Xilinx Inc. XA3S700A-4FGG484I
- Part Number:
- XA3S700A-4FGG484I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 4542241-XA3S700A-4FGG484I
- Description:
- IC FPGA 372 I/O 484FBGA
- Datasheet:
- XA3S700A-4FGG484I
Xilinx Inc. XA3S700A-4FGG484I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XA3S700A-4FGG484I.
- MountSurface Mount
- Package / CaseFBGA
- Number of Pins484
- JESD-609 Codee1
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations484
- ECCN Code3A991.D
- Max Operating Temperature100°C
- Min Operating Temperature-40°C
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)250
- Supply Voltage1.2V
- Terminal Pitch1mm
- Time@Peak Reflow Temperature-Max (s)30
- Pin Count484
- Number of Outputs288
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.21.2/3.33.3V
- Temperature GradeINDUSTRIAL
- Number of I/O372
- RAM Size45kB
- Clock Frequency667MHz
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells13248
- Number of Gates700000
- Screening LevelAEC-Q100
- Number of Logic Blocks (LABs)1472
- Speed Grade4
- Length23mm
- Height Seated (Max)2.6mm
- Width23mm
- RoHS StatusRoHS Compliant
XA3S700A-4FGG484I Overview
This package is included in the FBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. 1.2V volts power it. The Field Programmable Gate Arrays family of FPGAs includes this part. With this device, you will be able to make use of 288 outputs. The total number of terminations is 484. During the configuration of this FPGA module, the RAM si45kBe reaches 45kB to ensure that the program runs normally. The device is designed with 484 pins in total. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. It is powered by a 1.21.2/3.33.3V battery, which can be purchased separately. In this module, 100°C is the maximum operating temperature at which fpga electronics can operate. Over -40°C, the operating temperature should be higher. Fpga semiconductor is made up of 700000 gates as fpga semiconductors basic building block. The device has a total of 484 pins on fpga semiconductor. In its basic building block, it is composed of 1472 logic blocks (LABs), which are called building blocks. A crystal oscillating at 667MHz is one of the most common components of this device.
XA3S700A-4FGG484I Features
372 I/Os
484 LABs/CLBs
100°C gates
1472 logic blocks (LABs)
XA3S700A-4FGG484I Applications
There are a lot of Xilinx
XA3S700A-4FGG484I FPGAs applications.
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
This package is included in the FBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. 1.2V volts power it. The Field Programmable Gate Arrays family of FPGAs includes this part. With this device, you will be able to make use of 288 outputs. The total number of terminations is 484. During the configuration of this FPGA module, the RAM si45kBe reaches 45kB to ensure that the program runs normally. The device is designed with 484 pins in total. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. It is powered by a 1.21.2/3.33.3V battery, which can be purchased separately. In this module, 100°C is the maximum operating temperature at which fpga electronics can operate. Over -40°C, the operating temperature should be higher. Fpga semiconductor is made up of 700000 gates as fpga semiconductors basic building block. The device has a total of 484 pins on fpga semiconductor. In its basic building block, it is composed of 1472 logic blocks (LABs), which are called building blocks. A crystal oscillating at 667MHz is one of the most common components of this device.
XA3S700A-4FGG484I Features
372 I/Os
484 LABs/CLBs
100°C gates
1472 logic blocks (LABs)
XA3S700A-4FGG484I Applications
There are a lot of Xilinx
XA3S700A-4FGG484I FPGAs applications.
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
XA3S700A-4FGG484I More Descriptions
FPGA XA Spartan-3A Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V 484-Pin FBGA
Field Programmable Gate Array, 4160 CLBs, 37440 Gates, 667MHz, 37440-Cell, CMOS, PBGA676
IC FPGA 372 I/O 484FBGA
FIXED IND 68UH 900MA 429 MOHM
Field Programmable Gate Array, 4160 CLBs, 37440 Gates, 667MHz, 37440-Cell, CMOS, PBGA676
IC FPGA 372 I/O 484FBGA
FIXED IND 68UH 900MA 429 MOHM
The three parts on the right have similar specifications to XA3S700A-4FGG484I.
-
ImagePart NumberManufacturerMountPackage / CaseNumber of PinsJESD-609 CodeMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeMax Operating TemperatureMin Operating TemperatureSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)Pin CountNumber of OutputsQualification StatusOperating Supply VoltageSupply Voltage-Max (Vsup)Power SuppliesTemperature GradeNumber of I/ORAM SizeClock FrequencyProgrammable Logic TypeNumber of Logic Elements/CellsNumber of GatesScreening LevelNumber of Logic Blocks (LABs)Speed GradeLengthHeight Seated (Max)WidthRoHS StatusMounting TypeOperating TemperaturePackagingPublishedSeriesPart StatusVoltage - SupplyBase Part NumberTotal RAM BitsNumber of LABs/CLBsRadiation HardeningPbfree CodeReflow Temperature-Max (s)View Compare
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XA3S700A-4FGG484ISurface MountFBGA484e13 (168 Hours)4843A991.D100°C-40°CField Programmable Gate ArraysCMOSBOTTOMBALL2501.2V1mm30484288Not Qualified1.2V1.26V1.21.2/3.33.3VINDUSTRIAL37245kB667MHzFIELD PROGRAMMABLE GATE ARRAY13248700000AEC-Q1001472423mm2.6mm23mmRoHS Compliant--------------
-
Surface MountFBGA484e13 (168 Hours)4843A991.D125°C-40°CField Programmable Gate ArraysCMOSBOTTOMBALL2501.2V1mm30484288Not Qualified1.2V1.26V1.21.2/3.33.3VAUTOMOTIVE37245kB667MHzFIELD PROGRAMMABLE GATE ARRAY13248700000AEC-Q1001472423mm2.6mm23mmRoHS Compliant-------------
-
Surface Mount484-FBGA, CSPBGA484e13 (168 Hours)484EAR99--Field Programmable Gate ArraysCMOSBOTTOMBALL--0.8mm-484249-1.2V-1.21.2/3.32.5/3.3V-309283.5kB667MHzFIELD PROGRAMMABLE GATE ARRAY537123400000--419mm1.8mm19mmRoHS CompliantSurface Mount-40°C~100°C TJTray2008Automotive, AEC-Q100, Spartan®-3A DSP XAObsolete1.14V~1.26VXA3SD3400A23224325968No--
-
Surface Mount256-LBGA256e13 (168 Hours)256EAR99--Field Programmable Gate Arrays-BOTTOMBALL2601.2V1mm-256391-1.2V-1.21.2/3.32.5V-17354kB125MHzFIELD PROGRAMMABLE GATE ARRAY172801000000--417mm1.55mm17mmRoHS CompliantSurface Mount-40°C~100°C TJTray2002Automotive, AEC-Q100, Spartan®-3 XAObsolete1.14V~1.26VXA3S10004423681920Noyes30
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