Xilinx Inc. XA3S1000-4FTG256I
- Part Number:
- XA3S1000-4FTG256I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3639431-XA3S1000-4FTG256I
- Description:
- IC FPGA 173 I/O 256FTBGA
- Datasheet:
- XA3S1000-4FTG256I
Xilinx Inc. XA3S1000-4FTG256I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XA3S1000-4FTG256I.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case256-LBGA
- Number of Pins256
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2002
- SeriesAutomotive, AEC-Q100, Spartan®-3 XA
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- ECCN CodeEAR99
- SubcategoryField Programmable Gate Arrays
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)30
- Base Part NumberXA3S1000
- Pin Count256
- Number of Outputs391
- Operating Supply Voltage1.2V
- Power Supplies1.21.2/3.32.5V
- Number of I/O173
- RAM Size54kB
- Clock Frequency125MHz
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells17280
- Total RAM Bits442368
- Number of Gates1000000
- Number of LABs/CLBs1920
- Speed Grade4
- Height Seated (Max)1.55mm
- Length17mm
- Width17mm
- Radiation HardeningNo
- RoHS StatusRoHS Compliant
XA3S1000-4FTG256I Overview
Xilinx Inc. is the brand of this part, which falls under the Embedded - FPGAs (Field Programmable Gate Array) category. Specifically, it is an Embedded - FPGAs (Field Programmable Gate Array) chip with a JESD-609 Code of e1. It has 256 terminations and operates at a voltage supply of 1.14V~1.26V. The peak reflow temperature is 260 degrees Celsius and the supply voltage is 1.2V. This chip has a pin count of 256 and an operating supply voltage of 1.2V. It also boasts 17280 logic elements/cells and 1920 LABs/CLBs, with a speed grade of 4.
XA3S1000-4FTG256I Features
173 I/Os
Up to 442368 RAM bits
256 LABs/CLBs
XA3S1000-4FTG256I Applications
There are a lot of Xilinx Inc. XA3S1000-4FTG256I FPGAs applications.
Medical Applications
Software-defined radios
Automotive Applications
Military DSP
Ecosystem
Security systems
Device controllers
Artificial intelligence (AI)
Medical imaging
Telecommunication
Xilinx Inc. is the brand of this part, which falls under the Embedded - FPGAs (Field Programmable Gate Array) category. Specifically, it is an Embedded - FPGAs (Field Programmable Gate Array) chip with a JESD-609 Code of e1. It has 256 terminations and operates at a voltage supply of 1.14V~1.26V. The peak reflow temperature is 260 degrees Celsius and the supply voltage is 1.2V. This chip has a pin count of 256 and an operating supply voltage of 1.2V. It also boasts 17280 logic elements/cells and 1920 LABs/CLBs, with a speed grade of 4.
XA3S1000-4FTG256I Features
173 I/Os
Up to 442368 RAM bits
256 LABs/CLBs
XA3S1000-4FTG256I Applications
There are a lot of Xilinx Inc. XA3S1000-4FTG256I FPGAs applications.
Medical Applications
Software-defined radios
Automotive Applications
Military DSP
Ecosystem
Security systems
Device controllers
Artificial intelligence (AI)
Medical imaging
Telecommunication
XA3S1000-4FTG256I More Descriptions
Field Programmable Gate Array, 240 CLBs, 100000 Gates, 572MHz, 2160-Cell, CMOS, PBGA484
IC FPGA 173 I/O 256FTBGA
IC FPGA 333 I/O 456FBGA
CAP TANT 10UF 25V 10% 2312
Contact for details
IC FPGA 173 I/O 256FTBGA
IC FPGA 333 I/O 456FBGA
CAP TANT 10UF 25V 10% 2312
Contact for details
The three parts on the right have similar specifications to XA3S1000-4FTG256I.
-
ImagePart NumberManufacturerMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeSubcategoryVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberPin CountNumber of OutputsOperating Supply VoltagePower SuppliesNumber of I/ORAM SizeClock FrequencyProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of GatesNumber of LABs/CLBsSpeed GradeHeight Seated (Max)LengthWidthRadiation HardeningRoHS StatusFactory Lead TimeTechnologyQualification StatusNumber of CLBsTerminal FinishMax Operating TemperatureMin Operating TemperatureTime@Peak Reflow Temperature-Max (s)Supply Voltage-Max (Vsup)Temperature GradeScreening LevelNumber of Logic Blocks (LABs)View Compare
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XA3S1000-4FTG256ISurface MountSurface Mount256-LBGA256-40°C~100°C TJTray2002Automotive, AEC-Q100, Spartan®-3 XAe1yesObsolete3 (168 Hours)256EAR99Field Programmable Gate Arrays1.14V~1.26VBOTTOMBALL2601.2V1mm30XA3S10002563911.2V1.21.2/3.32.5V17354kB125MHzFIELD PROGRAMMABLE GATE ARRAY172804423681000000192041.55mm17mm17mmNoRoHS Compliant-------------
-
Surface MountSurface Mount256-LBGA256-40°C~100°C TJTray1999Automotive, AEC-Q100, Spartan®-3A XAe1-Active3 (168 Hours)256EAR99Field Programmable Gate Arrays1.14V~1.26VBOTTOMBALL2601.2V1mm30XA3S200A2561601.2V1.21.2/3.33.3V19536kB667MHzFIELD PROGRAMMABLE GATE ARRAY403229491220000044841.55mm17mm17mm-ROHS3 Compliant10 WeeksCMOSNot Qualified448--------
-
Surface MountSurface Mount208-BFQFP208-40°C~125°C TJTray2007Automotive, AEC-Q100, Spartan®-3E XAe3-Obsolete3 (168 Hours)208EAR99Field Programmable Gate Arrays1.14V~1.26VQUADGULL WING2451.2V0.5mm30XA3S250E2081261.2V1.21.2/3.32.5V15827kB572MHzFIELD PROGRAMMABLE GATE ARRAY55082211842500006124-28mm28mm-RoHS Compliant-CMOSNot Qualified612Tin (Sn)-------
-
Surface Mount-FBGA484----e1--3 (168 Hours)4843A991.DField Programmable Gate Arrays-BOTTOMBALL2501.2V1mm--4842881.2V1.21.2/3.33.3V37245kB667MHzFIELD PROGRAMMABLE GATE ARRAY13248-700000-42.6mm23mm23mm-RoHS Compliant-CMOSNot Qualified--125°C-40°C301.26VAUTOMOTIVEAEC-Q1001472
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