Winbond Electronics W988D2FBJX7E
- Part Number:
- W988D2FBJX7E
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 3232051-W988D2FBJX7E
- Description:
- IC SDRAM 256MBIT 133MHZ 90BGA
- ECAD Model:
-
- Datasheet:
- W988D2FBJX7E
Winbond Electronics W988D2FBJX7E technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W988D2FBJX7E.
- Factory Lead Time10 Weeks
- Mounting TypeSurface Mount
- Package / Case90-TFBGA
- Surface MountYES
- Operating Temperature-25°C~85°C TC
- PackagingTray
- Published2016
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations90
- ECCN CodeEAR99
- Additional FeatureAUTO/SELF REFRESH
- HTS Code8542.32.00.24
- TechnologySDRAM - Mobile LPSDR
- Voltage - Supply1.7V~1.95V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.8mm
- Pin Count90
- JESD-30 CodeR-PBGA-B90
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.95V
- Power Supplies1.8V
- Supply Voltage-Min (Vsup)1.7V
- Memory Size256Mb 8M x 32
- Number of Ports1
- Memory TypeVolatile
- Operating ModeSYNCHRONOUS
- Clock Frequency133MHz
- Supply Current-Max0.07mA
- Access Time5.4ns
- Memory FormatDRAM
- Memory InterfaceParallel
- Organization8MX32
- Memory Width32
- Write Cycle Time - Word, Page15ns
- Standby Current-Max0.00001A
- Memory Density268435456 bit
- I/O TypeCOMMON
- Alternate Memory Width16
- Refresh Cycles4096
- Sequential Burst Length1248FP
- Interleaved Burst Length1248
- Height Seated (Max)1.025mm
- Length13mm
- Width8mm
- RoHS StatusROHS3 Compliant
W988D2FBJX7E Overview
The package/case for this product is a 90-TFBGA, which was published in 2016. It is currently an active part, meaning it is still being produced and available for purchase. The Moisture Sensitivity Level (MSL) for this product is 3, which indicates that it can withstand up to 168 hours of exposure to moisture without any damage. The ECCN Code for this product is EAR99, indicating that it is not subject to any export controls. It has a pin count of 90 and is a volatile memory type. The clock frequency for this product is 133MHz and the maximum supply current is 0.07mA. Lastly, the memory density for this product is 268435456 bits. All of these specifications make this product a high-performing and reliable option for memory storage.
W988D2FBJX7E Features
Package / Case: 90-TFBGA
Additional Feature:AUTO/SELF REFRESH
I/O Type: COMMON
W988D2FBJX7E Applications
There are a lot of Winbond Electronics
W988D2FBJX7E Memory applications.
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
The package/case for this product is a 90-TFBGA, which was published in 2016. It is currently an active part, meaning it is still being produced and available for purchase. The Moisture Sensitivity Level (MSL) for this product is 3, which indicates that it can withstand up to 168 hours of exposure to moisture without any damage. The ECCN Code for this product is EAR99, indicating that it is not subject to any export controls. It has a pin count of 90 and is a volatile memory type. The clock frequency for this product is 133MHz and the maximum supply current is 0.07mA. Lastly, the memory density for this product is 268435456 bits. All of these specifications make this product a high-performing and reliable option for memory storage.
W988D2FBJX7E Features
Package / Case: 90-TFBGA
Additional Feature:AUTO/SELF REFRESH
I/O Type: COMMON
W988D2FBJX7E Applications
There are a lot of Winbond Electronics
W988D2FBJX7E Memory applications.
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
W988D2FBJX7E More Descriptions
DRAM Chip Mobile LPSDR SDRAM 256Mbit 8Mx32 1.8V 90-Pin VFBGA
IC DRAM 256MBIT PARALLEL 90VFBGA
VFBGA-90(8x13) SDRAM ROHS
IC DRAM 256MBIT PARALLEL 90VFBGA
VFBGA-90(8x13) SDRAM ROHS
The three parts on the right have similar specifications to W988D2FBJX7E.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeAdditional FeatureHTS CodeTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchPin CountJESD-30 CodeQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Memory SizeNumber of PortsMemory TypeOperating ModeClock FrequencySupply Current-MaxAccess TimeMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageStandby Current-MaxMemory DensityI/O TypeAlternate Memory WidthRefresh CyclesSequential Burst LengthInterleaved Burst LengthHeight Seated (Max)LengthWidthRoHS StatusOutput CharacteristicsView Compare
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W988D2FBJX7E10 WeeksSurface Mount90-TFBGAYES-25°C~85°C TCTray2016Active3 (168 Hours)90EAR99AUTO/SELF REFRESH8542.32.00.24SDRAM - Mobile LPSDR1.7V~1.95VBOTTOM11.8V0.8mm90R-PBGA-B90Not Qualified1.95V1.8V1.7V256Mb 8M x 321VolatileSYNCHRONOUS133MHz0.07mA5.4nsDRAMParallel8MX323215ns0.00001A268435456 bitCOMMON1640961248FP12481.025mm13mm8mmROHS3 Compliant-- -
10 WeeksSurface Mount54-TFBGAYES-40°C~85°C TATray2016Active3 (168 Hours)54EAR99AUTO/SELF REFRESH8542.32.00.24SDRAM - Mobile LPSDR1.7V~1.95VBOTTOM11.8V0.8mm54R-PBGA-B54Not Qualified1.95V1.8V1.7V256Mb 16M x 161VolatileSYNCHRONOUS166MHz0.075mA5.4nsDRAMParallel8MX323215ns0.00001A268435456 bitCOMMON1681921248FP12481.025mm9mm8mmROHS3 Compliant3-STATE
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10 WeeksSurface Mount90-TFBGA--40°C~85°C TATape & Reel (TR)-Active3 (168 Hours)----SDRAM - Mobile LPSDR1.7V~1.95V----------256Mb 8M x 32-Volatile-166MHz-5.4nsDRAMParallel--15ns----------ROHS3 Compliant-
-
-Surface Mount54-TFBGA--25°C~85°C TCTape & Reel (TR)-Not For New Designs3 (168 Hours)----SDRAM - Mobile LPSDR1.7V~1.95V----------256Mb 16M x 16-Volatile-166MHz-5.4nsDRAMParallel--15ns----------ROHS3 Compliant-
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