Xilinx Inc. XC1765EPD8C
- Part Number:
- XC1765EPD8C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3246507-XC1765EPD8C
- Description:
- IC PROM SERIAL CONFIG 65K 8-DIP
- Datasheet:
- XC1765EPD8C
Xilinx Inc. XC1765EPD8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC1765EPD8C.
- Mounting TypeThrough Hole
- Package / Case8-DIP (0.300, 7.62mm)
- Surface MountNO
- Number of Pins8
- Operating Temperature0°C~70°C
- PackagingTube
- Published2000
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)Not Applicable
- Number of Terminations8
- ECCN CodeEAR99
- Additional FeatureUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
- TechnologyCMOS
- Voltage - Supply4.75V~5.25V
- Terminal PositionDUAL
- Peak Reflow Temperature (Cel)225
- Number of Functions1
- Supply Voltage5V
- Terminal Pitch2.54mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)30
- Base Part NumberXC1765E
- Pin Count8
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)5.25V
- Power Supplies5V
- Supply Voltage-Min (Vsup)4.75V
- Programmable TypeOTP
- Memory Size65kb
- Operating ModeSYNCHRONOUS
- Clock Frequency10MHz
- Supply Current-Max0.01mA
- Organization64KX1
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.00005A
- Memory Density65536 bit
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)4.5974mm
- Length9.3599mm
- Width7.62mm
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC1765EPD8C Overview
FPGA uses a nice 8-DIP (0.300, 7.62mm) package that makes FPGA easy to use.Packaging for Tube.Qualified to operate within 0°C~70°C.FPGA is programmable through OTP.With a voltage of 4.75V~5.25V, it is powered.The memory device is mounted in the Through Hole position.A maximum of 65kb bytes of data can be stored.To find other similar parts, search for "XC1765E".5V is the required supply voltage.Different types of 8 terminations are available with different functions.There is a maximum voltage of 5.25V that can be applied to this memory device.An operating voltage of 4.75V is required in order to supply the device.A CONFIGURATION MEMORY memory chip like this is used for data storage.FPGA is recommended that the reflow soldering temperature be maintained at no more than 225 during the process.Pins on it are 8-shaped.A SERIAL-processing method is used to transfer data through this memory.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.01mA.There is a set of 8 pins that are included with the part.There is a memory IC in this package that works at 10MHz frequencies.There is a COMMON configuration for the memory's I/O.The use of a 5V power supply is recommended in order to achieve best results.In order to better serve the needs, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included.
XC1765EPD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC1765EPD8C Applications
There are a lot of Xilinx Inc. XC1765EPD8C applications of configuration proms for FPGAs.
main computer memory
eDRAM
data buffer
networking
Cache memory
supercomputers
multimedia computers
graphics card
embedded logic
eSRAM
FPGA uses a nice 8-DIP (0.300, 7.62mm) package that makes FPGA easy to use.Packaging for Tube.Qualified to operate within 0°C~70°C.FPGA is programmable through OTP.With a voltage of 4.75V~5.25V, it is powered.The memory device is mounted in the Through Hole position.A maximum of 65kb bytes of data can be stored.To find other similar parts, search for "XC1765E".5V is the required supply voltage.Different types of 8 terminations are available with different functions.There is a maximum voltage of 5.25V that can be applied to this memory device.An operating voltage of 4.75V is required in order to supply the device.A CONFIGURATION MEMORY memory chip like this is used for data storage.FPGA is recommended that the reflow soldering temperature be maintained at no more than 225 during the process.Pins on it are 8-shaped.A SERIAL-processing method is used to transfer data through this memory.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.01mA.There is a set of 8 pins that are included with the part.There is a memory IC in this package that works at 10MHz frequencies.There is a COMMON configuration for the memory's I/O.The use of a 5V power supply is recommended in order to achieve best results.In order to better serve the needs, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included.
XC1765EPD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC1765EPD8C Applications
There are a lot of Xilinx Inc. XC1765EPD8C applications of configuration proms for FPGAs.
main computer memory
eDRAM
data buffer
networking
Cache memory
supercomputers
multimedia computers
graphics card
embedded logic
eSRAM
XC1765EPD8C More Descriptions
XC1765E EAR99 Tube 64KX1 ics fpga configuration 7.62mm 0.00005A 65kb 5V
Configuration Memory, 64KX1, Serial, CMOS, PDSO8
PROM Serial 64K-bit 5V 8-Pin PDIP
CONFIGURATION MEMORY, 16MX1, PQF
IC PROM SERIAL CONFIG 65K 8-DIP
Product Description Demo for Development.
Configuration Memory, 64KX1, Serial, CMOS, PDSO8
PROM Serial 64K-bit 5V 8-Pin PDIP
CONFIGURATION MEMORY, 16MX1, PQF
IC PROM SERIAL CONFIG 65K 8-DIP
Product Description Demo for Development.
The three parts on the right have similar specifications to XC1765EPD8C.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeAdditional FeatureTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)Base Part NumberPin CountQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Programmable TypeMemory SizeOperating ModeClock FrequencySupply Current-MaxOrganizationOutput CharacteristicsMemory WidthStandby Current-MaxMemory DensityParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRoHS StatusLead FreeTerminal FinishTerminal FormJESD-30 CodeView Compare
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XC1765EPD8CThrough Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0noObsoleteNot Applicable8EAR99USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.75V~5.25VDUAL22515V2.54mmnot_compliant30XC1765E8Not Qualified5.25V5V4.75VOTP65kbSYNCHRONOUS10MHz0.01mA64KX13-STATE10.00005A65536 bitSERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains Lead----
-
Surface Mount20-LCC (J-Lead)YES-0°C~70°CTube-e0noObsolete3 (168 Hours)20-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.75V~5.25VQUAD22515V1.27mmunknown30-20COMMERCIAL5.25V-4.75VOTP36kbSYNCHRONOUS--36288X1-1-36288 bitSERIAL-CONFIGURATION MEMORY4.572mm8.9662mm8.9662mmNon-RoHS Compliant-TIN LEADJ BENDS-PQCC-J20
-
Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0noObsoleteNot Applicable8EAR99USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS3V~3.6VDUAL22513.3V2.54mmnot_compliant30XC1701L8Not Qualified3.6V3.3V3VOTP1MbSYNCHRONOUS15MHz0.01mA1MX13-STATE10.00005A-SERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains Lead---
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8EAR99USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.5V~5.5VDUAL22515V2.54mmnot_compliant30XC17128E8Not Qualified5.5V5V4.5VOTP128kbSYNCHRONOUS15MHz0.01mA-3-STATE10.00005A131072 bitSERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains Lead---
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