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PC28F256P33BFE

Micron Technology Inc. PC28F256P33BFE

Part Number:
PC28F256P33BFE
Manufacturer:
Micron Technology Inc.
Ventron No:
3720714-PC28F256P33BFE
Description:
IC FLASH 256MBIT 95NS 64EASYBGA
ECAD Model:
Datasheet:
PC28F256P33BFE

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Specifications
Micron Technology Inc. PC28F256P33BFE technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. PC28F256P33BFE.
  • Contact Plating
    Copper, Silver, Tin
  • Mounting Type
    Surface Mount
  • Package / Case
    64-TBGA
  • Surface Mount
    YES
  • Number of Pins
    64
  • Operating Temperature
    -40°C~85°C TC
  • Packaging
    Tray
  • Published
    2011
  • Series
    Axcell™
  • JESD-609 Code
    e1
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    64
  • Terminal Finish
    TIN SILVER COPPER
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.3V~3.6V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    28F256P33
  • Power Supplies
    2.5/3.3V
  • Voltage
    2.3V
  • Interface
    Parallel, Serial
  • Memory Size
    256Mb 16M x 16
  • Nominal Supply Current
    31mA
  • Memory Type
    Non-Volatile
  • Clock Frequency
    52MHz
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    16MX16
  • Memory Width
    16
  • Write Cycle Time - Word, Page
    95ns
  • Address Bus Width
    24b
  • Density
    256 Mb
  • Standby Current-Max
    0.00021A
  • Access Time (Max)
    95 ns
  • Sync/Async
    Asynchronous
  • Word Size
    16b
  • Data Polling
    NO
  • Toggle Bit
    NO
  • Number of Sectors/Size
    4255
  • Boot Block
    BOTTOM
  • Height Seated (Max)
    1.2mm
  • Length
    13mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
PC28F256P33BFE Overview
The JESD-609 Code e1 is an industry standard that specifies the requirements for moisture sensitivity levels (MSL) in electronic components. With an MSL of 3, these components can withstand 168 hours of exposure to moisture without any adverse effects. The number of terminations on these components is 64, each finished with a durable TIN SILVER COPPER coating. These components can withstand a peak reflow temperature of 260 degrees Celsius, making them suitable for a wide range of applications. The address bus width is 24b, and the components can operate in both synchronous and asynchronous modes. The toggle bit feature is not available on these components, and they are not radiation hardened. However, they are compliant with the latest RoHS regulations (ROHS3), making them environmentally friendly.

PC28F256P33BFE Features
Package / Case: 64-TBGA
64 Pins


PC28F256P33BFE Applications
There are a lot of Micron Technology Inc.
PC28F256P33BFE Memory applications.


networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
PC28F256P33BFE More Descriptions
NOR Flash Parallel/Serial 2.5V/3.3V 256Mbit 16M x 16bit 95ns 64-Pin EZBGA Tray
NOR Flash, Legacy NOR Flash, 256Mb, 2.3V-3.6V, 64-ball Easy BGA, RoHSMicron SCT
IC FLASH 256M PARALLEL 64EASYBGA Axcell
e1 Surface Mount 28F256P33 Tray ic memory 52MHz 95ns 13mm 31mA
IC FLASH 256MBIT 95NS 64EASYBGA
QKJP .Parallel NOR, 256Mb, P33
Product Comparison
The three parts on the right have similar specifications to PC28F256P33BFE.
  • Image
    Part Number
    Manufacturer
    Contact Plating
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    Power Supplies
    Voltage
    Interface
    Memory Size
    Nominal Supply Current
    Memory Type
    Clock Frequency
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Standby Current-Max
    Access Time (Max)
    Sync/Async
    Word Size
    Data Polling
    Toggle Bit
    Number of Sectors/Size
    Boot Block
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Pbfree Code
    Pin Count
    ECCN Code
    HTS Code
    Reach Compliance Code
    Qualification Status
    Operating Mode
    Supply Current-Max
    Alternate Memory Width
    Command User Interface
    Page Size
    Ready/Busy
    Common Flash Interface
    Width
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Access Time
    View Compare
  • PC28F256P33BFE
    PC28F256P33BFE
    Micron Technology Inc.
    Copper, Silver, Tin
    Surface Mount
    64-TBGA
    YES
    64
    -40°C~85°C TC
    Tray
    2011
    Axcell™
    e1
    Obsolete
    3 (168 Hours)
    64
    TIN SILVER COPPER
    FLASH - NOR
    2.3V~3.6V
    BOTTOM
    260
    1
    3V
    1mm
    30
    28F256P33
    2.5/3.3V
    2.3V
    Parallel, Serial
    256Mb 16M x 16
    31mA
    Non-Volatile
    52MHz
    FLASH
    Parallel
    16MX16
    16
    95ns
    24b
    256 Mb
    0.00021A
    95 ns
    Asynchronous
    16b
    NO
    NO
    4255
    BOTTOM
    1.2mm
    13mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • PC28F00AP33BFA
    PC28F00AP33BFA
    Micron Technology Inc.
    -
    Surface Mount
    64-TBGA
    YES
    64
    -40°C~85°C TA
    Tray
    2013
    Axcell™
    e1
    Obsolete
    3 (168 Hours)
    64
    TIN SILVER COPPER
    FLASH - NOR
    2.3V~3.6V
    BOTTOM
    260
    1
    3V
    1mm
    30
    28F00AP33
    -
    2.3V
    Parallel, Serial
    1Gb 64M x 16
    31mA
    Non-Volatile
    52MHz
    FLASH
    Parallel
    -
    16
    95ns
    26b
    1 Gb
    -
    95 ns
    Asynchronous
    16b
    -
    -
    -
    -
    1.2mm
    10mm
    No
    ROHS3 Compliant
    yes
    64
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    PC28F256P33BFE vs PC28F00AP33BFA
  • PC28F064M29EWBX
    PC28F064M29EWBX
    Micron Technology Inc.
    -
    Surface Mount
    64-LBGA
    YES
    64
    -40°C~85°C TA
    Tray
    2013
    -
    e1
    Obsolete
    3 (168 Hours)
    64
    TIN SILVER COPPER
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    260
    1
    3V
    1mm
    30
    PC28F064M29
    3/3.3V
    2.7V
    -
    64Mb 8M x 8 4M x 16
    -
    Non-Volatile
    -
    FLASH
    Parallel
    4MX16
    16
    60ns
    -
    -
    0.00012A
    65 ns
    -
    -
    YES
    YES
    8127
    BOTTOM
    1.4mm
    13mm
    -
    ROHS3 Compliant
    yes
    -
    3A991.B.1.A
    8542.32.00.51
    unknown
    Not Qualified
    ASYNCHRONOUS
    0.025mA
    8
    YES
    8/16words
    YES
    YES
    11mm
    -
    -
    -
    -
    PC28F256P33BFE vs PC28F064M29EWBX
  • PC28F128J3F75G
    PC28F128J3F75G
    Micron Technology Inc.
    -
    Surface Mount
    64-TBGA
    -
    64
    -40°C~85°C TA
    Tray
    2011
    StrataFlash™
    -
    Obsolete
    3 (168 Hours)
    -
    -
    FLASH - NOR
    2.7V~3.6V
    -
    -
    -
    -
    -
    -
    PC28F128J3F75
    -
    -
    Parallel
    128Mb 16M x 8 8M x 16
    -
    Non-Volatile
    -
    FLASH
    Parallel
    -
    -
    75ns
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    64-EasyBGA (10x13)
    85°C
    -40°C
    75ns
    PC28F256P33BFE vs PC28F128J3F75G
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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