Winbond Electronics W988D2FBJX6I
- Part Number:
- W988D2FBJX6I
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 3232136-W988D2FBJX6I
- Description:
- IC SDRAM 256MBIT 166MHZ 90BGA
- ECAD Model:
-
- Datasheet:
- W988D2FBJX6I
Winbond Electronics W988D2FBJX6I technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W988D2FBJX6I.
- Factory Lead Time10 Weeks
- Mounting TypeSurface Mount
- Package / Case90-TFBGA
- Surface MountYES
- Operating Temperature-40°C~85°C TA
- PackagingTray
- Published2016
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations90
- ECCN CodeEAR99
- Additional FeatureAUTO/SELF REFRESH
- HTS Code8542.32.00.24
- TechnologySDRAM - Mobile LPSDR
- Voltage - Supply1.7V~1.95V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.8mm
- Pin Count90
- JESD-30 CodeR-PBGA-B90
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.95V
- Power Supplies1.8V
- Supply Voltage-Min (Vsup)1.7V
- Memory Size256Mb 8M x 32
- Number of Ports1
- Memory TypeVolatile
- Operating ModeSYNCHRONOUS
- Clock Frequency166MHz
- Supply Current-Max0.075mA
- Access Time5.4ns
- Memory FormatDRAM
- Memory InterfaceParallel
- Organization8MX32
- Memory Width32
- Write Cycle Time - Word, Page15ns
- Standby Current-Max0.00001A
- Memory Density268435456 bit
- I/O TypeCOMMON
- Alternate Memory Width16
- Refresh Cycles4096
- Sequential Burst Length1248FP
- Interleaved Burst Length1248
- Height Seated (Max)1.025mm
- Length13mm
- Width8mm
- RoHS StatusROHS3 Compliant
W988D2FBJX6I Overview
Surface Mount technology has become increasingly popular in the electronics industry due to its compact size and efficient manufacturing process. One example of this is the packaging of electronic components in trays, which allows for easy handling and storage during production. This method is especially useful for active parts, meaning they are currently in production and readily available. Take for instance a component with a pin count of 90, clock frequency of 166MHz, and access time of 5.4ns. Although it may not be qualified yet, it boasts a high memory density of 268435456 bits and an interleaved burst length of 1248, making it a promising choice for future use. Furthermore, its standby current of only 0.00001A makes it an energy-efficient option for electronic devices.
W988D2FBJX6I Features
Package / Case: 90-TFBGA
Additional Feature:AUTO/SELF REFRESH
I/O Type: COMMON
W988D2FBJX6I Applications
There are a lot of Winbond Electronics
W988D2FBJX6I Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
Surface Mount technology has become increasingly popular in the electronics industry due to its compact size and efficient manufacturing process. One example of this is the packaging of electronic components in trays, which allows for easy handling and storage during production. This method is especially useful for active parts, meaning they are currently in production and readily available. Take for instance a component with a pin count of 90, clock frequency of 166MHz, and access time of 5.4ns. Although it may not be qualified yet, it boasts a high memory density of 268435456 bits and an interleaved burst length of 1248, making it a promising choice for future use. Furthermore, its standby current of only 0.00001A makes it an energy-efficient option for electronic devices.
W988D2FBJX6I Features
Package / Case: 90-TFBGA
Additional Feature:AUTO/SELF REFRESH
I/O Type: COMMON
W988D2FBJX6I Applications
There are a lot of Winbond Electronics
W988D2FBJX6I Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
W988D2FBJX6I More Descriptions
256Mb Low Power SDR SDRAM organized as 2M words x 4 banks x 32bits
Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90
IC DRAM 256MBIT PARALLEL 90VFBGA
Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90
IC DRAM 256MBIT PARALLEL 90VFBGA
The three parts on the right have similar specifications to W988D2FBJX6I.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeAdditional FeatureHTS CodeTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchPin CountJESD-30 CodeQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Memory SizeNumber of PortsMemory TypeOperating ModeClock FrequencySupply Current-MaxAccess TimeMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageStandby Current-MaxMemory DensityI/O TypeAlternate Memory WidthRefresh CyclesSequential Burst LengthInterleaved Burst LengthHeight Seated (Max)LengthWidthRoHS StatusSupplier Device PackageView Compare
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W988D2FBJX6I10 WeeksSurface Mount90-TFBGAYES-40°C~85°C TATray2016Active3 (168 Hours)90EAR99AUTO/SELF REFRESH8542.32.00.24SDRAM - Mobile LPSDR1.7V~1.95VBOTTOM11.8V0.8mm90R-PBGA-B90Not Qualified1.95V1.8V1.7V256Mb 8M x 321VolatileSYNCHRONOUS166MHz0.075mA5.4nsDRAMParallel8MX323215ns0.00001A268435456 bitCOMMON1640961248FP12481.025mm13mm8mmROHS3 Compliant-- -
10 WeeksSurface Mount90-TFBGA--40°C~85°C TATape & Reel (TR)-Active3 (168 Hours)----SDRAM - Mobile LPSDR1.7V~1.95V----------256Mb 8M x 32-Volatile-166MHz-5.4nsDRAMParallel--15ns----------ROHS3 Compliant-
-
10 WeeksSurface Mount54-TFBGA--25°C~85°C TCTape & Reel (TR)-Active3 (168 Hours)----SDRAM - Mobile LPSDR1.7V~1.95V----------256Mb 16M x 16-Volatile-133MHz-5.4nsDRAMParallel--15ns----------ROHS3 Compliant54-VFBGA (8x9)
-
-Surface Mount54-TFBGA--25°C~85°C TCTape & Reel (TR)-Not For New Designs3 (168 Hours)----SDRAM - Mobile LPSDR1.7V~1.95V----------256Mb 16M x 16-Volatile-166MHz-5.4nsDRAMParallel--15ns----------ROHS3 Compliant-
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