface Mount1156-BBGA, FCBGAYES-40°C~100°C TJBulk2012Kintex® UltraScale™Active4 (72 Hours)8542.39.00.01TRAYCMOS0.880V~0.979VBOTTOMBALLNOT SPECIFIED0.9V1mmNOT SPECIFIEDS-PBGA-B11565205205201920 CLBSFIELD PROGRAMMABLE GATE ARRAY530250216060003030019203.51mm35mm35mmROHS3 Compliante13A991.DTin/Silver/Copper (Sn/Ag/Cu)Field Programmable Gate Arrays-Not Qualified0.9V2.6MB
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