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SSTU32865ET/G,551

NXP USA Inc. SSTU32865ET/G,551

Part Number:
SSTU32865ET/G,551
Manufacturer:
NXP USA Inc.
Ventron No:
3716192-SSTU32865ET/G,551
Description:
IC REG BUFFER 28BIT 160-TFBGA
ECAD Model:
Datasheet:
SSTU32865ET/G,551

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Specifications
NXP USA Inc. SSTU32865ET/G,551 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. SSTU32865ET/G,551.
  • Mounting Type
    Surface Mount
  • Package / Case
    160-TFBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~70°C
  • Packaging
    Tray
  • Published
    2004
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    160
  • HTS Code
    8542.39.00.01
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.7V~1.9V
  • Terminal Pitch
    0.65mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    74SSTU32865
  • Pin Count
    160
  • JESD-30 Code
    R-PBGA-B160
  • Qualification Status
    Not Qualified
  • Number of Bits
    28
  • Output Characteristics
    OPEN-DRAIN
  • Logic Type
    1:2 Registered Buffer with Parity
  • Output Polarity
    TRUE
  • Trigger Type
    POSITIVE EDGE
  • Propagation Delay (tpd)
    2.15 ns
  • fmax-Min
    270 MHz
  • Height Seated (Max)
    1.2mm
  • Length
    13mm
  • Width
    9mm
  • RoHS Status
    ROHS3 Compliant
Description
SSTU32865ET/G,551 Overview
The operating temperature range for this product is from 0°C to 70°C, making it suitable for a wide range of environments. It is packaged in a tray, providing convenient storage and transportation. The product was published in 2004, indicating that it has been in the market for a considerable amount of time. It has a Moisture Sensitivity Level (MSL) of 3, which means it can withstand up to 168 hours of exposure to moisture. The terminal form is BALL, ensuring secure and reliable connections. This product has one function and operates within a supply voltage range of 1.7V to 1.9V. The output characteristics are OPEN-DRAIN, allowing for easy integration with other systems. It is a 1:2 registered buffer with parity, providing efficient data processing. The width of the product is 9mm, making it compact and space-saving.

SSTU32865ET/G,551 Features

SSTU32865ET/G,551 Applications
There are a lot of NXP USA Inc. SSTU32865ET/G,551 Specialty Logic ICs applications.

Solenoids
Remote controls
Bar, KTV wireless entertainment
Indoor ad hoc meeting
Changeing the frequency from IF to RF
interconnection between switches
Lamps
Wireless showroom
Switching system
Cell phones
SSTU32865ET/G,551 More Descriptions
Sstu Series Positive Edge Triggered D Flip-flop True Output PBGA160
Board Connector, 6 Contact(s), 2 Row(s), Female, Straight, Solder Terminal, Socket
IC REG BUFFER 28BIT 160-TFBGA
Product Comparison
The three parts on the right have similar specifications to SSTU32865ET/G,551.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    HTS Code
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    JESD-30 Code
    Qualification Status
    Number of Bits
    Output Characteristics
    Logic Type
    Output Polarity
    Trigger Type
    Propagation Delay (tpd)
    fmax-Min
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Supplier Device Package
    JESD-609 Code
    Terminal Finish
    Subcategory
    Technology
    Power Supplies
    Mount
    Number of Pins
    Pbfree Code
    ECCN Code
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Number of Outputs
    Operating Supply Voltage
    Number of Elements
    Polarity
    Max Supply Voltage
    Min Supply Voltage
    Nominal Supply Current
    Propagation Delay
    Turn On Delay Time
    Logic Function
    Logic IC Type
    High Level Output Current
    Low Level Output Current
    Clock Edge Trigger Type
    Thickness
    Radiation Hardening
    Lead Free
    View Compare
  • SSTU32865ET/G,551
    SSTU32865ET/G,551
    NXP USA Inc.
    Surface Mount
    160-TFBGA
    YES
    0°C~70°C
    Tray
    2004
    Obsolete
    3 (168 Hours)
    160
    8542.39.00.01
    BOTTOM
    BALL
    260
    1
    1.7V~1.9V
    0.65mm
    30
    74SSTU32865
    160
    R-PBGA-B160
    Not Qualified
    28
    OPEN-DRAIN
    1:2 Registered Buffer with Parity
    TRUE
    POSITIVE EDGE
    2.15 ns
    270 MHz
    1.2mm
    13mm
    9mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • SSTU32865ET/G,518
    SSTU32865ET/G,518
    NXP USA Inc.
    Surface Mount
    160-TFBGA
    -
    0°C~70°C
    Tape & Reel (TR)
    -
    Obsolete
    2 (1 Year)
    -
    -
    -
    -
    -
    -
    1.7V~1.9V
    -
    -
    -
    -
    -
    -
    28
    -
    1:2 Registered Buffer with Parity
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    160-TFBGA (9x13)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    SSTU32865ET/G,551 vs SSTU32865ET/G,518
  • SSTUA32864EC/G,557
    SSTUA32864EC/G,557
    NXP USA Inc.
    Surface Mount
    96-LFBGA
    YES
    0°C~70°C
    Tray
    2007
    Obsolete
    3 (168 Hours)
    96
    8542.39.00.01
    BOTTOM
    BALL
    260
    1
    1.7V~2V
    0.8mm
    30
    74SSTUA32864
    96
    R-PBGA-B96
    Not Qualified
    25, 14
    -
    1:1, 1:2 Configurable Registered Buffer
    TRUE
    POSITIVE EDGE
    1.8 ns
    450 MHz
    1.5mm
    13.5mm
    5.5mm
    ROHS3 Compliant
    -
    e1
    TIN SILVER COPPER
    Other Logic ICs
    CMOS
    1.8V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    SSTU32865ET/G,551 vs SSTUA32864EC/G,557
  • SSTUB32866BHLF
    SSTUB32866BHLF
    IDT, Integrated Device Technology Inc
    -
    -
    -
    -
    -
    2007
    Discontinued
    3
    -
    -
    -
    -
    260
    -
    -
    -
    -
    -
    96
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    13.5mm
    5.5mm
    RoHS Compliant
    -
    e1
    Tin/Silver/Copper (Sn/Ag/Cu)
    -
    -
    -
    Surface Mount
    96
    yes
    EAR99
    70°C
    0°C
    410MHz
    25
    1.8V
    1
    Non-Inverting
    1.9V
    1.7V
    40mA
    1.9 ns
    3 ns
    Buffer
    D FLIP-FLOP
    -8mA
    8mA
    Positive Edge
    1.4mm
    No
    Lead Free
    SSTU32865ET/G,551 vs SSTUB32866BHLF
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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