SN74LVC2G34DCK3
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Texas Instruments SN74LVC2G34DCK3

Part Number:
SN74LVC2G34DCK3
Manufacturer:
Texas Instruments
Ventron No:
6407577-SN74LVC2G34DCK3
Description:
2-ch, 1.65-V to 5.5-V buffers
ECAD Model:
Datasheet:
sn74lvc2g34
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Delivery:
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Specifications
Texas Instruments SN74LVC2G34DCK3 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments SN74LVC2G34DCK3.
  • Technology family
    LVC
  • Supply voltage (min) (V)
    1.65
  • Supply voltage (max) (V)
    5.5
  • Number of channels

    Number of Channels refers to the number of independent signal paths within an electronic component. It indicates how many separate signals can be processed or transmitted simultaneously. For example, an audio amplifier with two channels can amplify two separate audio signals, while a multi-channel data converter can convert multiple analog signals into digital data. The number of channels is a crucial parameter for determining the component's functionality and application.

    2
  • IOL (max) (mA)
    32
  • Supply current (max) (μA)
    10
  • IOH (max) (mA)
    -32
  • Input type

    Input Type refers to the type of signal that an electronic component can accept as input.

    Standard CMOS
  • Output type

    Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.

    Push-Pull
  • Features
    Balanced outputs
  • Rating
    Catalog
  • Operating temperature range (°C)
    -40 to 125
Description

The SN74LVC2G34 device is a dual buffer gate designed for 1.65-V to 5.5-V VCC operation. The SN74LVC2G34 device performs the Boolean function Y = A in positive logic.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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