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W25X32VSSIG

Winbond Electronics W25X32VSSIG

Part Number:
W25X32VSSIG
Manufacturer:
Winbond Electronics
Ventron No:
4547271-W25X32VSSIG
Description:
IC FLASH 32MBIT 75MHZ 8SOIC
ECAD Model:
Datasheet:
W25Xzz

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Specifications
Winbond Electronics W25X32VSSIG technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W25X32VSSIG.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.209, 5.30mm Width)
  • Number of Pins
    8
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tube
  • Published
    2007
  • Series
    SpiFlash®
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    8
  • ECCN Code
    3A991.B.1.A
  • Terminal Finish
    Matte Tin (Sn)
  • Additional Feature
    ORGANIZED AS 16K PAGES OF 256 BYTES
  • Technology
    CMOS
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    1.27mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • Pin Count
    8
  • Operating Supply Voltage
    3.3V
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Interface
    SPI, Serial
  • Memory Size
    32Mb 4M x 8
  • Nominal Supply Current
    18mA
  • Memory Type
    Non-Volatile
  • Clock Frequency
    75MHz
  • Access Time
    7 ns
  • Memory Format
    FLASH
  • Memory Interface
    SPI
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    3ms
  • Address Bus Width
    24b
  • Density
    32 Mb
  • Standby Current-Max
    0.00001A
  • Sync/Async
    Synchronous
  • Word Size
    8b
  • Programming Voltage
    2.7V
  • Serial Bus Type
    SPI
  • Endurance
    100000 Write/Erase Cycles
  • Data Retention Time-Min
    20
  • Write Protection
    HARDWARE/SOFTWARE
  • Alternate Memory Width
    1
  • Height Seated (Max)
    2.16mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
W25X32VSSIG Overview
The JESD-609 Code for the FLASH memory, published in 2007, is e3 and it is also Pbfree, with a Part Status of Obsolete. This memory operates at a supply voltage of 3.3V, with a maximum supply voltage (Vsup) of 3.6V. Its Memory Format is FLASH, with an Address Bus Width of 24b and a Density of 32 Mb. One of its notable features is the Write Protection option, which can be controlled either through hardware or software. This allows for added security and protection of the data stored in the memory. Despite being published over a decade ago, this FLASH memory still offers reliable and advanced features for various applications.

W25X32VSSIG Features
Package / Case: 8-SOIC (0.209, 5.30mm Width)
8 Pins
Operating Supply Voltage:3.3V
Additional Feature:ORGANIZED AS 16K PAGES OF 256 BYTES


W25X32VSSIG Applications
There are a lot of Winbond Electronics
W25X32VSSIG Memory applications.


networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
W25X32VSSIG More Descriptions
SOIC 8P;Serial flash 2.7V-3.6V , 75MHZ , Lead free
3A991.B.1.A Surface Mount Tube CMOS ic memory 75MHz 7ns 2.16mm 18mA
IC FLASH 32MBIT SPI 75MHZ 8SOIC
Product Description Demo for Development.
Product Comparison
The three parts on the right have similar specifications to W25X32VSSIG.
  • Image
    Part Number
    Manufacturer
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Nominal Supply Current
    Memory Type
    Clock Frequency
    Access Time
    Memory Format
    Memory Interface
    Memory Width
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Standby Current-Max
    Sync/Async
    Word Size
    Programming Voltage
    Serial Bus Type
    Endurance
    Data Retention Time-Min
    Write Protection
    Alternate Memory Width
    Height Seated (Max)
    Radiation Hardening
    RoHS Status
    Supplier Device Package
    Power Supplies
    Lead Free
    View Compare
  • W25X32VSSIG
    W25X32VSSIG
    Winbond Electronics
    Surface Mount
    Surface Mount
    8-SOIC (0.209, 5.30mm Width)
    8
    -40°C~85°C TA
    Tube
    2007
    SpiFlash®
    e3
    yes
    Obsolete
    3 (168 Hours)
    8
    3A991.B.1.A
    Matte Tin (Sn)
    ORGANIZED AS 16K PAGES OF 256 BYTES
    CMOS
    2.7V~3.6V
    DUAL
    260
    1
    3V
    1.27mm
    40
    8
    3.3V
    3.6V
    2.7V
    SPI, Serial
    32Mb 4M x 8
    18mA
    Non-Volatile
    75MHz
    7 ns
    FLASH
    SPI
    8
    3ms
    24b
    32 Mb
    0.00001A
    Synchronous
    8b
    2.7V
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    1
    2.16mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
  • W25X40VSNIG T&R
    W25X40VSNIG T&R
    Winbond Electronics
    -
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    2007
    SpiFlash®
    -
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    FLASH
    2.7V~3.6V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    4Mb 512K x 8
    -
    Non-Volatile
    75MHz
    -
    FLASH
    SPI
    -
    3ms
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    8-SOIC
    -
    -
    W25X32VSSIG vs W25X40VSNIG T&R
  • W25X40VSNIG
    W25X40VSNIG
    Winbond Electronics
    Surface Mount
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    8
    -40°C~85°C TA
    Tube
    2006
    SpiFlash®
    e3
    yes
    Obsolete
    3 (168 Hours)
    8
    EAR99
    Matte Tin (Sn)
    -
    CMOS
    2.7V~3.6V
    DUAL
    260
    1
    3V
    1.27mm
    40
    8
    -
    3.6V
    2.7V
    SPI, Serial
    4Mb 512K x 8
    20mA
    Non-Volatile
    75MHz
    7 ns
    FLASH
    SPI
    8
    3ms
    1b
    4 Mb
    0.00001A
    Synchronous
    8b
    2.7V
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    -
    1.72mm
    No
    ROHS3 Compliant
    -
    3/3.3V
    Lead Free
    W25X32VSSIG vs W25X40VSNIG
  • W25X10VZPIG T&R
    W25X10VZPIG T&R
    Winbond Electronics
    -
    Surface Mount
    8-WDFN Exposed Pad
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    2006
    SpiFlash®
    -
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    FLASH
    2.7V~3.6V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    1Mb 128K x 8
    -
    Non-Volatile
    75MHz
    -
    FLASH
    SPI
    -
    3ms
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    8-WSON (6x5)
    -
    -
    W25X32VSSIG vs W25X10VZPIG T&R
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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