Winbond Electronics W971GG8KB-25

W971GG8KB-25 Overview
The Surface Mount technology, commonly known as SMT, has become the preferred method for assembling electronic components on printed circuit boards. This method offers a variety of benefits such as smaller size, higher component density, and improved reliability. However, as technology advances, some components may become obsolete over time. This is the case with the Part Status of the component in question, which is now classified as obsolete. The Terminal Position of this component is located at the bottom, making it suitable for applications where space is limited. The Peak Reflow Temperature for this component is not specified, but it is classified under the JESD-30 Code of R-PBGA-B60, indicating that it is a plastic ball grid array with a 60-ball count. The component operates in a synchronous mode, making it ideal for applications that require precise timing. Its Memory Interface is parallel, allowing for faster data transfer. With a Memory Density of 1073741824 bits, this component can store a large amount of data. It also has a Refresh Cycle of 8192, ensuring that the data remains accurate and reliable. The component has a width of 8mm, making it suitable for compact electronic devices.

W971GG8KB-25 Features
Package / Case: 60-TFBGA
Additional Feature:AUTO/SELF REFRESH
I/O Type: COMMON


W971GG8KB-25 Applications
There are a lot of Winbond Electronics
W971GG8KB-25 Memory applications.


eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer