Xilinx Inc. XA3S700A-4FGG484Q

XA3S700A-4FGG484Q Overview
In the FBGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 372 I/O ports for more coherent data transfer. To form a fundamental building block, there are 13248 logic elements/cells. In order to operate fpga chips, a voltage supply of 1.2V volts is required. FPGA parts like this belong to the Field Programmable Gate Arrays family. A total of 288 outputs are incorporated into this device. 484 terminations are present in total. It is crucial that the RAM si45kBe of this FPGA module reaches 45kB so that the program can run normally. In order to make it work, 484 pins have been designed. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. There is a 1.21.2/3.33.3V power supply that is required to operate it. As a result of the design of this module, the maximum operating temperature reaches 125°C. There should be a temperature difference between -40°C and the operating temperature. There are 700000 gates in its basic building block. With a total of 484 pins, it is equipped with a high level of security. A basic building block of this system consists of 1472 logic blocks (LABs). It usually uses a 667MHz crystal.

XA3S700A-4FGG484Q Features
372 I/Os
484 LABs/CLBs
125°C gates
1472 logic blocks (LABs)


XA3S700A-4FGG484Q Applications
There are a lot of Xilinx
XA3S700A-4FGG484Q FPGAs applications.


Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense