NXP USA Inc. SSTUA32864EC/G,557

Name: SSTUA32864EC/G,557
Brand: NXP USA Inc.
SKU: 3716129-SSTUA32864EC/G,557
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: SSTUA32864EC/G,557

Manufacturer:: NXP USA Inc.

Ventron No:: 3716129-SSTUA32864EC/G,557

Description:: IC REG BUFFER 25BIT 96-LFBGA

ECAD Model:

Datasheet:: SSTUA32864EC/G,557

Specifications

NXP USA Inc. SSTUA32864EC/G,557 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. SSTUA32864EC/G,557.

Mounting Type
Surface Mount
Package / Case
96-LFBGA
Surface Mount
YES
Operating Temperature
0°C~70°C
Packaging
Tray
Published
2007
JESD-609 Code
e1
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
96
Terminal Finish
TIN SILVER COPPER
HTS Code
8542.39.00.01
Subcategory
Other Logic ICs
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
1.7V~2V
Terminal Pitch
0.8mm
Reflow Temperature-Max (s)
30
Base Part Number
74SSTUA32864
Pin Count
96
JESD-30 Code
R-PBGA-B96
Qualification Status
Not Qualified
Power Supplies
1.8V
Number of Bits
25, 14
Logic Type
1:1, 1:2 Configurable Registered Buffer
Output Polarity
TRUE
Trigger Type
POSITIVE EDGE
Propagation Delay (tpd)
1.8 ns
fmax-Min
450 MHz
Height Seated (Max)
1.5mm
Length
13.5mm
Width
5.5mm
RoHS Status
ROHS3 Compliant

Description

SSTUA32864EC/G,557 Overview
The 96-LFBGA package is suitable for use with CMOS technology and has a terminal pitch of 0.8mm. The product has been classified as obsolete, with a terminal finish of TIN SILVER COPPER and a terminal position of BOTTOM. The peak reflow temperature for this product is 260 degrees Celsius, with a maximum reflow time of 30 seconds. With a height seated at 1.5mm, this product has a total of 25 bits, with 14 of those being dedicated to its specific function. This product is designed for professional use and is ideal for applications that require high-speed data processing and reliable performance.

SSTUA32864EC/G,557 Features

SSTUA32864EC/G,557 Applications
There are a lot of NXP USA Inc. SSTUA32864EC/G,557 Specialty Logic ICs applications.

Satellite communications networks
Car radio
Remote controls
Desktop radio
Wireless transmission
1x/2x Fiber Channel
Military satellite communications
Single to Multimode Fiber Conversion
Wired telephone
Wireless teaching

SSTUA32864EC/G,557 More Descriptions

Registered Buffer Single 25-CH CMOS 96-Pin LFBGA Tray
IC REG BUFFER 25BIT 96-LFBGA

Product Comparison

The three parts on the right have similar specifications to SSTUA32864EC/G,557.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Terminal Finish

HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Base Part Number

Pin Count

JESD-30 Code

Qualification Status

Power Supplies

Number of Bits

Logic Type

Output Polarity

Trigger Type

Propagation Delay (tpd)

fmax-Min

Height Seated (Max)

Length

Width

RoHS Status

Mount

Number of Pins

Pbfree Code

ECCN Code

Max Operating Temperature

Min Operating Temperature

Frequency

Number of Outputs

Number of Elements

Polarity

Temperature Grade

Max Supply Voltage

Min Supply Voltage

Propagation Delay

Logic Function

Output Characteristics

Logic IC Type

High Level Output Current

Low Level Output Current

Clock Edge Trigger Type

Thickness

Lead Free

View Compare
SSTUA32864EC/G,557

NXP USA Inc.

Surface Mount

96-LFBGA

YES

0°C~70°C

Tray

2007

e1

Obsolete

3 (168 Hours)

96

TIN SILVER COPPER

8542.39.00.01

Other Logic ICs

CMOS

BOTTOM

BALL

260

1

1.7V~2V

0.8mm

30

74SSTUA32864

96

R-PBGA-B96

Not Qualified

1.8V

25, 14

1:1, 1:2 Configurable Registered Buffer

TRUE

POSITIVE EDGE

1.8 ns

450 MHz

1.5mm

13.5mm

5.5mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
SSTUAF32869AHLFT

IDT, Integrated Device Technology Inc

-

TFBGA

-

-

Tape & Reel (TR)

2006

e1

Discontinued

3

150

Tin/Silver/Copper (Sn/Ag/Cu)

-

Other Logic ICs

-

BOTTOM

BALL

260

1

1.8V

0.65mm

NOT SPECIFIED

-

150

-

Not Qualified

-

14

-

-

-

-

-

-

13mm

8mm

RoHS Compliant

Surface Mount

150

yes

EAR99

70°C

0°C

340MHz

28

1

Non-Inverting

COMMERCIAL

1.9V

1.7V

3 ns

Buffer

OPEN-DRAIN

D FLIP-FLOP

-12mA

12mA

Positive Edge

1.2mm

Lead Free

SSTUA32864EC/G,557 vs SSTUAF32869AHLFT
SSTU32865ET/G,551

NXP USA Inc.

Surface Mount

160-TFBGA

YES

0°C~70°C

Tray

2004

-

Obsolete

3 (168 Hours)

160

-

8542.39.00.01

-

-

BOTTOM

BALL

260

1

1.7V~1.9V

0.65mm

30

74SSTU32865

160

R-PBGA-B160

Not Qualified

-

28

1:2 Registered Buffer with Parity

TRUE

POSITIVE EDGE

2.15 ns

270 MHz

1.2mm

13mm

9mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

OPEN-DRAIN

-

-

-

-

-

-

SSTUA32864EC/G,557 vs SSTU32865ET/G,551
SSTUA32864EC/G,518

NXP USA Inc.

Surface Mount

96-LFBGA

YES

0°C~70°C

Tape & Reel (TR)

2007

-

Obsolete

2 (1 Year)

96

-

8542.39.00.01

-

-

BOTTOM

BALL

260

1

1.7V~2V

0.8mm

40

74SSTUA32864

96

R-PBGA-B96

Not Qualified

-

25, 14

1:1, 1:2 Configurable Registered Buffer

TRUE

POSITIVE EDGE

1.8 ns

450 MHz

1.5mm

13.5mm

5.5mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

SSTUA32864EC/G,557 vs SSTUA32864EC/G,518