Winbond Electronics W987D6HBGX6E
- Part Number:
- W987D6HBGX6E
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 3232627-W987D6HBGX6E
- Description:
- IC SDRAM 128MBIT 166MHZ 54BGA
- ECAD Model:
-
- Datasheet:
- W987D6HB/2HB
Winbond Electronics W987D6HBGX6E technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W987D6HBGX6E.
- Mounting TypeSurface Mount
- Package / Case54-TFBGA
- Surface MountYES
- Operating Temperature-25°C~85°C TC
- PackagingTray
- Published2011
- Part StatusNot For New Designs
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations54
- Additional FeatureAUTO/SELF REFRESH
- TechnologySDRAM - Mobile LPSDR
- Voltage - Supply1.7V~1.95V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.8mm
- JESD-30 CodeR-PBGA-B54
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.95V
- Power Supplies1.8V
- Supply Voltage-Min (Vsup)1.7V
- Memory Size128Mb 8M x 16
- Number of Ports1
- Memory TypeVolatile
- Operating ModeSYNCHRONOUS
- Clock Frequency166MHz
- Supply Current-Max0.075mA
- Access Time5.4ns
- Memory FormatDRAM
- Memory InterfaceParallel
- Organization8MX16
- Output Characteristics3-STATE
- Memory Width16
- Write Cycle Time - Word, Page15ns
- Standby Current-Max0.00001A
- Memory Density134217728 bit
- I/O TypeCOMMON
- Refresh Cycles4096
- Sequential Burst Length1248FP
- Interleaved Burst Length1248
- Height Seated (Max)1.025mm
- Length9mm
- Width8mm
- RoHS StatusROHS3 Compliant
W987D6HBGX6E Overview
Volatile is the type of memory it has. Tray-cases are available. An embedded 54-TFBGA case surrounds memory ics. This chip has an 128Mb 8M x 16 size of memory on it, so a lot of data can be stored on it. This device uses takes advantage of the DRAM format. Due to its wide temperature range of -25°C~85°C TC, this device is well suited to a wide range of applications that require high performance. A voltage of 1.7V~1.95V can be supplied to memory ics. The recommended mounting type for this device is Surface Mount. On the chip, there are 54 terminations that are planted. It supports up to 1 functions for comprehensive operation. There is a requirement for 1.8V to be supplied to this ic memory chip in order to operate. It has a clock frequency of 166MHz. Despite all the merits of this chip, it also has AUTO/SELF REFRESH to boost system performance. A memory address is accessed through 1 ports on this chip. As for power supplies, this memory chip requires just 1.8V . I/O port addresses in this device are mapped to COMMON bits from the device's memory. In order to operate your device, you will need to provide a maximum supply current of 0.075mA.
W987D6HBGX6E Features
Package / Case: 54-TFBGA
Additional Feature:AUTO/SELF REFRESH
I/O Type: COMMON
W987D6HBGX6E Applications
There are a lot of Winbond Electronics W987D6HBGX6E Memory applications.
cell phones
Camcorders
servers
data buffer
Cache memory
networking
hard disk drive (HDD)
multimedia computers
mainframes
printers
Volatile is the type of memory it has. Tray-cases are available. An embedded 54-TFBGA case surrounds memory ics. This chip has an 128Mb 8M x 16 size of memory on it, so a lot of data can be stored on it. This device uses takes advantage of the DRAM format. Due to its wide temperature range of -25°C~85°C TC, this device is well suited to a wide range of applications that require high performance. A voltage of 1.7V~1.95V can be supplied to memory ics. The recommended mounting type for this device is Surface Mount. On the chip, there are 54 terminations that are planted. It supports up to 1 functions for comprehensive operation. There is a requirement for 1.8V to be supplied to this ic memory chip in order to operate. It has a clock frequency of 166MHz. Despite all the merits of this chip, it also has AUTO/SELF REFRESH to boost system performance. A memory address is accessed through 1 ports on this chip. As for power supplies, this memory chip requires just 1.8V . I/O port addresses in this device are mapped to COMMON bits from the device's memory. In order to operate your device, you will need to provide a maximum supply current of 0.075mA.
W987D6HBGX6E Features
Package / Case: 54-TFBGA
Additional Feature:AUTO/SELF REFRESH
I/O Type: COMMON
W987D6HBGX6E Applications
There are a lot of Winbond Electronics W987D6HBGX6E Memory applications.
cell phones
Camcorders
servers
data buffer
Cache memory
networking
hard disk drive (HDD)
multimedia computers
mainframes
printers
W987D6HBGX6E More Descriptions
R-PBGA-B54 Surface Mount Tray 8MX16 ic memory 166MHz 5.4ns 8mm 0.00001A
Power Supply;AC-DC;12V;4.2A;85-264V In;Enclosed;Heatsink;Telecom;50W;TUNS Series
DRAM Chip Mobile LPSDR SDRAM 128M-Bit 8Mx16 1.8V 54-Pin VFBGA
128Mb Mobile LPSDR | IC DRAM 128M PARALLEL 54VFBGA
128Mb lOW POWER SDRAM 54VFBGA 166MHZ
Product Description Demo for Development.
Power Supply;AC-DC;12V;4.2A;85-264V In;Enclosed;Heatsink;Telecom;50W;TUNS Series
DRAM Chip Mobile LPSDR SDRAM 128M-Bit 8Mx16 1.8V 54-Pin VFBGA
128Mb Mobile LPSDR | IC DRAM 128M PARALLEL 54VFBGA
128Mb lOW POWER SDRAM 54VFBGA 166MHZ
Product Description Demo for Development.
The three parts on the right have similar specifications to W987D6HBGX6E.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsAdditional FeatureTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchJESD-30 CodeQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Memory SizeNumber of PortsMemory TypeOperating ModeClock FrequencySupply Current-MaxAccess TimeMemory FormatMemory InterfaceOrganizationOutput CharacteristicsMemory WidthWrite Cycle Time - Word, PageStandby Current-MaxMemory DensityI/O TypeRefresh CyclesSequential Burst LengthInterleaved Burst LengthHeight Seated (Max)LengthWidthRoHS StatusMountNumber of PinsJESD-609 CodeTerminal FinishOperating Supply VoltageNominal Supply CurrentAddress Bus WidthDensityRadiation HardeningView Compare
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W987D6HBGX6ESurface Mount54-TFBGAYES-25°C~85°C TCTray2011Not For New Designs3 (168 Hours)54AUTO/SELF REFRESHSDRAM - Mobile LPSDR1.7V~1.95VBOTTOM11.8V0.8mmR-PBGA-B54Not Qualified1.95V1.8V1.7V128Mb 8M x 161VolatileSYNCHRONOUS166MHz0.075mA5.4nsDRAMParallel8MX163-STATE1615ns0.00001A134217728 bitCOMMON40961248FP12481.025mm9mm8mmROHS3 Compliant---------- -
Surface Mount90-TFBGA--25°C~85°C TCTape & Reel (TR)2011Not For New Designs3 (168 Hours)--SDRAM - Mobile LPSDR1.7V~1.95V---------128Mb 4M x 32-Volatile-133MHz-5.4nsDRAMParallel---15ns---------ROHS3 Compliant---------
-
Surface Mount90-TFBGAYES-40°C~85°C TATray2011Not For New Designs3 (168 Hours)90AUTO/SELF REFRESHSDRAM - Mobile LPSDR1.7V~1.95VBOTTOM11.8V0.8mmR-PBGA-B90Not Qualified1.95V1.8V1.7V128Mb 4M x 321VolatileSYNCHRONOUS166MHz0.075mA5.4nsDRAMParallel4MX323-STATE3215ns0.00001A134217728 bitCOMMON40961248FP12481.025mm13mm8mmROHS3 Compliant---------
-
Surface Mount54-TFBGA--25°C~85°C TCTray2011Not For New Designs3 (168 Hours)54AUTO/SELF REFRESHSDRAM - Mobile LPSDR1.7V~1.95VBOTTOM11.8V0.8mm--1.95V-1.7V128Mb 8M x 161Volatile-133MHz-5.4nsDRAMParallel8MX163-STATE1615ns0.00001A-COMMON40961248FP12481.025mm9mm-ROHS3 CompliantSurface Mount54e1Tin/Silver/Copper (Sn/Ag/Cu)1.8V70mA14b128 MbNo
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