Winbond Electronics W29N01GVSIAA

Name: W29N01GVSIAA
Brand: Winbond Electronics
SKU: 3228374-W29N01GVSIAA
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: W29N01GVSIAA

Manufacturer:: Winbond Electronics

Ventron No:: 3228374-W29N01GVSIAA

Description:: IC FLASH 1GBIT 25NS 48TSOP

ECAD Model:

Datasheet:: W29N01GVSIAA

Specifications

Winbond Electronics W29N01GVSIAA technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W29N01GVSIAA.

Factory Lead Time
14 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
48-TFSOP (0.724, 18.40mm Width)
Number of Pins
48
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2016
Part Status
Discontinued
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
48
Technology
FLASH - NAND (SLC)
Voltage - Supply
2.7V~3.6V
Terminal Position
DUAL
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
0.5mm
Reach Compliance Code
unknown
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
2.7V
Interface
Parallel, Serial
Memory Size
1Gb 128M x 8
Memory Type
Non-Volatile
Operating Mode
ASYNCHRONOUS
Memory Format
FLASH
Memory Interface
Parallel
Organization
128MX8
Memory Width
8
Write Cycle Time - Word, Page
25ns
Address Bus Width
28b
Density
1 Gb
Page Size
256B
Height Seated (Max)
1.2mm
Length
18.4mm
RoHS Status
ROHS3 Compliant

Description

W29N01GVSIAA Overview
Its memory type can be classified as Non-Volatile. It comes in a Tray. In the case of 48-TFSOP (0.724, 18.40mm Width), it is embedded within the case. There is an 1Gb 128M x 8 memory capacity on the chip. This device uses takes advantage of the FLASH format. -40°C~85°C TA is an extended operating temperature range, making this device ideal for demanding applications. The device is capable of handling a supply voltage of 2.7V~3.6V volts. It is recommended that the mounting type be Surface Mount. On the chip, there are 48 terminations. There are 1 functions supported by this part as part of the comprehensive working process. A voltage of 3.3V is required for the operation of this memory device. The memory device has an 48-pin package, which encloses it in a small package. This memory chip has an operating supply voltage of 3.3V. This chip uses Surface Mount mounting, a straightforward, high-efficiency method of mounting.

W29N01GVSIAA Features
Package / Case: 48-TFSOP (0.724, 18.40mm Width)
48 Pins
Operating Supply Voltage:3.3V

W29N01GVSIAA Applications
There are a lot of Winbond Electronics W29N01GVSIAA Memory applications.

eDRAM
embedded logic
Cache memory
cell phones
DVD disk buffer
graphics card
mainframes
nonvolatile BIOS memory
eSRAM
printers

W29N01GVSIAA More Descriptions

Surface Mount Tray 128MX8 FLASH - NAND (SLC) ic memory 25ns 18.4mm 1Gb 2.7V
NAND Flash Serial 3V 1G-bit 128M x 8 25ns 48-Pin TSOP
Product Description Demo for Development.
IC FLASH 1GBIT PARALLEL 48TSOP

Product Comparison

The three parts on the right have similar specifications to W29N01GVSIAA.

Image

Part Number

Manufacturer

Factory Lead Time

Mount

Mounting Type

Package / Case

Number of Pins

Operating Temperature

Packaging

Published

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Technology

Voltage - Supply

Terminal Position

Number of Functions

Supply Voltage

Terminal Pitch

Reach Compliance Code

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Interface

Memory Size

Memory Type

Operating Mode

Memory Format

Memory Interface

Organization

Memory Width

Write Cycle Time - Word, Page

Address Bus Width

Density

Page Size

Height Seated (Max)

Length

RoHS Status

Surface Mount

JESD-30 Code

Memory Density

Programming Voltage

Width

Pbfree Code

View Compare
W29N01GVSIAA

Winbond Electronics

14 Weeks

Surface Mount

Surface Mount

48-TFSOP (0.724, 18.40mm Width)

48

-40°C~85°C TA

Tray

2016

Discontinued

3 (168 Hours)

48

FLASH - NAND (SLC)

2.7V~3.6V

DUAL

1

3.3V

0.5mm

unknown

3.3V

3.6V

2.7V

Parallel, Serial

1Gb 128M x 8

Non-Volatile

ASYNCHRONOUS

FLASH

Parallel

128MX8

8

25ns

28b

1 Gb

256B

1.2mm

18.4mm

ROHS3 Compliant

-

-

-

-

-

-

-
W29N04GVSIAF

Winbond Electronics

10 Weeks

-

Surface Mount

48-TFSOP (0.488, 12.40mm Width)

-

-40°C~85°C TA

Tray

2016

Active

3 (168 Hours)

48

FLASH - NAND (SLC)

2.7V~3.6V

DUAL

1

3V

0.5mm

-

-

3.6V

2.7V

-

4Gb 512M x 8

Non-Volatile

ASYNCHRONOUS

FLASH

Parallel

512MX8

8

25ns

-

-

-

1.2mm

18.4mm

ROHS3 Compliant

YES

R-PDSO-G48

4294967296 bit

3.3V

12mm

-

W29N01GVSIAA vs W29N04GVSIAF
W29N01HVBINF

Winbond Electronics

10 Weeks

-

Surface Mount

63-VFBGA

63

-40°C~85°C TA

Tray

2016

Active

3 (168 Hours)

63

FLASH - NAND (SLC)

2.7V~3.6V

BOTTOM

1

3V

0.8mm

-

-

3.6V

2.7V

-

1Gb 128M x 8

Non-Volatile

ASYNCHRONOUS

FLASH

Parallel

128MX8

8

25ns

-

-

-

1mm

11mm

ROHS3 Compliant

YES

-

1073741824 bit

3.3V

9mm

yes

W29N01GVSIAA vs W29N01HVBINF
W29N01HVSINF

Winbond Electronics

10 Weeks

Surface Mount

Surface Mount

48-TFSOP (0.488, 12.40mm Width)

48

-40°C~85°C TA

Tray

2016

Active

3 (168 Hours)

48

FLASH - NAND (SLC)

2.7V~3.6V

DUAL

1

3V

0.5mm

-

3.3V

3.6V

2.7V

-

1Gb 128M x 8

Non-Volatile

ASYNCHRONOUS

FLASH

Parallel

128MX8

8

25ns

28b

1 Gb

2.1kB

1.2mm

18.4mm

ROHS3 Compliant

-

-

-

-

-

yes

W29N01GVSIAA vs W29N01HVSINF