Xilinx Inc. XC17256ELPD8C

Name: XC17256ELPD8C
Brand: Xilinx Inc.
SKU: 3246487-XC17256ELPD8C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC17256ELPD8C

Manufacturer:: Xilinx Inc.

Ventron No:: 3246487-XC17256ELPD8C

Description:: IC 3V SER CFG PROM 256K 8-DIP

ECAD Model:

Datasheet:: XC17256ELPD8C

Specifications

Xilinx Inc. XC17256ELPD8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17256ELPD8C.

Mounting Type
Through Hole
Package / Case
8-DIP (0.300, 7.62mm)
Surface Mount
NO
Number of Pins
8
Operating Temperature
0°C~70°C
Packaging
Tube
Published
2000
JESD-609 Code
e0
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
Not Applicable
Number of Terminations
8
ECCN Code
EAR99
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Technology
CMOS
Voltage - Supply
3V~3.6V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
225
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
2.54mm
Reflow Temperature-Max (s)
30
Base Part Number
XC17256EL
Pin Count
8
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
3V
Programmable Type
OTP
Memory Size
256Kb
Clock Frequency
15MHz
Supply Current-Max
0.005mA
Organization
256KX1
Output Characteristics
3-STATE
Memory Width
1
Density
256 kb
Standby Current-Max
0.00005A
Parallel/Serial
SERIAL
I/O Type
COMMON
Memory IC Type
CONFIGURATION MEMORY
Height Seated (Max)
4.5974mm
Length
9.3599mm
Width
7.62mm
Radiation Hardening
No
RoHS Status
Non-RoHS Compliant
Lead Free
Contains Lead

Description

XC17256ELPD8C Overview
The operating temperature range for this particular memory IC type is between 0°C to 70°C, making it suitable for use in a wide variety of electronic devices. However, it is important to note that its part status is now obsolete, meaning it is no longer being manufactured. The supply voltage for this memory chip is 3.3V, with a maximum of 3.6V. Its terminal pitch is 2.54mm, allowing for easy integration into circuit boards. The memory size and density are both 256Kb, providing ample space for storing data. With a length of 9.3599mm, this memory IC is compact and can easily fit into compact devices. It is also worth mentioning that it is non-RoHS compliant.

XC17256ELPD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17256ELPD8C Applications
There are a lot of Xilinx Inc. XC17256ELPD8C applications of configuration proms for FPGAs.

nonvolatile BIOS memory
multimedia computers
servers
eSRAM
networks
workstations,
networking
graphics card
main computer memory
embedded logic

XC17256ELPD8C More Descriptions

XC17256EL EAR99 Tube 256KX1 ics fpga configuration 7.62mm 0.00005A 256Kb 3.3V
PROM Serial 256K-bit 3.3V 8-Pin PDIP
CoC and 2-years warranty / RFQ for pricing
IC SERIAL CFG PROM 256K 8-SOIC

Product Comparison

The three parts on the right have similar specifications to XC17256ELPD8C.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Surface Mount

Number of Pins

Operating Temperature

Packaging

Published

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Additional Feature

Technology

Voltage - Supply

Terminal Position

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Base Part Number

Pin Count

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Programmable Type

Memory Size

Clock Frequency

Supply Current-Max

Organization

Output Characteristics

Memory Width

Density

Standby Current-Max

Parallel/Serial

I/O Type

Memory IC Type

Height Seated (Max)

Length

Width

Radiation Hardening

RoHS Status

Lead Free

Terminal Finish

HTS Code

Terminal Form

Reach Compliance Code

Qualification Status

Power Supplies

Operating Mode

Memory Density

View Compare
XC17256ELPD8C

Xilinx Inc.

Through Hole

8-DIP (0.300, 7.62mm)

NO

8

0°C~70°C

Tube

2000

e0

Obsolete

Not Applicable

8

EAR99

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

CMOS

3V~3.6V

DUAL

225

1

3.3V

2.54mm

30

XC17256EL

8

3.3V

3.6V

3V

OTP

256Kb

15MHz

0.005mA

256KX1

3-STATE

1

256 kb

0.00005A

SERIAL

COMMON

CONFIGURATION MEMORY

4.5974mm

9.3599mm

7.62mm

No

Non-RoHS Compliant

Contains Lead

-

-

-

-

-

-

-

-

-
XC17256ELPD8I

Xilinx Inc.

Through Hole

8-DIP (0.300, 7.62mm)

NO

8

-40°C~85°C

Tube

2000

e0

Obsolete

Not Applicable

8

EAR99

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

CMOS

3V~3.6V

DUAL

225

1

3.3V

2.54mm

30

XC17256EL

8

3.3V

3.6V

3V

OTP

256Kb

15MHz

0.005mA

256KX1

3-STATE

1

256 kb

0.00005A

SERIAL

COMMON

CONFIGURATION MEMORY

4.5974mm

9.3599mm

7.62mm

No

Non-RoHS Compliant

Contains Lead

-

-

-

-

-

-

-

-

XC17256ELPD8C vs XC17256ELPD8I
XC17256ELPC20I

Xilinx Inc.

Surface Mount

20-LCC (J-Lead)

YES

20

-40°C~85°C

Tube

2000

e0

Obsolete

3 (168 Hours)

20

EAR99

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

CMOS

3V~3.6V

QUAD

225

1

3.3V

1.27mm

30

XC17256EL

20

-

3.6V

3V

OTP

256Kb

15MHz

0.005mA

256KX1

3-STATE

1

-

0.00005A

SERIAL

COMMON

CONFIGURATION MEMORY

4.572mm

8.9662mm

8.9662mm

-

Non-RoHS Compliant

Contains Lead

Tin/Lead (Sn85Pb15)

8542.32.00.61

J BEND

not_compliant

Not Qualified

3.3V

SYNCHRONOUS

262144 bit

XC17256ELPD8C vs XC17256ELPC20I
XC17128EPD8I

Xilinx Inc.

Through Hole

8-DIP (0.300, 7.62mm)

NO

8

-40°C~85°C

Tube

2000

e0

Obsolete

Not Applicable

8

EAR99

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

CMOS

4.5V~5.5V

DUAL

225

1

5V

2.54mm

30

XC17128E

8

-

5.5V

4.5V

OTP

128kb

15MHz

0.01mA

-

3-STATE

1

-

0.00005A

SERIAL

COMMON

CONFIGURATION MEMORY

4.5974mm

9.3599mm

7.62mm

-

Non-RoHS Compliant

Contains Lead

-

-

-

not_compliant

Not Qualified

5V

SYNCHRONOUS

131072 bit

XC17256ELPD8C vs XC17128EPD8I