Xilinx Inc. XC17S40XLPDG8C
- Part Number:
- XC17S40XLPDG8C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3245597-XC17S40XLPDG8C
- Description:
- IC PROM PROG C-TEMP 3.3V 8-DIP
- Datasheet:
- XC17S40XLPDG8C
Xilinx Inc. XC17S40XLPDG8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S40XLPDG8C.
- Mounting TypeThrough Hole
- Package / Case8-DIP (0.300, 7.62mm)
- Surface MountNO
- Number of Pins8
- Operating Temperature0°C~70°C
- PackagingTube
- Published1999
- JESD-609 Codee3
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations8
- TerminationThrough Hole
- ECCN CodeEAR99
- Terminal FinishMatte Tin (Sn)
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionDUAL
- Peak Reflow Temperature (Cel)250
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch2.54mm
- Reach Compliance Codeunknown
- Reflow Temperature-Max (s)30
- Base Part NumberXC17S40XL
- Pin Count8
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3.3V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- InterfaceSerial
- Memory Size400kb
- Memory TypePROM
- Operating ModeSYNCHRONOUS
- Clock Frequency10MHz
- Supply Current-Max0.005mA
- Organization330696X1
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.00005A
- Memory Density330696 bit
- I/O TypeCOMMON
- Height Seated (Max)4.5974mm
- Length9.3599mm
- Width7.62mm
- REACH SVHCNo SVHC
- RoHS StatusRoHS Compliant
- Lead FreeLead Free
XC17S40XLPDG8C Overview
A neat 8-DIP (0.300, 7.62mm) package is used.Tube external packaging.Qualified to perform a variety of tasks within the 0°C~70°C environment.This device can be programmed using the OTP language.The voltage is 3V~3.6V.FPGA is mounted in Through Hole.There is a limit of 400kb MB for the amount of data that can be stored.Try searching "XC17S40XL" for more parts.3.3V is the required supply voltage.8 terminations with different functions.FPGA is possible to use this memory device at a maximum voltage of 3.6V.3V is the minimum voltage required to supply the device.The reflow soldering process should be done at a temperature no higher than 250.FPGA has pins on the 8 axis.A memory chip can operate at a voltage no greater than 0.005mA.There is a set of 8 pins that are included with the part.In terms of speed, this is a memory IC that operates at a 10MHz frequency.There is a COMMON configuration for the memory's I/O.Memory is recommended that a 3.3V power supply be used.The PROM memory is also referred to as the X memory.
XC17S40XLPDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
COMMON I/O equipped.
PROM memory
XC17S40XLPDG8C Applications
There are a lot of Xilinx Inc. XC17S40XLPDG8C applications of configuration proms for FPGAs.
networks
eDRAM
DVD disk buffer
supercomputers
embedded logic
mainframes
networking
personal computers
data buffer
printers
A neat 8-DIP (0.300, 7.62mm) package is used.Tube external packaging.Qualified to perform a variety of tasks within the 0°C~70°C environment.This device can be programmed using the OTP language.The voltage is 3V~3.6V.FPGA is mounted in Through Hole.There is a limit of 400kb MB for the amount of data that can be stored.Try searching "XC17S40XL" for more parts.3.3V is the required supply voltage.8 terminations with different functions.FPGA is possible to use this memory device at a maximum voltage of 3.6V.3V is the minimum voltage required to supply the device.The reflow soldering process should be done at a temperature no higher than 250.FPGA has pins on the 8 axis.A memory chip can operate at a voltage no greater than 0.005mA.There is a set of 8 pins that are included with the part.In terms of speed, this is a memory IC that operates at a 10MHz frequency.There is a COMMON configuration for the memory's I/O.Memory is recommended that a 3.3V power supply be used.The PROM memory is also referred to as the X memory.
XC17S40XLPDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
COMMON I/O equipped.
PROM memory
XC17S40XLPDG8C Applications
There are a lot of Xilinx Inc. XC17S40XLPDG8C applications of configuration proms for FPGAs.
networks
eDRAM
DVD disk buffer
supercomputers
embedded logic
mainframes
networking
personal computers
data buffer
printers
XC17S40XLPDG8C More Descriptions
XC17S40XL Matte Tin (Sn) EAR99 Tube ics fpga configuration 7.62mm 0.00005A 400kb 3.3V
Memory Circuit, 330696X1, CMOS, PDSO20
IC PROM PROG C-TEMP 3.3V 8-DIP
PROM SCP FOR FPGA, 17S40, DIP8; Memory Type:PROM; Interface Type:Serial; Memory Size:300Kbit; Voltage, Memory Vcc:5V; Voltage, Supply Min:4.75V; Voltage, Supply Max:5.25V; Termination Type:Through Hole; Case Style:DIP; No. of Pins:8; Operating Temperature Range:0°C to 70°C; Temp, Op. Max:70°C; Temp, Op. Min:0°C; Base Number:17; IC Generic Number:17S40; Logic Function Number:17S40; Temperature Range, IC:Commercial; Voltage, Programming:3.3V
Memory Circuit, 330696X1, CMOS, PDSO20
IC PROM PROG C-TEMP 3.3V 8-DIP
PROM SCP FOR FPGA, 17S40, DIP8; Memory Type:PROM; Interface Type:Serial; Memory Size:300Kbit; Voltage, Memory Vcc:5V; Voltage, Supply Min:4.75V; Voltage, Supply Max:5.25V; Termination Type:Through Hole; Case Style:DIP; No. of Pins:8; Operating Temperature Range:0°C to 70°C; Temp, Op. Max:70°C; Temp, Op. Min:0°C; Base Number:17; IC Generic Number:17S40; Logic Function Number:17S40; Temperature Range, IC:Commercial; Voltage, Programming:3.3V
The three parts on the right have similar specifications to XC17S40XLPDG8C.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminationECCN CodeTerminal FinishTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)Base Part NumberPin CountQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Programmable TypeInterfaceMemory SizeMemory TypeOperating ModeClock FrequencySupply Current-MaxOrganizationOutput CharacteristicsMemory WidthStandby Current-MaxMemory DensityI/O TypeHeight Seated (Max)LengthWidthREACH SVHCRoHS StatusLead FreePbfree CodeAdditional FeatureParallel/SerialMemory IC TypeOperating Supply VoltageVoltageDensityRadiation HardeningView Compare
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XC17S40XLPDG8CThrough Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube1999e3Obsolete1 (Unlimited)8Through HoleEAR99Matte Tin (Sn)CMOS3V~3.6VDUAL25013.3V2.54mmunknown30XC17S40XL8Not Qualified3.6V3.3V3VOTPSerial400kbPROMSYNCHRONOUS10MHz0.005mA330696X13-STATE10.00005A330696 bitCOMMON4.5974mm9.3599mm7.62mmNo SVHCRoHS CompliantLead Free---------
-
Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0ObsoleteNot Applicable8-EAR99-CMOS3V~3.6VDUAL22513.3V2.54mmnot_compliant30XC1701L8Not Qualified3.6V3.3V3VOTP-1Mb-SYNCHRONOUS15MHz0.01mA1MX13-STATE10.00005A-COMMON4.5974mm9.3599mm7.62mm-Non-RoHS CompliantContains LeadnoUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASSERIALCONFIGURATION MEMORY----
-
Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0ObsoleteNot Applicable8-EAR99-CMOS4.75V~5.25VDUAL22515V2.54mm-30XC17256E8--5V-OTP-256Kb--15MHz0.01mA256KX13-STATE10.00005A-COMMON4.5974mm9.3599mm7.62mm-Non-RoHS CompliantContains Lead-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASSERIALCONFIGURATION MEMORY5V5V256 kbNo
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0ObsoleteNot Applicable8-EAR99-CMOS4.5V~5.5VDUAL22515V2.54mmnot_compliant30XC17128E8Not Qualified5.5V5V4.5VOTP-128kb-SYNCHRONOUS15MHz0.01mA-3-STATE10.00005A131072 bitCOMMON4.5974mm9.3599mm7.62mm-Non-RoHS CompliantContains Lead-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASSERIALCONFIGURATION MEMORY----
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