Winbond Electronics W971GG8KB25I TR
- Part Number:
- W971GG8KB25I TR
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 3720620-W971GG8KB25I TR
- Description:
- IC SDRAM 1GBIT 400MHZ 60BGA
- Datasheet:
- W971GG8KB25I TR
Winbond Electronics W971GG8KB25I TR technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W971GG8KB25I TR.
- Mounting TypeSurface Mount
- Package / Case60-TFBGA
- Operating Temperature-40°C~95°C TC
- PackagingTape & Reel (TR)
- Published2016
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - DDR2
- Voltage - Supply1.7V~1.9V
- Memory Size1Gb 128M x 8
- Memory TypeVolatile
- Clock Frequency200MHz
- Access Time400ps
- Memory FormatDRAM
- Memory InterfaceParallel
- Write Cycle Time - Word, Page15ns
- RoHS StatusROHS3 Compliant
W971GG8KB25I TR Overview
The package or case for this particular product is a 60-TFBGA, which is a type of ball grid array packaging. It is designed to withstand a wide range of operating temperatures, from -40°C to 95°C TC. The packaging for this product is a Tape & Reel (TR), which is a common method of packaging electronic components for shipping and storage. This product was published in 2016, but it is now considered obsolete and is no longer being manufactured. The memory size for this product is 1Gb 128M x 8, meaning it has a capacity of 1 gigabyte and is organized as 128 million words of 8 bits each. It is a volatile memory type, meaning it requires power to retain data. The clock frequency for this product is 200MHz, and it has an access time of 400ps. Additionally, this product is compliant with ROHS3 standards, meaning it does not contain any hazardous materials.
W971GG8KB25I TR Features
Package / Case: 60-TFBGA
W971GG8KB25I TR Applications
There are a lot of Winbond Electronics
W971GG8KB25I TR Memory applications.
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
The package or case for this particular product is a 60-TFBGA, which is a type of ball grid array packaging. It is designed to withstand a wide range of operating temperatures, from -40°C to 95°C TC. The packaging for this product is a Tape & Reel (TR), which is a common method of packaging electronic components for shipping and storage. This product was published in 2016, but it is now considered obsolete and is no longer being manufactured. The memory size for this product is 1Gb 128M x 8, meaning it has a capacity of 1 gigabyte and is organized as 128 million words of 8 bits each. It is a volatile memory type, meaning it requires power to retain data. The clock frequency for this product is 200MHz, and it has an access time of 400ps. Additionally, this product is compliant with ROHS3 standards, meaning it does not contain any hazardous materials.
W971GG8KB25I TR Features
Package / Case: 60-TFBGA
W971GG8KB25I TR Applications
There are a lot of Winbond Electronics
W971GG8KB25I TR Memory applications.
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
W971GG8KB25I TR More Descriptions
IC DRAM 1GBIT PARALLEL 60WBGA
IC SDRAM 1GBIT 400MHZ 60BGA
IC SDRAM 1GBIT 400MHZ 60BGA
The three parts on the right have similar specifications to W971GG8KB25I TR.
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ImagePart NumberManufacturerMounting TypePackage / CaseOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyAccess TimeMemory FormatMemory InterfaceWrite Cycle Time - Word, PageRoHS StatusSurface MountNumber of TerminationsAdditional FeatureTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchJESD-30 CodeQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of PortsOperating ModeSupply Current-MaxOrganizationOutput CharacteristicsMemory WidthMemory DensityI/O TypeRefresh CyclesSequential Burst LengthInterleaved Burst LengthHeight Seated (Max)LengthWidthECCN CodeHTS CodePeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)Pin CountVoltage - Supply:Supplier Device Package:Speed:Series:Packaging:Package / Case:Operating Temperature:Memory Type:Memory Size:Memory Format:Interface:View Compare
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W971GG8KB25I TRSurface Mount60-TFBGA-40°C~95°C TCTape & Reel (TR)2016Obsolete3 (168 Hours)SDRAM - DDR21.7V~1.9V1Gb 128M x 8Volatile200MHz400psDRAMParallel15nsROHS3 Compliant-------------------------------------------
-
Surface Mount60-TFBGA-40°C~95°C TCTray2016Obsolete3 (168 Hours)SDRAM - DDR21.7V~1.9V1Gb 128M x 8Volatile200MHz400psDRAMParallel15nsROHS3 CompliantYES60AUTO/SELF REFRESHBOTTOM11.8V0.8mmR-PBGA-B60Not Qualified1.9V1.8V1.7V1SYNCHRONOUS0.185mA128MX83-STATE81073741824 bitCOMMON819248481.2mm12.5mm8mm----------------
-
Surface Mount60-TFBGA0°C~85°C TCTray2016Obsolete3 (168 Hours)SDRAM - DDR21.7V~1.9V1Gb 128M x 8Volatile200MHz400psDRAMParallel15nsROHS3 CompliantYES60AUTO/SELF REFRESHBOTTOM11.8V0.8mmR-PBGA-B60Not Qualified1.9V1.8V1.7V1SYNCHRONOUS0.185mA128MX83-STATE81073741824 bitCOMMON819248481.2mm12.5mm8mmEAR998542.32.00.32NOT SPECIFIEDNOT SPECIFIED60-----------
-
------------------------------------------------1.7 V ~ 1.9 V60-WBGA (8x12.5)200MHz-Tape & Reel (TR)60-TFBGA-40°C ~ 95°C (TC)Volatile1Gb (128M x 8)DRAMParallel
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